Chip-packaging module for a chip and a method for forming a chip-packaging module

Patent metadata

Field	Value
Publication number	US-9324586-B2
Application number	US-201113211408-A
Country	US
Kind code	B2
Filing date	Aug 17, 2011
Priority date	Aug 17, 2011
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

A chip-packaging module for a chip is provided, the chip-packaging module including a chip including a first chip side, wherein the first chip side includes an input portion configured to receive a signal; a chip carrier configured to be in electrical connection with the first chip side, wherein the chip is mounted to the chip carrier via the first chip side; and a mold material configured to cover the chip on at least the first chip side, wherein at least part of the input portion is released from the mold material.

First claim

What is claimed is:

1. A chip-packaging module for a chip, the chip-packaging module comprising:
a chip comprising a first chip side, wherein the first chip side comprises an input portion configured to receive a signal;
a chip carrier configured to be in electrical connection with the first chip side, and wherein the chip is mounted to the chip carrier with the first chip side facing the carrier; a mold material configured to cover the chip on at least the first chip side,
wherein at least part of the input portion is free from the mold material;
wherein the chip carrier comprises one or more openings for the electrical connection with the first chip side; and
a buffer layer formed on a surface of the first chip side between the chip and the chip carrier, with a bottom surface of the buffer layer facing the surface of the first chip side,
wherein a portion of the buffer layer extends into the input portion of said chip, and
wherein the buffer layer has a top surface opposite to the bottom surface and substantially parallel to the surface of the first chip side and at least a portion of the mold material is formed directly on at least a portion of said top surface of the buffer layer.

2. The chip-packaging module according to claim 1 , wherein one or more connection pads are formed on the first chip side.

3. The chip-packaging module according to claim 2 , wherein the chip carrier is configured to be in electrical connection with at least one of the one or more connection pads formed on the first chip side.

4. The chip-packaging module according to claim 1 , wherein the chip comprises at least one from the following group of sensors, the group consisting of: electrical sensors, mechanical sensors, electromechanical sensors, microelectromechanical sensors, pressure sensors, gas sensors, chemical sensors, biological sensors, pumps and actuators.

5. The chip-packaging module according to claim 1 , wherein the input portion comprises a membrane.

6. The chip-packaging module according to claim 1 , wherein the input portion is configured to receive at least one from the following group of signals, the group consisting of: motion signals, mechanical signals, electrical signals, chemical signals, pressure signals and gaseous signals.

7. The chip-packaging module according to claim 1 , wherein the chip comprises a lab-on-chip.

8. The chip-packaging module of claim 1 , wherein the chip carrier comprises a chip carrier side adhered to part of the first chip side.

9. The chip-packaging module of claim 1 , wherein the chip carrier comprises a further chip carrier side configured to be in electrical connection with the first chip side.

10. The chip-packaging module of claim 1 , wherein the chip carrier further comprises at least one wire configured to provide the electrical connection between the first chip side and the chip carrier.

11. The chip-packaging module of claim 1 , further comprising a buffer layer formed on the first chip side, wherein the buffer layer lies between the chip and the chip carrier.

12. The chip-packaging module of claim 11 , wherein the buffer layer is configured to adhere at least part of the chip carrier to at least part of the first chip side.

13. The chip-packaging module according to claim 11 , wherein the buffer layer may comprise at least one from the following group of materials, the group consisting of: adhesive glue, epoxy, solder, double-sided tape, elastic polymer, resist, polyimide, bistage material, and thermal adhesive.

14. The chip-packaging module according to claim 11 , wherein the buffer layer may be configured to isolate the input portion from connection pads formed on the first chip side.

15. The chip-packaging module according to claim 1 , wherein the mold material comprises a material selected from a group consisting of: filled or unfilled epoxy, pre-impregnated composite fibers, laminate, thermoset and thermoplastic material.

16. The chip-packaging module of claim 1 , wherein the mold material is further configured to cover at least part of the chip carrier.

17. The chip-packaging module of claim 1 , wherein the mold material is further configured to cover the chip on at least part of a second chip side, wherein the second chip side faces a direction opposite to the first chip side.

18. The chip-packaging module of claim 11 , wherein the mold material is formed over at least part of the buffer layer.

19. The chip-packaging module according to claim 1 , wherein the chip carrier comprises at least one of a leadframe and a laminate.

20. A method for forming a chip-packaging module comprising:
forming a chip carrier in electrical connection with a first chip side, the first chip side comprising an input portion for receiving a signal, and mounting the chip to the chip carrier with the first chip side facing the carrier;
covering the chip with a mold material on at least the first chip side, wherein at least part of the input portion is free from the mold material;
wherein one or more openings are formed in the chip carrier for the electrical connection with the first chip side; and
forming a buffer layer on a surface of the first chip side between the chip and the chip carrier, with a bottom surface of the buffer layer facing the surface of the first chip side,
wherein a portion of the buffer layer extends into the input portion of said chip, and
wherein the buffer layer has a top surface opposite to the bottom surface and substantially parallel to the surface of the surface of the first chip side and at least a portion of the mold material is formed directly on at least a portion of said top surface of the buffer layer.

21. The chip-packaging module according to claim 10 , wherein the at least one wire extends through one of the one or more openings in the chip carrier.

22. The chip-packaging module according to claim 21 , wherein the at least one wire makes contact to one of one or more contact pads formed on the first chip side.

23. The chip-packaging module according to claim 22 , wherein the one or more contact pads are aligned with respective ones of the one or more openings.

Assignees

• Theuss Horst
• Infineon Technologies Ag

Inventors

• Theuss Horst

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title