Pressure sensor chip

Patent metadata

Field	Value
Publication number	US-9274016-B2
Application number	US-201314085253-A
Country	US
Kind code	B2
Filing date	Nov 20, 2013
Priority date	Nov 20, 2012
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

A pressure sensor chip includes a sensor diaphragm, and first and second retaining members. The first and second retaining members face and are bonded to peripheral edge portions of a first face and another face of the sensor diaphragm, and have pressure guiding holes that guide measurement pressures to the sensor diaphragm. The first retaining member has, in an interior thereof, a non-bonded region that is continuous with a peripheral portion of the pressure guiding hole. The non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

First claim

The invention claimed is:

1. A pressure sensor chip comprising:
a sensor diaphragm that outputs a signal in accordance with a difference in pressures applied to a first face and to another face; and
first and second retaining members, which face and are bonded to the peripheral edge portions of the first face and the other face of the sensor diaphragm, wherein:
the first retaining member has a first pressure guiding hole that guides a first measurement pressure to the first face of the sensor diaphragm,
the second retaining member has a second pressure guiding hole that guides a second measurement pressure to the other face of the sensor diaphragm,
the first retaining member has, in an interior thereof, a first non-bonded region that is continuous with a peripheral portion of the first pressure guiding hole;
the first non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm; and
the second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

2. The pressure sensor chip as set forth in claim 1 , wherein:
in the interior of the first retaining member, a ring-shaped groove is formed protruding in the direction of the wall thickness of the first retaining member, continuous with the non-bonded region.

3. The pressure sensor chip as set forth in claim 1 , wherein:
the first retaining member is divided in two at the plane that is parallel to the pressure bearing surface of the sensor diaphragm, at which the non-bonded region is provided, where one retaining member and the other retaining member that are divided in two are bonded together, except for at the non-bonded region of the plane wherein the non-bonded region is provided.

4. The pressure sensor chip as set forth in claim 2 , wherein:
in the ring-shaped groove that is continuous with the non-bonded region on the interior of the first retaining member, the cross-sectional shape of the intersection with the non-bonded region in the interior of the first retaining member includes a circular arc part.

5. The pressure sensor chip as set forth in claim 1 , wherein:
the sensor diaphragm uses the one face as a pressure bearing face for a high-pressure-side measurement pressure, and uses the other face as the pressure bearing face for a low-pressure-side measurement pressure.

6. The pressure sensor chip as set forth in claim 1 , wherein:
the first retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm;
the second retaining member has, in the interior thereof, a second non-bonded region that is continuous with the peripheral portion of the second pressure guiding hole; and
the second non-bonded region in the interior of the second retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm.

Assignees

• Azbil Corp

Inventors

• Tokuda Tomohisa
• Seto Yuuki

Classifications

• G01L13/025 Primary

  using diaphragms · CPC title

• G01L9/0051

  using variations in ohmic resistance · CPC title

• G01L13/00

  Devices or apparatus for measuring differences of two or more fluid pressure values · CPC title

• G01L9/00

  Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements {(G01L11/004 takes precedence)}; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means (measuring differences of two or more pressure values G01L13/00; measuring two or more pressure values simultaneously G01L15/00) · CPC title

• G01L19/06 Primary

  Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa · CPC title