High performance, ultra low loss, ultra lightweight, multi-layered rigid circuit boards

Patent metadata

Field	Value
Publication number	US-10129976-B2
Application number	US-201514692559-A
Country	US
Kind code	B2
Filing date	Apr 21, 2015
Priority date	Apr 21, 2015
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.

First claim

What is claimed is:

1. A method for fabricating an electronic component made of only Dyneema® and Indalloy, said method comprising:
providing a spool of a Dyneema® filament and a spool of an Indalloy wire on a Fused Deposition Modeling (FDM) machine;
feeding the Dyneema® filament to a first head of the FDM machine;
feeding the Indalloy wire to a second head of the FDM machine; and
coextruding the Dyneema® filament and the Indalloy wire to fabricate the electronic component using the FDM machine wherein said Dyneema filament and Indalloy wire are utilized in the fabricated electronic component without any further additives.

2. The method according to claim 1 further comprising setting a head temperature for the first head in the range of 270°−290° F.

3. The method according to claim 1 further comprising setting a head temperature for the second head at approximately 430° F.

4. The method according to claim 1 further comprising setting a temperature for a base of the FDM machine in the range of 270°−290° F.

5. The method according to claim 1 wherein feeding the Dyneema® filament to a first head and feeding the Indalloy wire to a second head includes feeding the filament and the wire at a constant feed rate so that a consistent pressure is provided when fabricating the electronic component.

6. The method according to claim 1 further comprising programming a computing device for an electronic component assembly CAD file/model and slicing the CAD file/model using a slicer software program to create a 3D model file such that layers of the electronic component are defined for fabrication.

7. The method according to claim 6 wherein programming the computing device includes optimizing a numerical control programming code/language that is produced from the 3D model file.

8. The method according to claim 1 wherein coextruding the Dyneema® filament and the Indalloy wire includes using a head movement speed that is in the range of 20-80 mm/s.

9. A method for fabricating an electronic component, said method comprising:
providing a first spool of an Ultra High Molecular Weight Polyethylene (UHMWPE) filament and a second spool of a circuit material on a three-dimensional printer;
feeding the UHMWPE filament from the first spool to a first head of the three-dimensional printer;
feeding the circuit material from the second spool to a second head of the three-dimensional printer;
providing a computing device that is programmed to provide predetermined operating parameters for the three-dimensional printer; and
coextruding the UHMWPE and the circuit material to fabricate an electronic component using the three-dimensional wherein said Ultra High Molecular Weight Polyethylene (UHMWPE) filament and circuit material are utilized in the fabricated electronic component without any further additives printer.

10. The method according to claim 9 wherein providing predetermined operating parameters of the three-dimensional printer includes providing a head temperature for the first head that is in the range of 270°−290° F.

11. The method according to claim 9 wherein providing predetermined operating parameters of the three-dimensional printer includes providing a head temperature for the second head that is approximately 430° F.

12. The method according to claim 9 wherein providing predetermined operating parameters of the three-dimensional printer includes providing a base temperature for a base of the three-dimensional printer that is in the range of 270°-290° F.

13. The method according to claim 9 wherein providing predetermined operating parameters of the three-dimensional printer includes providing a constant feed rate for the UHMWPE filament and the circuit material such that a consistent pressure is provided when fabricating the electronic component.

14. The method according to claim 9 wherein providing predetermined operating parameters of the three-dimensional printer includes optimizing a numerical control programming code/language of the three-dimensional printer.

15. The method according to claim 9 wherein the three-dimensional printer is a Fused Deposition Modeling (FDM) machine.

Assignees

• Northrop Grumman Systems Corp

Inventors

• Braley Daniel J
• Barnes Eric G
• Gonzalez Pedro

Classifications

• H05K2201/0129

  Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title

• H05K2203/0126

  Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes · CPC title

• B29K2305/00

  Use of metals, their alloys or their compounds, as reinforcement · CPC title

• H05K2201/0158

  Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP] · CPC title

• H05K1/032

  consisting of one material · CPC title