Printed three-dimensional (3d) functional part and method of making

Patent metadata

Field	Value
Publication number	US-2016198576-A1
Application number	US-201414900860-A
Country	US
Kind code	A1
Filing date	Jun 24, 2014
Priority date	Jun 24, 2013
Publication date	Jul 7, 2016
Grant date	—

Abstract

A printed 3D functional part includes a 3D structure comprising a structural material, and at least one functional electronic device is at least partially embedded in the 3D structure. The functional electronic device has a base secured against an interior surface of the 3D structure. One or more conductive filaments are at least partially embedded in the 3D structure and electrically connected to the at least one functional electronic device.

First claim

1 . A printed three-dimensional (3D) functional part comprising:
a 3D structure comprising a structural material; at least one functional electronic device at least partially embedded in the 3D structure and having a base secured against an interior surface thereof; and one or more conductive filaments at least partially embedded in the 3D structure and electrically connected to the at least one functional electronic device.

2 - 4 . (canceled)

5 . The printed 3D functional part of claim 1 , wherein the at least one functional electronic device is selected from the group consisting of electromechanical components, electrochemical components, active electronic components, passive electronic components, and integrated circuits.

6 . The printed 3D functional part of claim 1 , comprising a plurality of the functional electronic devices, each of the functional electronic devices having a base secured against one of the interior surfaces of the 3D structure.

7 - 8 . (canceled)

9 . The printed 3D functional part of claim 1 , wherein at least one of the one or more conductive filaments follows a nonplanar pathway between connection points.

10 - 11 . (canceled)

12 . The printed 3D functional part of claim 1 , wherein each of the one or more conductive filaments comprises a diameter or width of about 500 microns or less.

13 . The printed 3D functional part of claim 1 , wherein each of the one or more conductive filaments comprises a percolating network of conductive particles.

14 - 15 . (canceled)

16 . A method of printing a three-dimensional (3D) functional part, the method comprising:
extruding and depositing a structural filament in a predetermined pattern on a substrate to form one or more portions of a 3D structure; placing or forming at least one functional electronic device on an exposed surface of the one or more portions; and extruding and depositing one or more conductive filaments to form interconnections with the at least one functional electronic device.

17 - 19 . (canceled)

20 . The method of claim 16 , further comprising:
extruding and depositing an additional length of the structural filament in a predetermined pattern on the substrate to form one or more additional portions of the 3D structure, the one or more additional portions at least partially covering the at least one functional electronic device.

21 . (canceled)

22 . The method of claim 20 , wherein the one or more additional portions at least partially cover the one or more conductive filaments.

23 . The method of claim 16 , wherein the one or more conductive filaments comprise conductive particles in a solvent, and
wherein the structural filament comprises a polymer.

24 - 26 . (canceled)

27 . The method of claim 16 , wherein placing the at least one functional device on the exposed surface comprises a pick and place maneuver.

28 . The method of claim 16 , wherein the at least one functional electronic device is placed in a cavity comprising the exposed surface, the functional electronic device being surrounded on all sides except for an exposed face by structural material, so as to be partially embedded in the 3D structure, and wherein the exposed face comprises accessible contact pads for electrical connection to the functional electronic device.

29 . The method of claim 16 , wherein the at least one functional device includes a battery, and the battery is placed on the exposed surface.

30 . The method of claim 16 , wherein forming the at least one functional device on the exposed surface comprises extruding at least one device filament and depositing the device filament in a predetermined pattern on the substrate.

31 . The method of claim 30 , wherein the at least one functional device includes a battery, wherein the at least one device filament comprises an anode filament and a cathode filament, and wherein forming the battery comprises:
extruding the cathode filament comprising a first electrochemically active material and depositing the cathode filament in a predetermined pattern on the second exposed surface to form a cathode structure; and extruding the anode filament comprising a second electrochemically active material and depositing the anode filament in a predetermined pattern on the second exposed surface to form an anode structure.

32 . A method of printing a three-dimensional (3D) functional part, the method comprising:
extruding and depositing a structural filament in a predetermined pattern on a substrate to form one or more portions of a 3D structure, the 3D structure having a predetermined volume; placing or forming at least one functional electronic device on an exposed surface of the one or more portions; forming a battery on another exposed surface of the one or more portions, the battery having dimensions customized to the predetermined volume; and extruding and depositing one or more conductive filaments to form interconnections with the at least one functional electronic device and the battery.

33 . The method of claim 32 , wherein the exposed surface is part of a cavity or a channel in the 3D structure.

34 . The method of claim 32 , further comprising extruding and depositing an additional length of the structural filament in a predetermined pattern on the substrate to form one or more additional portions of the 3D structure, the one or more additional portions at least partially covering the at least one functional electronic device and the microbattery.

35 . (canceled)

36 . The method of claim 32 , wherein forming the battery comprises:
extruding and depositing a cathode filament comprising a first electrochemically active material in a predetermined pattern on the second exposed surface to form a cathode structure; and extruding and depositing an anode filament comprising a second electrochemically active material in a predetermined pattern on the second exposed surface to form an anode structure.

37 . The method of claim 32 , wherein the 3D functional part comprises a hearing aid and the 3D structure comprises a polymeric body.

38 - 55 . (canceled)

Assignees

• Harvard College

Inventors

• Lewis Jennifer A
• Bell Michael A
• Busbee Travis A
• Minardi John E

Classifications

• B29C64/118 Primary

  using filamentary material being melted, e.g. fused deposition modelling [FDM] · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/07178

  Means for aligning · CPC title