Heat dissipating system

Patent metadata

Field	Value
Publication number	US-10123464-B2
Application number	US-201214376124-A
Country	US
Kind code	B2
Filing date	Feb 9, 2012
Priority date	Feb 9, 2012
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

First claim

The invention claimed is:

1. A heat dissipating system comprising:
a fluid cooled thermal bus bar;
a thermal transport to remove heat from a heat-generating component and move the heat to a heat exchanger;
a connector connected to the thermal bus bar and the heat exchanger, the connector to apply a pressure between the thermal bus bar and the heat exchanger to shorten a distance between the thermal bus bar and the heat exchanger, forming a thermally conductive dry disconnect interface therebetween, wherein the thermal bus bar does not contact the heat exchanger without the pressure; and
an actuator slidably connected to the fluid cooled thermal bus bar to move the connector to apply the pressure.

2. The device of claim 1 , the connector comprising a clamp mechanism having an extended position and an unextended position.

3. The device of claim 2 , wherein the clamp mechanism exerts the pressure on one of the heat exchanger and the thermal bus bar to form the thermally conductive dry disconnect interface in the unextended position.

4. The device of claim 1 , wherein the thermal transport comprises a heat pipe.

5. The device of claim 1 , wherein the heat-generating component is housed in an electronic component; and
wherein the thermal transport comprises a sealed fluid circulation system at least partially inside the electronic component to move heat to the thermal bus bar.

6. The device of claim 1 , further comprising a pin fin array in the thermal bus bar.

7. The device of claim 6 , further comprising valves in the thermal bus bar to modulate fluid flow through a manifold in the thermal bus bar and past the pin fin array, the valves further provided to regulate temperature of outlet fluid from the pin fin array.

8. The device of claim 1 , further comprising a heat sink in thermal connection with the heat-generating component, wherein a heat path is formed between the heat sink and the thermal bus bar.

9. The device of claim 1 , wherein the heat-generating component is directly connected to the thermal transport.

10. A heat dissipating method comprising:
removing heat from a rack component via a thermal transport;
making a signal and power connection between a rack component and a rack system with an electrical connection movement; and
completing a thermal circuit between the thermal transport and a fluid cooled thermal bus bar with a thermal connection movement that is different than the electrical connection movement, wherein the thermal connection movement comprises applying a pressure at the fluid cooled thermal bus bar on the rack system to form a thermally conductive dry disconnect interface between the thermal transport and the fluid cooled thermal bus bar.

11. The method of claim 10 , further comprising regulating temperature of a cooling fluid in the thermal bus bar using active valves.

12. The method of claim 10 , further comprising regulating temperature of a cooling fluid in the thermal bus bar using passive valves actuated by thermal expansion of a wax material within a piston.

13. The method of claim 10 , wherein removing heat from the rack component is via a heat pipe in the rack component.

14. The method of claim 10 , wherein removing heat from the rack component is via a sealed fluid circulation system in the rack component, and no fluid crosses the dry disconnect interface.

15. A heat dissipating system comprising:
a fluid cooled thermal bus bar;
a thermal transport to remove heat from a heat-generating component and move the heat to a heat exchanger;
a connector to apply a pressure on one of the thermal bus bar and the heat exchanger to form a thermally conductive dry disconnect interface therebetween; and
an actuator slidably connected to the fluid cooled thermal bus bar to move the connector to apply the pressure;
wherein the thermal bus bar comprises a pin fin array, a manifold, and valves to modulate fluid flow through the manifold and past the pin fin array, the valves further provided to regulate temperature of outlet fluid from the pin fin array.

16. The system of claim 2 ,
wherein the actuator is to move the clamp mechanism between the extended position and the unextended position; and
wherein the pressure is applied in the extended position.

17. The system of claim 1 ,
wherein the connector comprises a spring mechanism to bias the connector.

Assignees

• Moore David A
• Franz John P
• Cader Tahir
• Sabotta Michael L
• Hewlett Packard Entpr Dev Lp

Inventors

• Moore David A
• Franz John P
• Cader Tahir
• Sabotta Michael L

Classifications

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• H02G5/10

  Cooling · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• H05K7/20781 Primary

  within cabinets for removing heat from server blades · CPC title

• H05K7/20827

  within rooms for removing heat from cabinets, e.g. air conditioning devices · CPC title