Liquid cooling

Patent metadata

Field	Value
Publication number	US-9803937-B2
Application number	US-201314764341-A
Country	US
Kind code	B2
Filing date	Jan 31, 2013
Priority date	Jan 31, 2013
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

First claim

What is claimed is:

1. An assembly to provide liquid cooling, the assembly comprising:
a thermal member including an array of cooling pins, the array of cooling pins extend from the thermal member, the array of cooling pins formed of a thermally conductive material;
a support member including an inlet channel and an outlet channel, the inlet channel to provide a fluid to the array of cooling pins, the outlet channel to receive the fluid from the array of cooling pins; and
a gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween, wherein the gasket comprises a seal member to extend between the thermal member and the support member, and wherein the seal member selectively compresses to align a mating member flush with a heat block that receives heat from an electronic device.

2. The assembly of claim 1 , wherein the thermal member includes the array of cooling pins on one side and the mating member on an opposite side,
the array of cooling pins to extend from the thermal member towards the gasket and receive the fluid therebetween; and
the mating member to be positioned adjacent to the heat block such that the heat block transfers heat from the electronic device to the thermal member via the mating member and the fluid contacts the array of cooling pins to remove the heat therefrom.

3. The assembly of claim 1 , wherein the seal member engages with the support member, the seal member including a flexible side wall that extends from the thermal member and selectively compresses to align the mating member flush with the heat block that receives heat from the electronic device.

4. The assembly of claim 1 , further comprising a fluid control mechanism including at least one protrusion extending across the inlet channel to evenly distribute the fluid to the cooling channel.

5. The assembly of claim 1 , further comprising a thermally actuated valve connected to the support member, the thermally actuated valve extending through the outlet channel and the gasket into a cooling channel formed between the thermal member and the gasket, the thermally actuated valve to control the flow of the fluid through the cooling channel by extending and retracting based on the temperature of the fluid in the cooling channel.

6. The assembly of claim 1 , wherein
the inlet channel receives the fluid and transports the fluid therethrough towards the cooling channel; and
the outlet channel receives the fluid from the cooling channel and transports the fluid away from the cooling channel.

7. A cooling system to provide liquid cooling comprising:
a thermal member including an array of cooling pins, the array of cooling pins extend from the thermal member, the array of cooling pins formed of a thermally conductive material;
a support member including an inlet channel and an outlet channel, the inlet channel to provide a fluid to the array of cooling pins, the outlet channel to receive the fluid from the array of cooling pins;
a gasket between the thermal member and the support member to form a fluid tight seal therebetween, wherein the gasket comprises a seal member to extend between the thermal member and the support member, and wherein the seal member selectively compresses to align a mating member flush with a heat block that receives heat from an electronic device; and
a connector member extending from the support member to provide movement of the support member during alignment of the thermal member with the heat block.

8. The cooling system of claim 7 , wherein the thermal member includes the array of cooling pins on one side and the mating member on an opposite side,
the array of cooling pins to extend from the thermal member towards the gasket and receive the fluid therebetween; and
the mating member to be positioned adjacent to the heat block such that the heat block transfers heat from the electronic device to the thermal member via the mating member and the fluid contacts the array of cooling pins to remove the heat therefrom.

9. The cooling system of claim 7 , wherein the support member comprises a first support member and a second support member, and a connector member between the first support member and the second support member to provide movement of the first support member and the second support member independent of one another.

10. The cooling system of claim 7 , wherein the connector member comprises:
a channel connector to connect to the inlet channel and the outlet channel;
a flexible inlet channel to provide a flexible connection with the inlet channel via the channel connector; and
a flexible outlet channel to provide a flexible connection with the outlet channel via the channel connector.

11. The cooling system of claim 7 , further comprising a thermally actuated valve connected to the support member, the thermally actuated valve extending through the outlet channel and the gasket into a cooling channel formed between the thermal member and the gasket, the thermally actuated valve to control the temperature of the fluid in the cooling channel by extending and retracting based on the temperature of the fluid in the cooling channel.

12. The cooling system of claim 7 , further comprising:
an inlet member to supply the fluid to the inlet channel, and
an outlet member to remove the fluid from the outlet channel.

13. An assembly to provide liquid cooling, the assembly comprising:
a thermal member including an array of cooling pins, the array of cooling pins extend from the thermal member, the array of cooling pins formed of a thermally conductive material;
a support member including an inlet channel and an outlet channel, the inlet channel to provide a fluid to the array of cooling pins, the outlet channel to receive the fluid from the array of cooling pins; and
a gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween, wherein the gasket comprises a seal member to engage with the support member, the seal member including a flexible side wall that extends from the thermal member and selectively compresses to align the mating member flush with a heat block that receives heat from an electronic device.

14. The assembly of claim 13 , wherein the gasket comprises a seal member to extend between the thermal member and the support member, the seal member selectively compresses to align the mating member flush with a heat block that receives heat from an electronic device.

15. The assembly of claim 13 , further comprising a thermally actuated valve connected to the support member, the thermally actuated valve extending through the outlet channel and the gasket into a cooling channel formed between the thermal member and the gasket, the thermally actuated valve to control the flow of the fluid through the cooling channel by extending and retracting based on the temperature of the fluid in the cooling channel.

Assignees

• Hewlett Packard Development Co Lp
• Hewlett Packard Entpr Dev Lp

Inventors

• Franz John P
• Cader Tahir
• Sabotta Michael L
• Moore David A

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20781

  within cabinets for removing heat from server blades · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• F28F1/40 Primary

  the means being only inside the tubular element · CPC title

• H01L2924/0002

  Electricity · mapped topic