Cooling assembly

Patent metadata

Field	Value
Publication number	US-9927187-B2
Application number	US-201214432207-A
Country	US
Kind code	B2
Filing date	Sep 28, 2012
Priority date	Sep 28, 2012
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.

First claim

What is claimed is:

1. An assembly useable with a cooling system, the assembly comprising:
a support member to support a thermal member, the support member including a receiving member formed therein to receive the thermal member;
a thermal member connected to the receiving member, the thermal member including an array of cooling pins on one side and a mating member on an opposite side,
the array of cooling pins to extend from the thermal member towards the receiving member and receive a fluid thereacross;

a channel formed within the support member to carry the fluid therethrough, the channel to:
receive the fluid;
distribute the fluid across the thermal member; and
remove the fluid from the thermal member; and

a fluid control mechanism along the channel to control the flow of the fluid therethrough;
wherein the mating member is positioned adjacent to a heat block such that the heat block transfers heat from an electronic device to the thermal member via the mating member and the fluid contacts the array of cooling pins to remove the heat thereform.

2. The assembly of claim 1 , wherein the channel further comprises:
an inlet channel to receive and distribute the fluid across a thermal member;
an outlet channel connectable to a thermal member to remove the fluid from the thermal member; and
a cooling channel extending between the inlet channel and the outlet channel to transport the fluid across the thermal member.

3. The assembly of claim 1 , wherein the support member includes a base portion and a cover portion connectable to the base portion.

4. The assembly of claim 1 , further comprising a thermally actuated valve connected to the support member, the thermally actuated valve controls the temperature of the fluid that flows out of the support member.

5. The assembly of claim 4 , wherein the thermally actuated valve comprises a valve fitting, a valve body with a wax member that receives the valve fitting, and a resilient member to control movement of the valve body by extending and retracting,
the wax member expands as the temperature of the fluid in the thermal member increases, expansion of the wax member allows the valve body to extend into the thermal member, which increases the amount of the fluid that flows across the thermal member, and
the wax member contracts as the temperature of the fluid in the thermal member decreases, contraction of the wax member allows the valve body to retract, which decreases the amount of the fluid that flows across the support member.

6. The assembly of claim 1 , wherein the fluid control mechanism comprises a protrusion extending within the channel to evenly distribute the fluid across the thermal members.

7. A cooling system comprising:
a support member to support a plurality of thermal members, the support member including a plurality of receiving members formed therein, each of the plurality of receiving members to mate to one of the plurality of thermal members;
each of the plurality of thermal members including an array of cooling pins,
the array of cooling pins extend from each of the plurality of thermal members towards a corresponding receiving member, the array of cooling pins receive a fluid thereacross to remove heat therefrom;
a channel formed in the support member to carry the fluid therethrough, the channel includes:
an inlet channel to receive and distribute the fluid across the plurality of thermal members: and
an outlet channel connectable to each of the plurality of thermal members to remove the fluid from the plurality of thermal members; and

a fluid control mechanism in the channel to control the flow of the fluid across the plurality of thermal members.

8. The cooling system of claim 7 , wherein each of the plurality of thermal members further comprise a mating member, the array of cooling pins are located on one side of each of the plurality of thermal members and the mating member is located on an opposite side of each of the plurality of thermal members, one of the plurality of thermal members is positioned adjacent to a heat block such that the heat block transfers heat from an electronic device to the one of the plurality of thermal members via the mating member, and the fluid contacts the array of cooling pins to transfer the heat from each of the plurality of thermal members to the fluid.

9. The cooling system of claim 7 , further comprising:
an inlet member to receive the fluid, and
an outlet member to remove the fluid therefrom.

10. The cooling system of claim 7 , further comprising a plurality of cooling channels extending between the inlet channel and the outlet channel, each of the plurality of cooling channels are formed between one of the plurality of receiving members and one of the plurality of thermal members, such that the fluid is distributed across the plurality of thermal members.

11. The cooling system of claim 7 , further comprising a heat exchanger between the outlet channel and the inlet channel to recycle the fluid from the outlet channel and provide the inlet channel with the fluid, such that
the fluid is transported from the outlet channel to the heat exchanger, and
the heat exchanger reduces a temperature of the fluid from the outlet channel, and
the fluid with a reduced temperature is transported to the inlet channel.

12. The cooling system of claim 7 , further comprising at least one thermally actuated valve for each of the plurality of thermal members to control the temperature of fluid flowing through the array of cooling pins based on the temperature of the fluid in the one of the plurality of thermal members, such that the temperature of the fluid is regulated,
the thermally actuated valve comprises a valve fitting, a valve body with a wax member that receives the valve fitting, and a resilient member to control movement of the valve body by extending and retracting,
the wax member expands as the temperature of the fluid in the one of the plural of thermal members increases, expansion of the wax member allows the valve body to extend into the one of the plurality of thermal members, which increases the amount of the fluid that flows across the one of the plurality of thermal members, and
the wax member contracts as the temperature of the fluid in the one of the plurality of thermal member decreases, contraction of the wax member allows the valve body to retract, which decreases the amount of the fluid that flows across the support member.

13. A method to cool an electronic device, the method comprising:
receiving heat from an electronic device with a cooling system, the cooling system includes:
a support member to support a thermal member,
a channel formed within the support member to carry a fluid therethrough, the channel to:
receive the fluid,
distribute the fluid across a thermal member,
remove the fluid from the thermal member,

a fluid control mechanism along the channel to control the flow of the fluid therethrough, and
a thermal member positioned adjacent to a heat block that receives heat from the electronic device, the thermal member includes an array of cooling pins on one side, the array of cooling pins extend towards the receiving member;

distributing the fluid across the thermal member via the channel, the fluid is distributed over the array of cooling pins, as the fluid contacts the array of cooling pins the heat transfers from the thermal member to the fluid; and
removing the fluid with the heat from the thermal member via the channel.

14. The method of claim 13 , further comprising recycling the fluid by:
carrying the fluid from the thermal member to a heat exchanger

Assignees

• Hewlett Packard Development Co
• Hewlett Packard Entpr Dev Lp

Inventors

• Moore David Allen
• Franz John P
• Cader Tahir
• Sabotta Michael Lawrence

Classifications

• H05K7/20781

  within cabinets for removing heat from server blades · CPC title

• F28F13/06 Primary

  by affecting the pattern of flow of the heat-exchange media {(F28F13/003 takes precedence; static flow control means in header boxes F28F9/026)} · CPC title

• H05K7/20809

  within server blades for removing heat from heat source · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H01L23/473

  Electricity · mapped topic