Method of forming a protective coating for a packaged semiconductor device

Patent metadata

Field	Value
Publication number	US-10118816-B2
Application number	US-201615388557-A
Country	US
Kind code	B2
Filing date	Dec 22, 2016
Priority date	Aug 24, 2015
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

A packaged includes a flip-chip assembly. The flip-chip assembly includes a first semiconductor substrate having at least one integrated semiconductor device, and a second substrate connected to the first substrate. A main surface of the first semiconductor substrate faces and is spaced apart from the second substrate. The packaged semiconductor device further includes a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate. A first section of the main surface is exposed from the parylene coating.

First claim

What is claimed is:

1. A packaged semiconductor device, comprising:
a flip-chip assembly, comprising a first semiconductor substrate comprising at least one integrated semiconductor device, and a second substrate connected to the first substrate, wherein a main surface of the first semiconductor substrate faces and is spaced apart from the second substrate;
a parylene coating covering outer surfaces of the first semiconductor substrate and the second substrate,
wherein a first section of the main surface is exposed from the parylene coating.

2. The packaged semiconductor device of claim 1 , wherein only the first section of the main surface of the first semiconductor substrate is exposed from the parylene coating and every other surface of the first semiconductor substrate outside of the first section of the main surface is covered by the parylene coating.

3. The packaged semiconductor device of claim 2 , wherein the first semiconductor substrate comprises a MEMs sensor device, and wherein a sensing portion of the MEMs sensor device is disposed in the first section of the main surface of the first semiconductor substrate.

4. The packaged semiconductor device of claim 3 , wherein the MEMs sensor device comprises a pressure sensor configured to detect ambient air pressure at the main surface.

5. The packaged semiconductor device of claim 1 , wherein the second semiconductor substrate comprises at least one integrated semiconductor device.

6. The packaged semiconductor device of claim 1 , wherein the second semiconductor substrate is devoid of functional circuitry.

7. The packaged semiconductor device of claim 5 , wherein the second semiconductor substrate is configured as a heat sink.

8. The packaged semiconductor device of claim 1 , wherein the first semiconductor substrate is connected to the second semiconductor substrate by an interconnect structure, wherein the interconnect structure is completely covered by the parylene coating.

9. The packaged semiconductor device of claim 7 , wherein the interconnect structure is a copper solder bump or stud.

10. The packaged semiconductor device of claim 1 , further comprising a molded cavity package comprising an interior cavity and electrically conductive leads, wherein the flip-chip assembly is mounted within the interior cavity, and wherein the electrically conductive leads are connected to electrical terminals of the first semiconductor substrate.

11. The packaged semiconductor device of claim 9 , wherein the electrically conductive leads are connected to electrical terminals of the first semiconductor substrate by one or more though-silicon-vias that extend through the second substrate.

12. The packaged semiconductor device of claim 9 , wherein the electrically conductive leads are connected to electrical terminals of the first semiconductor substrate by one or more electrically conductive bond wires connected between the leads and electrical terminals of the of the second semiconductor substrate.

13. The packaged semiconductor device of claim 9 , wherein the molded cavity package comprises an open side that extends between top ends of opposing outer sidewalls, and wherein the open side is covered by a gas-permeable membrane.

Assignees

• Infineon Technologies Ag

Inventors

• Elian Klaus
• Theuss Horst

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• B81B7/0038 Primary

  using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters · CPC title

• B81C1/00285

  using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters · CPC title