Multi-layer packaging scheme for implant electronics

Patent metadata

Field	Value
Publication number	US-2016133540-A1
Application number	US-201514981432-A
Country	US
Kind code	A1
Filing date	Dec 28, 2015
Priority date	Sep 17, 2013
Publication date	May 12, 2016
Grant date	—

Abstract

The present invention provides a micropackaged device comprising: a substrate for securing a device with a corrosion barrier affixed to the substrate, wherein the corrosion barrier comprises a first thin-film layer, a metal film coating the thin-film layer and a second thin-film layer to provide a sandwich layer; and optionally at least one feedthrough disposed in the substrate to permit at least one input and or at least one output line into the micropackaged device, wherein the micropackaged device is encapsulated by the corrosion barrier. Methods of producing the micropackaged device are also disclosed.

First claim

1 . A method for preparing a micropackaged device, said method comprising:
providing a substrate for securing the device; coating the device with a first thin-film layer to provide a first thin-film layer over the device; depositing a surrounding metal film over the first thin-film layer to produce a metal coat; and coating the metal coat layer with a second thin-film layer to provide an encapsulated micropackaged device.

2 . The method of claim 1 , wherein said device is a member selected from the group consisting of an integrated circuit (IC) chip, a printed circuit board (PCB), a microelectromechanical system (MEMS), a capacitor, an inductor, an oscillator, and a combination thereof

3 . The method of claim 1 , wherein the first thin-film layer is made of a material selected from the group consisting of parylene, polyimide, Teflon and Kapton.

4 . The method of claim 1 , wherein the second thin-film layer is made of a material selected from the group consisting of parylene, polyimide, Teflon and Kapton.

5 . The method of claim 3 , wherein the first thin-film layer is parylene.

6 . The method of claim 4 , wherein the second thin-film layer is parylene.

7 . The method of claim 1 , wherein the metal film is a biocompatible metal.

8 . The method of claim 7 , wherein the metal film is a member selected from the group consisting of Au, Ag, Pt, Pd, Ti and an alloy.

9 . The method of claim 1 , wherein depositing a surrounding metal film over the first thin-film layer to produce a metal coat is accomplished in a plurality of stages.

10 . The method of claim 9 , wherein in a first stage, the device is held at about 45° to the metal deposition source to complete encapsulation of one side of the device.

11 . The method of claim 9 , wherein in a second stage, the device is flipped 180 ° and held at about 45° to the metal deposition source to complete encapsulation of the other side of the device.

12 . The method of claim 9 , wherein depositing a surrounding metal film surrounding the device is performed with a holder in constant motion.

13 . The method of claim 1 , wherein the first thin-film layer, the metal film coating and the second thin-film layer is a sandwich layer.

14 . The method of claim 13 , wherein said sandwich layer is a parylene-metal film-parylene.

15 . The method of claim 13 , wherein said sandwich is a corrosion barrier.

16 . The method of claim 1 , wherein said substrate comprises at least one feedthrough disposed therein to permit at least one input and or at least one output line into said micropackaged device.

17 . The micropackaged device produced by the method of claim 1 .

18 . An encapsulated micropackaged device, said micropackaged device comprising:
a substrate for securing a device; a corrosion barrier affixed to said substrate, wherein said corrosion barrier comprises a first thin-film layer, a metal film coating said first thin-film layer and a second thin-film layer to provide a sandwich layer; and optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device, wherein said micropackaged device is encapsulated by said corrosion barrier.

19 . The encapsulated micropackaged device of claim 18 , wherein said device is a member selected from the group consisting of an integrated circuit (IC) chip, a printed circuit board (PCB), a microelectromechanical system (MEMS), a capacitor, an inductor, an oscillator, and a combination thereof.

20 . The encapsulated micropackaged device of claim 18 , wherein said corrosion barrier is made from a low-permeation material.

21 - 40 . (canceled)

Assignees

• California Inst Of Techn

Inventors

• Tai Yu-Chong
• Chang Han-Chieh

Classifications

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W74/121 Primary

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• A61N1/36046

  of the eye · CPC title

• B81C1/00

  Manufacture or treatment of devices or systems in or on a substrate (B81C3/00 takes precedence) · CPC title