Monolithic manifold mask and substrate concepts

Patent metadata

Field	Value
Publication number	US-10118263-B2
Application number	US-201514843775-A
Country	US
Kind code	B2
Filing date	Sep 2, 2015
Priority date	Sep 2, 2015
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

Component-locating templates or masks for use with positioning fluid-flow components on monolithic ceramic substrates are provided, as well as techniques for the manufacture of such templates.

First claim

What is claimed is:

1. An apparatus comprising:
a ceramic monolithic manifold (CMM) for routing semiconductor processing gases between various fluid flow components, the CMM including:
a plurality of internal passages,
a plurality of first drop-holes formed in a first side of the CMM prior to sintering the CMM, each first drop-hole leading to one of the internal passages, and
one or more reference features formed after the CMM has been sintered; and

a first template, the first template including:
one or more first template-locating features configured to interface with the one or more reference features of the CMM so as to locate the first template relative to the CMM when the first template is laid against the first side of the CMM, and
one or more first component-locating features that are positioned with respect to a template reference coordinate system defined by the one or more first template-locating features based, at least in part, on measured positions of the first drop-holes relative to a substrate reference coordinate system defined by the one or more reference features, wherein:
the first template is laid against the first side of the CMM and the one or more first template-locating features is interfaced with the one or more reference features,
each first component-locating feature is positioned over one of the first drop-holes, and
each first component-locating feature is configured to position one of a plurality of first fluid flow components relative to one or more of the first drop-holes when that first fluid flow component is mounted to the apparatus.

2. The apparatus of claim 1 , wherein the first template is formed from a sheet of material.

3. The apparatus of claim 2 , wherein the material of the sheet of material is selected from the group consisting of: stainless steel alloy, aluminum alloy, plastic, fiberglass, printed circuit board substrate material, and ceramic.

4. The apparatus of claim 1 , wherein the first template further includes a resistive heater layer.

5. The apparatus of claim 1 , wherein the first template further includes an electrical interconnect layer including a plurality of conductive pathways that are electrically isolated from one another within the electrical interconnect layer and that are configured to communicate electrical signals to one or more of the first fluid flow components when the first fluid flow components are mounted to the CMM and the first template is interposed between the one or more of the one or more first fluid flow components and the CMM.

6. The apparatus of claim 1 , wherein the first template further includes one or more textual or graphical indicators indicating mounting locations for one or more of the first fluid-flow components.

7. The apparatus of claim 1 , wherein the CMM also includes poka-yoke receptacles in one or more locations on the first side and the first template does not have openings in at least some locations with respect to the template reference coordinate system that correspond to the locations of the poka-yoke receptacles with respect to the substrate reference coordinate system.

8. The apparatus of claim 1 , wherein:
the CMM further includes one or more sets of first component-mounting features,
each first component-mounting feature is associated with one of the first component-locating features,
the first template further includes one or more sets of first component-mounting feature pass-throughs,
each first component-mounting feature pass-through is associated with a different one of the first component-locating features, and
each first component-mounting feature pass-through is positioned such that that first component-mounting feature pass-through is collocated with the associated first component-locating feature when the template is laid against the CMM with the one or more first template-locating features interfaced with the one or more reference features.

9. The apparatus of claim 8 , wherein the CMM further includes a plurality of second drop-holes in a second side of the CMM opposite the first side of the CMM, the apparatus further comprising:
a second template, the second template including:
one or more second template-locating features configured to interface with the one or more reference features of the CMM so as to locate the second template relative to the CMM, and
one or more second component-locating features that are positioned with respect to a second template reference coordinate system defined by the one or more second template-locating features based, at least in part, on measured positions of the second drop-holes relative to the substrate reference coordinate system, wherein:
each second component-locating feature is configured to position a second fluid flow component relative to one or more of the second drop-holes when that second fluid flow component is mounted to the apparatus.

10. The apparatus of claim 9 , wherein:
the first template and the second template match with respect to the positions of the first and second template-locating features and the first and second component-locating features, respectively.

11. A method comprising:
forming a plurality of first drop-holes in a first side of a ceramic substrate;
sintering the ceramic substrate after forming the plurality of first drop-holes in the first side of the ceramic substrate;
forming one or more reference features in the ceramic substrate after the ceramic substrate has been sintered;
measuring a two-dimensional location of each first drop-hole relative to a substrate reference coordinate system defined by the one or more reference features;
forming one or more template-locating features in a template, the one or more template-locating features configured to interface with the one or more reference features so as to allow the template to be laid against the ceramic substrate and fixed in at least two dimensions relative to the ceramic substrate by interfacing the one or more template-locating features with the one or more reference features; and
forming one or more component-locating features in the template, each component-locating feature positioned relative to a template reference coordinate system defined by the one or more template-locating features based, at least in part, on the measured location of one of the first drop-holes relative to the substrate reference coordinate system.

12. The method of claim 11 , further comprising:
storing the location of each component-locating feature relative to the template reference coordinate system in a non-volatile, computer-readable medium;
receiving a request for a replacement template;
retrieving, responsive to the request for a replacement template, the location of each component-locating feature relative to the template reference coordinate system from the non-volatile, computer-readable medium;
forming one or more replacement template-locating features in a replacement template, the one or more replacement template-locating features configured to interface with the one or more reference features so as to allow the replacement template to be placed on the ceramic substrate and fixed in at least two dimensions relative to the ceramic substrate, and
forming one or more replacement component-locating features in the replacement template, each replacement component-locating feature positioned relative to a replacement template reference coordinate system defined by the one or more replacement template-locating features at locations corresponding to the locations of the component-locating features relative to the template reference coordinate system retrieved from the non-volatile, computer-readable medium.

Assignees

• Lam Res Corp
• Lam Researech Corp

Inventors

• Kellogg Michael C
• Lee Andrew C
• Pena Christopher J

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/50 Primary

  for positioning, orientation or alignment · CPC title

• B23P19/10 Primary

  Aligning parts to be fitted together · CPC title

• B23P19/12

  Alignment of parts for insertion into bores · CPC title