Coupling element, integrated circuit device and method of fabrication therefor

Patent metadata

Field	Value
Publication number	US-10115697-B2
Application number	US-201615365107-A
Country	US
Kind code	B2
Filing date	Nov 30, 2016
Priority date	Dec 22, 2015
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A coupling element for providing external coupling to a semiconductor die within an integrated circuit package. The coupling element comprises a flexible laminate structure comprising a flexible, electrically insulating substrate layer, a first conductive layer bonded to a first surface of the substrate layer, and a second conductive layer bonded to a second surface of the substrate layer. The coupling element is arranged to be coupled to the semiconductor die such that the first and second conductive layers are electrically coupled to electrical contacts of the semiconductor die. The coupling element is further arranged to extend through the integrated circuit package when electrically coupled to the semiconductor die, and for the first and second conductive layers to be further electrically coupled to at least one external component.

First claim

The invention claimed is:

1. A coupling element for providing external coupling to a semiconductor die within an integrated circuit package; the coupling element comprising a flexible laminate structure comprising:
a flexible, electrically insulating substrate layer;
a first conductive layer bonded to a first surface of the substrate layer, the first conductive layer comprising a first bonding area for bonding directly to a first respective bonding pad of the semiconductor die; and
a second conductive layer bonded to a second surface of the substrate layer, wherein:
the coupling element is arranged to be coupled to the semiconductor die such that the first and second conductive layers are electrically coupled to electrical contacts of the semiconductor die, the second conductive layer comprising a second bonding area for bonding directly to a second respective bonding pad of the semiconductor die; and
the coupling element is further arranged to extend through the integrated circuit package when electrically coupled to the semiconductor die, and for the first and second conductive layers to be further electrically coupled to at least one external component.

2. The coupling element of claim 1 , wherein the first and second conductive layers are arranged to extend beyond a first edge of the substrate layer.

3. The coupling element of claim 2 , wherein the first and second conductive layers are further arranged to extend beyond a second edge of the substrate layer, and provide bonding areas for bonding to respective bonding pads of the at least one external component.

4. The coupling element of claim 1 , wherein:
the first conductive layer bonded to the first surface of the substrate layer is arranged to provide a signal path between the semiconductor die and the at least one external component; and
the second conductive layer bonded to the second surface of the substrate layer is arranged to provide a reference path between the semiconductor die and the at least one external component.

5. The coupling element of claim 1 , wherein the first and second conductive layers are bonded onto the substrate layer such that they at least partially overlap one another.

6. The coupling element of claim 1 comprising a plurality of conductive layers bonded to the first surface of the substrate layer, and a plurality of conductive layers bonded to the second surface of the substrate layer; wherein the coupling element is arranged to be coupled to the semiconductor die such that each conductive layer is electrically coupled to electrical contacts of the semiconductor die.

7. The coupling element of claim 1 , wherein at least one of the first conductive layer and the second conductive layer is configured to integrally provide at least a part of an impedance transformation and power combination network.

8. An integrated circuit device comprising a semiconductor die located within an integrated circuit package and a coupling element for providing external coupling to the semiconductor die; the coupling element comprising a flexible laminate structure comprising:
a flexible, electrically insulating substrate layer;
a first conductive layer bonded to a first surface of the substrate layer, the first conductive layer comprising a first bonding area for bonding directly to a first respective bonding pad of the semiconductor die; and
a second conductive layer bonded to a second surface of the substrate layer, wherein:
the coupling element is arranged to be coupled to the semiconductor die such that the first and second conductive layers are electrically coupled to electrical contacts of the semiconductor die, the second conductive layer comprising a second bonding area for bonding directly to a second respective bonding pad of the semiconductor die; and
the coupling element is further arranged to extend through the integrated circuit package when electrically coupled to the semiconductor die, and for the first and second conductive layers to be further electrically coupled to at least one external component.

9. The integrated circuit device of claim 8 , wherein the first and second conductive layers are arranged to extend beyond a first edge of the substrate layer.

10. The integrated circuit device of claim 9 , wherein the first and second conductive layers are further arranged to extend beyond a second edge of the substrate layer, and provide bonding areas for bonding to respective bonding pads of the at least one external component.

11. The integrated circuit device of claim 8 , wherein:
the first conductive layer bonded to the first surface of the substrate layer is arranged to provide a signal path between the semiconductor die and the at least one external component; and
the second conductive layer bonded to the second surface of the substrate layer is arranged to provide a reference path between the semiconductor die and the at least one external component.

12. The integrated circuit device of claim 8 , wherein the first and second conductive layers are bonded onto the substrate layer such that they at least partially overlap one another.

13. The integrated circuit device of claim 8 , wherein the coupling element comprises a plurality of conductive layers bonded to the first surface of the substrate layer, and a plurality of conductive layers bonded to the second surface of the substrate layer; wherein the coupling element is arranged to be coupled to the semiconductor die such that each conductive layer is electrically coupled to electrical contacts of the semiconductor die.

14. The integrated circuit device of claim 13 , wherein the semiconductor die comprises a plurality of active devices, and at least one conductive layer bonded to the first surface of the substrate layer is electrically coupled respectively to each active element of the semiconductor die.

15. The integrated circuit device of claim 8 , wherein at least one of the first conductive layer and the second conductive layer is configured to integrally provide at least a part of an impedance transformation and power combination network.

16. A method of fabricating a coupling element for providing external coupling to a semiconductor die within an integrated circuit package; the method comprising:
bonding a first conductive layer to a first surface of a flexible, electrically insulating substrate layer, the first conductive layer comprising a first bonding area for bonding directly to a first respective bonding pad of the semiconductor die; and
bonding a second conductive layer to a second surface of the substrate layer,
wherein:
the coupling element is arranged to be coupled to the semiconductor die such that the first and second conductive layers are electrically coupled to electrical contacts of the semiconductor die, the second conductive layer comprising a second bonding area for bonding directly to a second respective bonding pad of the semiconductor die; and
the coupling element is further arranged to extend through the integrated circuit package when electrically coupled to the semiconductor die, and for the first and second conductive layers to be further electrically coupled to at least one external component.

17. The method of claim 16 , wherein the first and second conductive layers are bonded to the substrate layer such that they extend beyond a first edge of the substrate layer.

18. The method of claim 17 , wherein the first and second conductive layers are bonded to the substrate layer such that they extend beyond a second edge of the substrate layer, and provide bonding areas for bonding

Assignees

• Nxp Usa Inc

Inventors

• Jones Jeffrey Kevin
• Blednov Igor

Classifications

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/347

  Dispositions of multiple die-attach connectors · CPC title

• H10W44/234

  Arrangements for impedance matching · CPC title

• H10W44/226

  for HF amplifiers · CPC title

• H10W44/216

  Waveguides, e.g. strip lines · CPC title