Inverter power module
US-2024258196-A1 · Aug 1, 2024 · US
Dispositions of multiple die-attach connectors
Dispositions of multiple die-attach connectors · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/347 |
| Official title | {Dispositions of multiple die-attach connectors} |
| Display label | Dispositions of multiple die-attach connectors |
| Total patents | 3,775 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 183 |
| 2016 | 239 |
| 2017 | 242 |
| 2018 | 274 |
| 2019 | 334 |
| 2020 | 456 |
| 2021 | 445 |
| 2022 | 441 |
| 2023 | 340 |
| 2024 | 421 |
| 2025 | 337 |
| 2026 | 63 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Power module and electrical device
US-2024235414-A1 · Jul 11, 2024 · US
Thermal expansion matched chip module with integrated liquid cooling
US-2024203822-A1 · Jun 20, 2024 · US
Semiconductor package with reinforcing structure
US-2024063077-A1 · Feb 22, 2024 · US
Package with Improved Heat Dissipation Efficiency and Method for Forming the Same
US-2024006270-A1 · Jan 4, 2024 · US
Multiple bond via arrays of different wire heights on a same substrate
US-2015380377-A1 · Dec 31, 2015 · US
Semiconductor device
US-9224663-B2 · Dec 29, 2015 · US
Silicon shield for package stress sensitive devices
US-2015364431-A1 · Dec 17, 2015 · US
Thermal interface material on package
US-2015364342-A1 · Dec 17, 2015 · US
Semiconductor device and an electronic device
US-2015364587-A1 · Dec 17, 2015 · US
Apparatus for mounting microelectronic chips
US-9214404-B1 · Dec 15, 2015 · US
Electronic module and method of manufacturing the same
US-2015342073-A1 · Nov 26, 2015 · US
Semiconductor device and method for manufacturing the same
US-2015333024-A1 · Nov 19, 2015 · US
Semiconductor package
US-9184107-B2 · Nov 10, 2015 · US
Stacked semiconductor die assemblies with support members and associated systems and methods
US-2015311185-A1 · Oct 29, 2015 · US
Semiconductor unit and semiconductor device using the same
US-9165871-B2 · Oct 20, 2015 · US
Semiconductor Module
US-2015289369-A1 · Oct 8, 2015 · US
Molded semiconductor package with pluggable lead
US-9153518-B2 · Oct 6, 2015 · US
Semiconductor die package with multiple mounting configurations
US-2015279757-A1 · Oct 1, 2015 · US
Semiconductor Package with Integrated Die Paddles for Power Stage
US-2015270202-A1 · Sep 24, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/347?
- CPC H10W72/347 is the Cooperative Patent Classification code for “Dispositions of multiple die-attach connectors.”
- How many patents are filed under CPC H10W72/347 (Dispositions of multiple die-attach connectors)?
- Our database includes 3,775 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/347 growing?
- Publication counts under this code: 421 in 2024 vs 337 in 2025 (latest complete years).