Semiconductor Manufacturing Device, Push-up Unit, and Method of Manufacturing Semiconductor Device
US-2024312825-A1 · Sep 19, 2024 · US
US10115620B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10115620-B2 |
| Application number | US-201514840404-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 31, 2015 |
| Priority date | Aug 31, 2015 |
| Publication date | Oct 30, 2018 |
| Grant date | Oct 30, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Disclosed is an apparatus for handling electronic components and a method of adjusting the position of at least one handling device of an apparatus for handling electronic components. The apparatus comprises a rotary device; an imaging device located on the rotary device which is positionable by the rotary device; a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; a fiducial mark located at a fixed position relative to the rotary device such that the rotary device is rotatable relative to the fiducial mark, the fixed position of the fiducial mark being indicative of an arrangement of an electronic component which is held by a respective pick head; and at least one handling device for handling the electronic components, the position of the at least one handling device being adjustable for aligning the at least one handling device with the arrangement of the electronic component held by the pick head; wherein the imaging device is operative to capture at least one image comprising the fiducial mark and the at least one handling device for deriving an offset between the at least one handling device and the arrangement of the electronic component as indicated by the fixed position of the fiducial mark.
Opening claim text (preview).
The invention claimed is: 1. An apparatus for handling electronic components, the apparatus comprising: a rotary device; an imaging device located on the rotary device which is positionable by the rotary device; a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; a fiducial mark located at a fixed position relative to the rotary device such that the rotary device is rotatable relative to the fiducial mark, the fixed position of the fiducial mark being indicative of an arrangement of an electronic component which is held by a respective pick head; and at least one handling device for handling the electronic components, the position of the at least one handling device being adjustable for aligning the at least one handling device with the arrangement of the electronic component held by the pick head; wherein the imaging device is operative to capture at least one image comprising the fiducial mark and the at least one handling device for deriving an offset between the at least one handling device and the arrangement of the electronic component as indicated by the fixed position of the fiducial mark. 2. The apparatus of claim 1 , wherein the handling device is adjustable to align it to the fiducial mark based on an offset between the imaging device and the fiducial mark that is derived. 3. The apparatus of claim 1 , wherein the fiducial mark is comprised in a reference member which is external to the rotary device. 4. The apparatus of claim 1 , wherein the imaging device is a camera. 5. The apparatus of claim 1 , wherein the at least one handling device is motorised and is operable to automatically align the at least one handling device with respect to the arrangement of the electronic component as indicated by the fixed position of the fiducial mark. 6. The apparatus of claim 1 , further comprising a mounting member located on the rotary device to which the imaging device is detachably mountable. 7. The apparatus of claim 1 , wherein the imaging device is operative to capture a first image comprising the fiducial mark, and a second image comprising the at least one handling device. 8. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components, the apparatus comprising a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, the method comprising the steps of: positioning an imaging device located on the rotary device with respect to a fiducial mark located at a fixed position relative to the rotary device such that the rotary device is rotatable relative to the fiducial mark, the fixed position of the fiducial mark being indicative of an arrangement of an electronic component which is held by a respective pick head; capturing at least one image comprising the fiducial mark and at least one handling device using the imaging device; deriving an offset between the fiducial mark and the at least one handling device from the at least one image captured by the imaging device; and adjusting the position of the at least one handling device to align the at least one handling device with respect to the arrangement of the electronic components, based on the said offset. 9. The method of claim 8 , further comprising a step of detachably mounting the imaging device to a mounting member for locating the imaging device on the rotary device. 10. The method of claim 8 , wherein the fiducial mark is comprised in a reference member which is external to the rotary device. 11. The method of claim 8 , wherein the step of adjusting the position of the at least one handling device further comprises the step of adjusting the handling device such that an optical centre of the handling device is aligned with respect to an optical centre of the fiducial mark. 12. The method of claim 8 , wherein the at least one handling device is motorised and the step of adjusting the position of the at least one handling device is automatically performed based on the said offset. 13. The method of claim 8 , wherein the step of capturing at least one image comprising the fiducial mark and at least one handling device using the imaging device comprises a step of capturing a first image of the fiducial mark and a second image of the at least one handling device. 14. The method of claim 8 , wherein the step of adjusting the position of the at least one handling device comprises a step of adjusting the at least one handling device based on a derived offset between the imaging device and the fiducial mark.
characterised by supporting substrates others than wafers, e.g. chips · CPC title
characterised by lifting arrangements, e.g. lift pins · CPC title
the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title
Sorting devices · CPC title
using optical controlling means · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.