Substrate cooling method, substrate transfer method, and load-lock mechanism

Patent metadata

Field	Value
Publication number	US-10115611-B2
Application number	US-201615334179-A
Country	US
Kind code	B2
Filing date	Oct 25, 2016
Priority date	Oct 26, 2015
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A substrate cooling method is for, using a load-lock mechanism for controlling a pressure therein between a first pressure close to an atmospheric pressure and a second pressure in a vacuum state, cooling a substrate transferred from the second module to the first module. The method includes maintaining a pressure in the chamber to the second pressure, allowing the chamber to communicate with a second module, and loading the substrate into the chamber; locating the substrate to a cooling position close to the cooling member; exhausting the chamber such that the pressure in the chamber becomes a third pressure where a region between a surface of the cooling member and a backside of the substrate satisfies a molecular flow condition. The method further includes introducing a purge gas into the chamber to increase the pressure in the chamber to the first pressure, and cooling the substrate by the cooling member.

First claim

What is claimed is:

1. A substrate cooling method for, by using a load-lock mechanism for controlling a pressure therein between a first pressure and a second pressure in the case of transferring the substrate between a first module maintained at a first pressure close to an atmospheric pressure and a second module maintained at a second pressure in a vacuum state, cooling a high-temperature substrate transferred from the second module to the first module, the load-lock mechanism including a chamber accommodating a substrate, a cooling member disposed in the chamber and configured to cool the substrate disposed proximate to the cooling member, a gas exhaust unit configured to exhaust the chamber, and a purge gas inlet unit configured to introduce a purge gas into the chamber, the method comprising:
maintaining a pressure in the chamber to the second pressure, allowing the chamber to communicate with the second module, and loading the high-temperature substrate into the chamber;
placing the substrate to a cooling position close to the cooling member;
exhausting the chamber to a third pressure at which a region between a surface of the cooling member and a backside of the substrate satisfies a molecular flow condition to obtain uniform temperature distribution of the substrate; and
after maintaining the third pressure in the chamber at the third pressure for a first duration, introducing a purge gas into the chamber to increase the pressure in the chamber to the first pressure, and cooling the substrate by using the cooling member.

2. The substrate cooling method of claim 1 , wherein a temperature of the high-temperature substrate is 200° C. or above.

3. The substrate cooling method of claim 1 , wherein in the cooling position, a distance between the surface of the cooling member and the backside of the substrate is within a range from 0.2 mm to 1 mm.

4. The substrate cooling method of claim 1 , wherein the first duration of maintaining the pressure in the chamber at the third pressure is in a range of 5 sec to 60 sec.

5. The substrate cooling method of claim 1 , wherein the second pressure is within a range from 20 Pa to 200 Pa.

6. The substrate cooling method of claim 1 , wherein the cooling member is controlled to a predetermined temperature by circulating a cooling medium therethrough.

7. A substrate transfer method for, by using a load-lock mechanism for controlling a pressure therein between a first pressure and a second pressure in the case of transferring the substrate between a first module maintained at a first pressure close to an atmospheric pressure and a second module maintained at a second pressure in a vacuum state, transferring a high-temperature substrate from the second module to the first module, the load-lock mechanism including a chamber accommodating a substrate, a cooling member disposed in the chamber and configured to cool the substrate disposed proximate the cooling member, a gas exhaust unit configured to exhaust the chamber, and a purge gas inlet unit configured to introduce a purge gas into the chamber, the method comprising:
maintaining a pressure in the chamber to the second pressure, allowing the chamber to communicate with the second module, and loading the high-temperature substrate into the chamber;
placing the substrate to a cooling position close to the cooling member;
exhausting the chamber to a third pressure at which a region between a surface of the cooling member and a backside of the substrate satisfies a molecular flow condition to obtain uniform temperature distribution of the substrate;
after maintaining the pressure in the chamber at the third pressure for a first duration, introducing a purge gas into the chamber to increase the pressure in the chamber to the first pressure, and cooling the substrate by using the cooling member; and
transferring the substrate cooled to a predetermined temperature to the first module.

8. The substrate transfer method of claim 7 , wherein a temperature of the high-temperature substrate is 200° C. or above.

9. The substrate transfer method of claim 7 , wherein in the cooling position, a distance between the surface of the cooling member and the backside of the substrate is within a range from 0.2 mm to 1 mm.

10. The substrate transfer method of claim 7 , wherein the first duration of maintaining the pressure in the chamber at the third pressure is in the range of 5 sec to 60 sec.

11. The substrate transfer method of claim 7 , wherein the second pressure is within a range from 20 Pa to 200 Pa.

12. The substrate transfer method of claim 7 , wherein the cooling member is controlled to a predetermined temperature by circulating a cooling medium therethrough.

13. A load-lock mechanism for controlling a pressure therein between a first pressure and a second pressure in the case of transferring a substrate between a first module maintained at a first pressure close to an atmospheric pressure and a second module maintained at a second pressure in a vacuum state, comprising:
a chamber accommodating a substrate;
a cooling member provided in the chamber and configured to cool the substrate disposed proximate to the cooling member;
a gas exhaust unit configured to exhaust the chamber;
a purge gas inlet unit configured to introduce a purge gas into the chamber;
a communicating unit configured to allow the chamber to communicate with any one of the first module and the second module; and
a control unit configured to control respective components of the load-lock mechanism,
wherein when a high-temperature substrate is transferred from the second module to the first module, the control unit performs processes including;
maintaining a pressure in the chamber at the second pressure, allowing the chamber to communicate with the second module, and loading the high-temperature substrate into the chamber;
placing the substrate to a cooling position close to the cooling member;
exhausting the chamber to a third pressure at which a region between a surface of the cooling member and a backside of the substrate satisfies a molecular flow condition to obtain uniform temperature distribution of the substrate; and
after maintaining the pressure in the chamber at the third pressure for a predetermined duration, introducing a purge gas into the chamber to increase the pressure in the chamber to the first pressure, and cooling the substrate by heat transfer from the cooling member.

14. The substrate transfer method of claim 1 , wherein the third pressure is lower than the second pressure.

15. The substrate transfer method of claim 7 , wherein the third pressure is lower than the second pressure.

16. The load-lock mechanism for controlling a pressure of claim 13 , wherein the third pressure is lower than the second pressure.

Assignees

• Tokyo Electron Ltd

Inventors

• Sakaue Hiromitsu
• Okano Shinya

Classifications

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0456

  in-line arrangement · CPC title

• H10P72/0454

  surrounding a central transfer chamber · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title