Integrated waveguide structure and socket structure for millimeter waveband testing

Patent metadata

Field	Value
Publication number	US-10114067-B2
Application number	US-201615016151-A
Country	US
Kind code	B2
Filing date	Feb 4, 2016
Priority date	Feb 4, 2016
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A structure for signal transmission is disclosed. The structure comprises a first plurality of waveguides tightly disposed together and disposed substantially in parallel with each other, each of said waveguides having a first opening and a second opening, wherein each first opening is operable to align with a patch antenna, and wherein the first plurality of waveguides is disposed adjacent to a socket. The integrated structure further comprises the socket which comprises an opening operable to support an insertion of a device under test (DUT), wherein the DUT is communicatively coupled to a plurality of microstrip transmission lines on a printed circuit board (PCB) underlying the socket for transmitting test signals from the DUT, wherein each of the microstrip transmission lines is electrically coupled to a respective patch antenna. Further, the first plurality of waveguides and the socket are integrated into a single plastic or metal structure.

First claim

What is claimed is:

1. A structure for signal transmission, said structure comprising:
a first plurality of waveguides disposed adjacently and substantially in parallel with each other—and wherein the first plurality of waveguides is disposed adjacent to a socket; and
the socket comprising an opening operable to support an insertion of a device under test (DUT), wherein the DUT is communicatively coupled to a plurality of microstrip transmission lines on a printed circuit board (PCB) underlying the socket for transmitting test signals from the DUT, wherein each of the microstrip transmission lines is electrically coupled to a respective patch antenna, and wherein each of the first plurality of waveguides is mounted onto a respective patch antenna, and
wherein the first plurality of waveguides and the socket are integrated together as a common structure.

2. The structure of claim 1 , wherein each of said waveguides comprises a first end and a second end, wherein each first end is mounted to a respective patch antenna, wherein each patch antenna is positioned flush against a top surface of the PCB, and further comprising:
a second plurality of waveguides tightly disposed together and disposed substantially in parallel with each other, wherein the second plurality of waveguides is disposed adjacent to the socket on a side opposite from the first plurality of waveguides, and wherein the first plurality of waveguides, the socket and the second plurality of waveguides are integrated together as a common structure.

3. The structure of claim 2 , wherein first plurality of waveguides, the socket and the second plurality of waveguides are integrated as a single plastic structure.

4. The structure of claim 2 , wherein first plurality of waveguides, the socket and the second plurality of waveguides are integrated as a single metal structure.

5. The structure of claim 2 , wherein the first plurality of waveguides and the second plurality of waveguides each comprise a covering structure for encapsulating a respective plurality of waveguides.

6. The structure of claim 2 , wherein the second end of each waveguide is operable to be coupled to a tester diagnostic system and communicate signals to and from the DUT to the tester diagnostic system.

7. The structure of claim 6 , wherein the second end of each waveguide is operable to be coupled to the tester diagnostic system using a blind mate connection.

8. The structure of claim 1 , wherein the common structure comprising the socket and the first plurality of waveguides are fastened to the PCB using a fastening agent.

9. The structure of claim 1 , wherein the DUT is communicatively coupled to the plurality of microstrip transmission lines on the printed circuit board (PCB) using a ball grid array.

10. A structure for signal transmission, said structure comprising:
a first plurality of waveguides adjacently disposed and disposed substantially in parallel with each other, and wherein the first plurality of waveguides is disposed adjacent to a first side of a socket;
a second plurality of waveguides disposed adjacently and substantially in parallel with each other, wherein the second plurality of waveguides is disposed adjacent to a second side of the socket opposite from the first plurality of waveguides; and
the socket comprising an opening operable to support an insertion of a device under test (DUT), wherein the DUT is communicatively coupled to a plurality of microstrip transmission lines on a printed circuit board (PCB) underlying the socket for transmitting test signals from the DUT,
wherein the first plurality of waveguides, the second plurality of waveguides and the socket are integrated together as a single structure.

11. The structure of claim 10 , wherein first plurality of waveguides, the socket and the second plurality of waveguides are integrated within a single plastic structure.

12. The structure of claim 11 , further comprising a plurality of channels inside the first plurality of waveguides and inside the second plurality of waveguides, said channels are metal-plated.

13. The structure of claim 10 , wherein first plurality of waveguides, the socket and the second plurality of waveguides are integrated within a single metal structure.

14. The structure of claim 10 , wherein the first plurality of waveguides and the second plurality of waveguides each comprise a covering structure for encapsulating a respective plurality of waveguides, wherein each plurality of waveguides and a corresponding covering structure comprise an integrated waveguide structure.

15. The structure of claim 10 , wherein each of said waveguides comprises a first end and a second end, wherein each first end is operable to align with a respective patch antenna, wherein each of the microstrip transmission lines is electrically coupled to a respective patch antenna, and wherein each of the first plurality of waveguides and each of the second plurality of waveguides is mounted to a respective patch antenna positioned flush against the top surface of the PCB, and wherein the second end of each waveguide is operable to be coupled to a tester diagnostic system and communicate signals to and from the DUT to the tester diagnostic system.

16. The structure of claim 15 , wherein the second opening of each waveguide is operable to be coupled to the tester diagnostic system using a docking system.

17. The structure of claim 15 , wherein the single structure comprising the socket, the first plurality of waveguides and the second plurality of waveguides is configured to minimize a length of the microstrip transmission lines from device pads on the DUT to respective patch antennas.

18. The structure of claim 10 , wherein the single structure comprising the socket, the first plurality of waveguides, and the second plurality of waveguides are fastened to the PCB using a fastening agent.

19. The structure of claim 10 , wherein the DUT is communicatively coupled to the plurality of microstrip transmission lines on the printed circuit board (PCB) using a ball grid array.

20. A structure for signal transmission, said structure comprising:
a first plurality of waveguides tightly disposed together and disposed substantially in parallel with each other, and wherein the first plurality of waveguides is disposed adjacent to a first side of a socket;
a second plurality of waveguides tightly disposed together and disposed substantially in parallel with each other, wherein the second plurality of waveguides is disposed adjacent to a second side of the socket; and
the socket comprising an opening operable to support an insertion of a device under test (DUT), wherein the DUT is communicatively coupled to a plurality of microstrip transmission lines on a printed circuit board (PCB) underlying the socket for transmitting test signals from the DUT,
wherein the first plurality of waveguides, the second plurality of waveguides and the socket are integrated into a single structure.

21. The structure of claim 20 , wherein each of said waveguides comprises a first end and a second end, wherein each first end is mounted to a patch antenna, wherein each of the microstrip transmission lines is electrically coupled to a respective patch antenna, and wherein each of the first plurality of waveguides and each of the second plurality of waveguides can be mounted onto a respective patch antenna, wherein the single structure is configured to minimize a length of the microstrip transmission lines from the DUT to the respective pat

Assignees

• Advantest Corp

Inventors

• Lam Daniel
• Lee Don
• McAleenan Roger
• Miyao Kosuke

Classifications

• G01R31/2834 Primary

  Automated test systems [ATE]; using microprocessors or computers (G01R31/317 takes precedence; ATE for detection of defective computer hardware G06F11/2736) · CPC title

• G01R1/0441

  Details · CPC title

• G01R1/24 Primary

  Transmission-line, e.g. waveguide, measuring sections, e.g. slotted section · CPC title

• H01P3/121

  integrated in a substrate · CPC title

• G01R31/2886

  Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06) · CPC title