Plate bonding method and plate assembly

Patent metadata

Field	Value
Publication number	US-10112255-B2
Application number	US-201515319256-A
Country	US
Kind code	B2
Filing date	Jun 17, 2015
Priority date	Jun 17, 2014
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

The present invention relates to a thin plate bonding method or a thin plate assembly, and more particularly, to a thin plate bonding method which includes coating with a coating material after increasing a surface roughness or increasing a surface roughness through coating with a coating material, and then, conducting diffusion bonding, such that excellent bonding strength is achieved even when the diffusion bonding is performed at low temperature and low pressure, thin plate deformation by thermal stress may be prevented, and high air tightness may be obtained since the coating material fills micro-pores.

First claim

The invention claimed is:

1. A plate bonding method through lamination and bonding of two or more plates, comprising:
a roughness increasing process of increasing a surface roughness of at least one surface of the two or more plates facing each other;
a coating process of uniformly coating microfine ceramic columns on the at least one surface of the two or more plates, wherein the microfine ceramic columns have a diameter of not more than 10 microns; and
a diffusion bonding process of laminating the two or more plates, then bonding the plates under heated and pressurized conditions.

2. The method according to claim 1 , wherein the roughness increasing process is a blasting process of colliding micro-particles toward the at least one surface of the two or more plates.

3. The method according to claim 2 , wherein the micro-particles are made of the same material as that of the two or more plates.

4. The method according to claim 2 , wherein the blasting process is wet blasting or dry blasting.

5. The method according to claim 1 , wherein the roughness increasing process is a peening process of colliding shot toward the at least one surface of the two or more plates.

Assignees

• Korea Inst Energy Res

Inventors

• Park Jong-Soo
• Hwang Kyung-Ran
• Lee Dong-Wook
• Park Ju-Seok
• Lee Chun-Boo
• Lee Sung-Wook
• Oh Duck-Kyu
• Park Jin-Woo
• Jin Min-Ho

Classifications

• B23K20/026 Primary

  with diffusion of soldering material · CPC title

• B23K20/24

  Preliminary treatment · CPC title

• B23K2201/35

  Operations & Transport · mapped topic

• B24C1/10

  for compacting surfaces, e.g. shot-peening (for deforming sheet metal, tubes or profiles B21D31/06; as a metallurgical treatment C21D7/00, C22F1/00) · CPC title

• B23K2201/18

  Operations & Transport · mapped topic