Method for making a circuit board

Patent metadata

Field	Value
Publication number	US-10104771-B1
Application number	US-201715670044-A
Country	US
Kind code	B1
Filing date	Aug 7, 2017
Priority date	Apr 20, 2017
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A method for making a circuit board comprising: providing a silver clad laminate comprising a substrate and two silver foils; forming at least one through hole on the silver clad laminate, the through hole comprises an annular middle wall and two annular edge walls connected to two sides of the annular middle wall; forming an organic conductive film on the annular middle wall; forming a dry film pattern layer on the second area; plating copper to form a copper circuit layer on the first area, and to form a via hole in the through hole; removing the dry film pattern layer; and etching the second area of the silver foil away. The first area changes to a silver circuit layer. The copper circuit layer and the silver circuit layer define a conductive circuit layer. A circuit board made by the method is also provided.

First claim

What is claimed is:

1. A method for making a circuit board comprising:
providing a silver clad laminate, the silver clad laminate comprising a substrate and two silver foils attached to two opposite surfaces of the substrate, each of the two silver foils comprising a first area and a second area;
forming at least one through hole on the silver clad laminate, the through hole comprising an annular side wall, the annular side wall comprising an annular middle wall and two annular edge walls connected to two sides of the annular middle wall, the annular middle wall being a surface of the substrate, each of the two annular edge walls being a surface of a silver foil;
forming an organic conductive film on the annular middle wall;
forming a dry film pattern layer on a surface of the second area away from the substrate to obtain an intermediate product;
plating copper on the intermediate product to form a copper circuit layer on a surface of the first area away from the substrate and to form a via hole in the through hole;
removing the dry film pattern layer from the second area of the silver foil to expose the surface of the second area away from the substrate;
etching the second area of the silver foil away by an etchant and the first area defining to be a silver circuit layer, the silver circuit layer being between the substrate and the copper circuit layer, the copper circuit layer and the silver circuit layer defining a conductive circuit layer.

2. The method of claim 1 , wherein a thickness of the silver foil is about 0.15 μm to about 0.3 μm.

3. The method of claim 1 , wherein forming an organic conductive film on the annular middle wall comprising:
treating the annular middle wall of the through hole with a pore former to form a negatively charged layer on the annular middle wall;
providing an organic solution comprising organic sulfonic acid and an organic monomer;
immersing the annular middle wall into the organic solution;
adding manganese dioxide into the organic solution to form an organic conductive film on the annular middle wall.

4. The method of claim 3 , wherein forming an organic conductive film on the annular middle wall comprising:
treating the annular middle wall of the through hole with a pore former, to form a negatively charged layer on the annular middle wall;
providing an organic solution comprising organic sulfonic acid and an organic monomer;
immersing the annular middle wall into the organic solution;
adding potassium permanganate into the organic solution to form an organic conductive film on the annular middle wall.

5. The method of claim 1 , wherein forming a dry film pattern layer on a surface of the second area away from the substrate comprising:
forming a dry film on a surface of the silver foil away from the substrate and in the through hole;
exposing a portion of the dry film attached on the second area to light to form a dry film pattern layer;
developing to remove the dry film not being exposed to light.

6. The method of claim 1 , wherein the etchant is a mixed solution of ammonium hydroxide, hydrogen peroxide, and methanol, a mixed solution of hydrogen chloride, hydrogen peroxide, and water, or a mixed solution of potassium iodide, iodine, and water.

7. The method of claim 1 , wherein a line width to line spacing of the conductive circuit layer is less than or equal to 10 μm/10 μm.

Assignees

• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co

Inventors

• Ho Ming-Jaan
• Hu xian-qin
• Shen Fu-Yun
• Wei wen-zhu

Classifications

• H05K2201/0329

  Intrinsically conductive polymer [ICP]; Semiconductive polymer · CPC title

• H05K3/425

  characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern · CPC title

• H05K3/1275

  by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing · CPC title

• H05K2201/0355

  Metal foils · CPC title

• H05K3/067

  Etchants · CPC title