Printed wiring board and method for producing printed wiring board

Patent metadata

Field	Value
Publication number	US-9894765-B2
Application number	US-201515311601-A
Country	US
Kind code	B2
Filing date	May 12, 2015
Priority date	May 21, 2014
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.

First claim

The invention claimed is:

1. A printed wiring board comprising:
a base layer containing a fluororesin as a main component; a first conductive layer stacked on one surface of the base layer; a second conductive layer stacked on the other surface of the base layer; and
a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other,
wherein at least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.

2. The printed wiring board according to claim 1 , further comprising a modified layer having a hydrophilic organic functional group in at least a region of the inner circumferential surface of the base layer in the connection hole, the region having the pre-treated surface.

3. The printed wiring board according to claim 1 , wherein the via-hole includes an underlying conductor layer that is in contact with an inner circumferential surface of the connection hole, and a main conductor layer that is in contact with an inner circumferential surface of the underlying conductor layer.

4. The printed wiring board according to claim 1 , wherein a contact angle of the pre-treated surface with respect to pure water is 90° or less.

5. The printed wiring board according to claim 1 , wherein a peel strength between the via-hole and the base layer is 1.0 N/cm or more.

Assignees

• Sumitomo Electric Printed Circuits Inc

Inventors

• Miura Kousuke
• KIYA Satoshi
• Uehara Sumito

Classifications

• H05K1/0313

  Organic insulating material · CPC title

• H05K2201/09509

  Blind vias, i.e. vias having one side closed · CPC title

• H05K3/4661

  Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387) · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K3/4611

  by laminating two or more circuit boards (H05K3/4652 takes precedence) · CPC title