Wiring body, wiring board, touch sensor, and method for producing wiring body

Patent metadata

Field	Value
Publication number	US-9910552-B2
Application number	US-201615508882-A
Country	US
Kind code	B2
Filing date	Feb 1, 2016
Priority date	Feb 6, 2015
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H 1 −H 2 |<T 1 /3 where H 1 is a maximum height of the second conductor wire in a first region corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, H 2 is a minimum height of the second conductor wire in a second region that is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and T 1 is a thickness of the first conductor wire in the first predetermined sectional surface.

First claim

The invention claimed is:

1. A wiring body, comprising:
a first conductor layer including a first conductor wire;
a resin layer covering the first conductor layer; and
a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire, wherein
the following Formula (1) is satisfied:
| H 1 −H 2 |<T 1 /3  (1)

in the Formula (1), H 1 is a maximum height of the second conductor wire in a first region corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, H 2 is a minimum height of the second conductor wire in a second region which is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and T 1 is a thickness of the first conductor wire in the first predetermined sectional surface.

2. The wiring body according to claim 1 , wherein
the following Formula (2) is further satisfied:
| H 3 −H 4 |<T 2 /3  (2)

in the Formula (2), H 3 is a maximum height of the resin layer in a third region corresponding to the first conductor wire in a second predetermined sectional surface of the wiring body crossing the resin layer which is exposed from the second conductor layer, H 4 is a minimum height of the resin layer in a fourth region which is adjacent to the third region and has the same width as that of the third region in the second predetermined sectional surface, and T 2 is a thickness of the first conductor wire in the second predetermined sectional surface.

3. The wiring body according to claim 1 , wherein a distance between the first conductor layer and the second conductor layer is 1 time to 20 times the thickness of the first conductor layer.

4. The wiring body according to claim 1 , wherein the first conductor wire has a tapered shape which narrows towards the second conductor layer side.

5. The wiring body according to claim 1 , wherein the second conductor wire has a tapered shape which narrows towards a side separated from the first conductor layer.

6. The wiring body according to claim 1 , wherein a surface roughness of a surface on a side opposite to a first facing surface facing the second conductor wire is rougher than a surface roughness of the first facing surface in the first conductor wire.

7. The wiring body according to claim 1 , wherein a surface roughness of a second facing surface facing the first conductor wire is rougher than a surface roughness of a surface on a side opposite to the second facing surface in the second conductor wire.

8. The wiring body according to claim 1 , wherein the resin layer includes a protrusion protruding towards the second conductor layer, and the second conductor wire is disposed on the protrusion.

9. A wiring board comprising:
the wiring body according to claim 1 ; and
a support that supports the wiring body.

10. A touch sensor, comprising:
the wiring board according to claim 9 .

11. A method for producing a wiring body comprising:
a first process of filling a recessed portion of a first intaglio with a first conductive material, and of performing heating, drying, or irradiating with an energy ray with respect to the first conductive material;
a second process of disposing a first resin on the first conductive material;
a third process of preparing an intermediate obtained by releasing the first resin and the first conductive material from the first intaglio;
a fourth process of filling a recessed portion of a second intaglio with a second conductive material, and of performing heating, drying, or irradiating with an energy ray with respect to the second conductive material;
a fifth process of coating a surface of the intermediate on which the first resin is disposed with a second resin;
a sixth process of disposing the second resin and the intermediate on the second conductive material such that the second resin is in contact with the second conductive material; and
a seventh process of releasing the intermediate, the second resin, and the second conductive material from the second intaglio, wherein
the first conductive material includes a first linear portion,
the second conductive material includes a second linear portion, and
a relationship in a maximum height of the second linear portion, a minimum height of the second linear portion, and a thickness of the first linear portion satisfies the following Formula (3):
| H 5 −H 6 |<T 3 /3  (3)

in the Formula (3), H 5 is a maximum height of the second linear portion in a fifth region corresponding to the first linear portion in a third predetermined sectional surface crossing the wiring body along the second linear portion, H 6 is a minimum height of the second linear portion in a sixth region which is adjacent to the fifth region and has the same width as that of the fifth region in the third predetermined sectional surface, and T 3 is a thickness of the first linear portion in the third predetermined sectional surface.

Assignees

• Fujikura Ltd

Inventors

• Shiojiri Takeshi
• Hondo Takaharu

Classifications

• H05K2201/09045

  Locally raised area or protrusion of insulating substrate · CPC title

• H05K1/0313

  Organic insulating material · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F3/044 Primary

  by capacitive means · CPC title