Resist composition and method of forming resist pattern

US10101658B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10101658-B2
Application numberUS-201614995987-A
CountryUS
Kind codeB2
Filing dateJan 14, 2016
Priority dateJan 16, 2015
Publication dateOct 16, 2018
Grant dateOct 16, 2018

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid and an acid generator (B) which generates acid upon exposure, the base component (A) including a resin component having a structural unit (a0) represented by general formula (a0-1) shown below, and the acid generator component (B) containing a compound having a cation moiety having an electron withdrawing group (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya represents a carbon atom; Xa represents an atomic group required to form an alicyclic hydrocarbon group with Ya; and Ra 01 represents an aromatic hydrocarbon group optionally having a substituent).

First claim

Opening claim text (preview).

What is claimed is: 1. A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition comprising a base component (A) which exhibits changed solubility in a developing solution under action of acid and an acid generator (B) which generates acid upon exposure, the base component (A) comprising a resin component comprising a structural unit (a0) represented by general formula (a0-1) shown below, and the acid generator component (B) comprising a compound represented by general formula (b-1), (b-2) or (b-3), having a cation moiety having an electron withdrawing group: wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya represents a carbon atom; Xa represents an atomic group required to form an alicyclic hydrocarbon group with Ya; and Ra 01 represents an aromatic hydrocarbon group optionally having a substituent, wherein, R 101 and R 104 to R 108 each independently represents a cyclic group which may have a substituent, a chain-like alkyl group which may have a substituent or a chain-like alkenyl group which may have a substituent, provided that R 104 and R 105 may be mutually bonded to form a ring; R 106 and R 107 may be mutually bonded to form a ring; R 102 represents a fluorine atom or a fluorinated alkyl group of 1 to 5 carbon atoms; Y 101 represents a divalent linking group containing an oxygen atom; V 101 to V 103 each independently represents a single bond, an alkylene group or a fluorinated alkylene group; L 101 and L 102 each independently represents a single bond or an oxygen atom; L 103 to L 105 each independently represents a single bond, —CO— or —SO 2 —; and M′ m+ represents an organic cation having a valency of m and a cation moiety having an electron withdrawing group, wherein the cation moiety having an electron withdrawing group is represented by formula (ca-1), (ca-1-1), (ca-3) or (ca-4): in formula (ca-1), R 202 and R 203 each independently represents an aryl group, alkyl group or alkenyl group which may have a substituent, and are mutually bonded directly or via a hetero atom, an oxygen atom or a nitrogen atom, a carbonyl group, —SO—, —SO 2 —, —SO 3 —, —COO—, —CONH— or —N(R N )—, wherein R N represents an alkyl group of 1 to 5 carbon atoms, to form a ring with the sulfur atom, R 201 represents an optionally substituted aryl group having a halogenated alkyl group as an electron withdrawing group, in formula (ca-1-1), Rb 01 represents a halogenated alkyl group being an electron withdrawing group, Rb 02 represents an alkyl group of 1 to 5 carbon atoms, a plurality of Rb 01 and Rb 02 may be the same or different from each other, n2 represents an integer of 0 to 4, n1 represents an integer of 0 to 4; provided that at least one of n1 represents an integer of 1 to 4, in formula (ca-3), R 206 and R 207 each independently represents an aryl group, alkyl group or alkenyl group which may have a substituent, R 210 represents an aryl group which may have a substituent, an alkyl group which may have a substituent, an alkenyl group which may have a substituent or an —SO 2 — containing cyclic group which may have a substituent, R 208 and R 209 each independently represents a hydrogen atom or an alkyl group of 1 to 5 carbon atoms, and L 201 represents —C(═O)— or —C(═O)—O—, in formula (ca-4), R 211 and R 212 each independently represents an aryl group, alkyl group or alkenyl group which may have a substituent, at least one of R 211 and R 212 has an electron withdrawing group, each Y 201 independently represents an arylene group, an alkylene group, or an alkenylene group, x represents 1 or 2, and W 201 represents a linking group having a valency of (x+1). 2. The resist composition according to claim 1 , wherein the resin component comprises a polymeric compound (A1) comprising the structural unit (a0) and a polymeric compound (A2) comprising a structural unit (a9) represented by general formula (a9-1) shown below: wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya 91 represents a single bond or a divalent linking group; R 91 represents a hydrocarbon group optionally having a substituent; and Ya 92 represents a divalent linking group. 3. The resist composition according to claim 2 , wherein the polymeric compound (A1) further comprises a structural unit derived from hydroxystyrene or a hydroxystyrene derivative. 4. A method of forming a resist pattern, comprising: forming a resist film on a substrate using the resist composition according to claim 1 ; exposing the resist film; and developing the resist film to form a resist pattern. 5. A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition comprising a base component (A′) which exhibits changed solubility in a developing solution under action of acid and an acid diffusion control agent (D′), the base component (A′) comprising a resin component comprising a structural unit (a0) represented by general formula (a0-1) shown below and a structural unit (a2′) derived from an acrylate ester monomer having a log P value of 0.7 or less, and the acid diffusion control agent (D′) has an acid dissociation constant of 1.5 or more: wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Ya represents a carbon atom; Xa represents an atomic group required to form an alicyclic hydrocarbon group with Ya; and Ra 01 represents an aromatic hydrocarbon group optionally having a substituent, wherein the acid diffusion control agent (D′) is at least one selected from the group consisting of a compound represented by general formula (d1-1), a compound represented by general formula (d1-2) and a compound represented by general formula (d1-3): wherein Rd 1 to Rd 4 represent a cyclic group which may have a substituent, a chain-like alkyl group which may have a substituent or a chain-like alkenyl group which may have a substituent, provided that, the carbon atom adjacent to the sulfur atom within the Rd 2 in the formula (d1-2) has no fluorine atom bonded thereto; Yd′ represents a single bond or a divalent linking group; and M m+ each independently represents a cation having a valency of m represented by general formulas (ca-1) to (ca-4), wherein R 201 to R 203 each independently represents an aryl group, alkyl group or alkenyl group which may have a substituent, and at least one of R 201 to R 203 has an electron withdrawing group

Assignees

Inventors

Classifications

  • Non-aqueous compositions · CPC title

  • Aqueous alkaline compositions · CPC title

  • in the presence of a fluid, e.g. immersion; using fluid cooling means · CPC title

  • G03F7/0397Primary

    the macromolecular compound having an alicyclic moiety in a side chain · CPC title

  • with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

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What does patent US10101658B2 cover?
A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid and an acid generator (B) which generates acid upon exposure, the base component (A) including a resin component having a struct…
Who is the assignee on this patent?
Tokyo Ohka Kogyo Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/0397. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).