Aluminum chelate-based latent curing agent, method of producing same, and thermosetting epoxy resin

Patent metadata

Field	Value
Publication number	US-10093769-B2
Application number	US-201515509025-A
Country	US
Kind code	B2
Filing date	Aug 31, 2015
Priority date	Sep 9, 2014
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

An aluminum chelate-based latent curing agent for curing a thermosetting epoxy resin, in which an aluminum chelate-based curing agent is held in a porous resin obtained by, at the same time, subjecting a polyfunctional isocyanate compound to interfacial polymerization and subjecting a radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator, and the surface of the aluminum chelate-based latent curing agent has been subjected to inactivation treatment with an alkoxysilane coupling agent. An alkylalkoxysilane is preferred as the alkoxysilane coupling agent. The radical polymerizable compound preferably contains a polyfunctional radical polymerizable compound.

First claim

The invention claimed is:

1. An aluminum chelate-based latent curing agent for curing a thermosetting epoxy resin,
an aluminum chelate-based curing agent being held in a porous resin obtained by, at the same time, subjecting a polyfunctional isocyanate compound to interfacial polymerization and subjecting a radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator, and
a surface of the aluminum chelate-based latent curing agent having been subjected to inactivation treatment with an alkoxysilane coupling agent.

2. The aluminum chelate-based latent curing agent according to claim 1 , wherein the alkoxysilane coupling agent is an alkylalkoxysilane.

3. The aluminum chelate-based latent curing agent according to claim 2 , wherein the alkylalkoxysilane is methyltrimethoxysilane, n-propyltrimethoxysilane, or hexyltrimethoxysilane.

4. The aluminum chelate-based latent curing agent according to claim 1 , wherein the alkoxysilane coupling agent is an epoxyalkoxysilane.

5. The aluminum chelate-based latent curing agent according to claim 4 , wherein the epoxyalkoxysilane is 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane or 3-glycidoxypropyltrimethoxysilane.

6. The aluminum chelate-based latent curing agent according to claim 1 , wherein the radical polymerizable compound contains a polyfunctional radical polymerizable compound.

7. The aluminum chelate-based latent curing agent according to claim 6 , wherein the radical polymerizable compound contains not less than 50 mass % of the polyfunctional radical polymerizable compound.

8. The aluminum chelate-based latent curing agent according to claim 6 , wherein the polyfunctional radical polymerizable compound is a polyfunctional vinyl-based compound.

9. The aluminum chelate-based latent curing agent according to claim 8 , wherein the polyfunctional vinyl-based compound is divinylbenzene.

10. The aluminum chelate-based latent curing agent according to claim 6 , wherein the polyfunctional radical polymerizable compound further contains a polyfunctional (meth)acrylate-based compound.

11. The aluminum chelate-based latent curing agent according to claim 1 , wherein a content of the aluminum chelate-based curing agent is from 10 to 200 parts by mass per 100 parts by mass total of the polyfunctional isocyanate compound and the radical polymerizable compound.

12. A method of producing the aluminum chelate-based latent curing agent described in claim 1 , the method comprising:
obtaining an oil phase by dissolving or dispersing an aluminum chelate-based curing agent, a polyfunctional isocyanate compound, a radical polymerizable compound, and a radical polymerization initiator in a volatile organic solvent;
subjecting a polyfunctional isocyanate compound to interfacial polymerization and subjecting a radical polymerizable compound to a radical polymerization reaction at the same time by adding the obtained oil phase to an aqueous phase containing a dispersing agent while heating and stirring; and
after an aluminum chelate-based curing agent is held in a porous resin obtained thereby, subjecting a surface of the aluminum chelate-based latent curing agent to inactivation treatment with an alkoxysilane coupling agent by immersing the aluminum chelate-based latent curing agent into a solution in which an alkoxysilane coupling agent is dissolved in an organic solvent.

13. A thermosetting epoxy resin composition comprising the aluminum chelate-based latent curing agent described in claim 1 , an epoxy resin, and a silane-based compound.

14. The thermosetting epoxy resin composition according to claim 13 , wherein the silane-based compound is triphenylsilanol.

Assignees

• Dexerials Corp

Inventors

• Kamiya Kazunobu

Classifications

• C08G59/188

  using encapsulated compounds · CPC title

• C08G59/70 Primary

  Chelates · CPC title

• C08K5/5415

  containing at least one Si—O bond · CPC title

• C08G59/245

  aromatic · CPC title

• C08G59/40

  characterised by the curing agents used · CPC title