Adhesive composition

Patent metadata

Field	Value
Publication number	US-10174225-B2
Application number	US-201615579050-A
Country	US
Kind code	B2
Filing date	Jun 1, 2016
Priority date	Jun 2, 2015
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

An adhesive composition, capable of achieving excellent life performance and a wide margin for mounting, includes a cationic polymerizable compound, an aluminum chelate/silanol-based curing catalyst, and a nucleophilic compound containing a sulfur atom having an unshared electron pair. The nucleophilic compound is a thiol compound or an episulfide compound. The aluminum chelate/silanol-based curing catalyst includes an aluminum chelate curing agent, and a silanol compound or a silane coupling agent. The aluminum chelate curing agent constitutes a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.

First claim

The invention claimed is:

1. An adhesive composition comprising:
a cationic polymerizable compound;
an aluminum chelate/silanol-based curing catalyst; and
a nucleophilic compound containing a sulfur atom having an unshared electron pair, wherein
the nucleophilic compound has two or more thiol groups per molecule.

2. The adhesive composition according to claim 1 , wherein
the aluminum chelate/silanol-based curing catalyst includes an aluminum chelate curing agent and a silanol compound, and
the aluminum chelate curing agent and the silanol compound constitute a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.

3. The adhesive composition according to claim 1 , wherein
the aluminum chelate/silanol-based curing catalyst includes an aluminum chelate curing agent and a silane coupling agent, and
the aluminum chelate curing agent is a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.

4. The adhesive composition according to claim 1 , wherein
the cation polymerizable compound includes an alicyclic epoxy compound or a hydrogenated epoxy compound, and
the adhesive composition further comprises an acrylic resin obtained by polymerization of 0.5 to 10 wt % of acrylic acid and 0.5 to 10 wt % of an acrylic acid ester having a hydroxyl group and having a weight-average molecular weight of 50,000 to 900,000.

5. The adhesive composition according to claim 1 , wherein a reaction peak temperature at a temperature rising rate of 10° C./min measured by a differential scanning calorimeter is higher than a reaction start temperature by 50° C. or more.

6. The adhesive composition according to claim 1 , further comprising conductive particles obtained by forming a metal layer on surfaces of resin particles and solder particles having an average particle diameter smaller than that of the conductive particles.

7. A light emitting device comprising:
a substrate having a wiring pattern;
an anisotropic conductive film formed on an electrode of the wiring pattern; and
a light emitting element mounted on the anisotropic conductive film, wherein
the anisotropic conductive film is a cured product of an anisotropic conductive adhesive including a cationic polymerizable compound, an aluminum chelate/silanol-based curing catalyst, and a nucleophilic compound containing a sulfur atom having an unshared electron pair.

8. The light emitting device according to claim 7 , wherein the wiring pattern of the substrate is formed from aluminum.

9. An adhesive composition comprising:
a cationic polymerizable compound;
an aluminum chelate/silanol-based curing catalyst; and
a nucleophilic compound containing a sulfur atom having an unshared electron pair, wherein
the nucleophilic compound is a mercaptoalkanoate.

10. An adhesive composition comprising:
a cationic polymerizable compound;
an aluminum chelate/silanol-based curing catalyst; and
a nucleophilic compound containing a sulfur atom having an unshared electron pair, wherein
the nucleophilic compound is an episulfide compound.

11. The adhesive composition according to claim 10 , wherein the episulfide compound has two or more episulfide groups per molecule.

Assignees

• Dexerials Corp

Inventors

• Aoki Masaharu
• Namiki Hidetsugu

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• C08G59/66

  Mercaptans · CPC title

• C09J201/02

  characterised by the presence of specified groups {, e.g. terminal or pendant functional groups} · CPC title

• C09J181/04

  Polysulfides · CPC title