Adhesive agent and connection structure

Patent metadata

Field	Value
Publication number	US-10435601-B2
Application number	US-201515301836-A
Country	US
Kind code	B2
Filing date	May 22, 2015
Priority date	May 23, 2014
Publication date	Oct 8, 2019
Grant date	Oct 8, 2019

Abstract

An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.

First claim

The invention claimed is:

1. An adhesive agent for bonding a heat-generating electronic component and a substrate comprising:
an alicyclic epoxy compound or a hydrogenated epoxy compound, a cationic catalyst, an acrylic resin having a weight-average molecular weight of 50,000 to 900,000 and solder particles,
wherein the acrylic resin contains an acrylic acid at 0.5 to 10 wt % and an acrylic acid ester having a hydroxyl group at 0.5 to 10 wt %, and
the acrylic resin is contained at 1 to 5 pts. mass with respect to 100 pts. mass of the epoxy compound.

2. The adhesive agent according to claim 1 , wherein the solder particles are blended at an amount of 30 or more to less than 150 pts. mass with respect to 100 pts. mass of the epoxy compound.

3. The adhesive agent according to claim 2 , wherein the solder particles have an average particle diameter of 3 or more to less than 30 μm.

4. The adhesive agent according to claim 2 , wherein the acrylic acid ester having a hydroxyl group is one or more substances selected from the group consisting of 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate.

5. The adhesive agent according to claim 2 , wherein the acrylic resin contains butyl acrylate, ethyl acrylate and acrylonitrile.

6. The adhesive agent according to claim 2 , wherein the cationic catalyst is an aluminum chelate-type latent curing agent.

7. The adhesive agent according to claim 2 , further comprising conductive particles.

8. The adhesive agent according to claim 1 , wherein the solder particles have an average particle diameter of 3 or more to less than 30 μm.

9. The adhesive agent according to claim 1 , wherein the acrylic acid ester having a hydroxyl group is one or more substances selected from the group consisting of 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate.

10. The adhesive agent according to claim 1 , wherein the acrylic resin contains butyl acrylate, ethyl acrylate and acrylonitrile.

11. The adhesive agent according to claim 1 , wherein the cationic catalyst is an aluminum chelate-type latent curing agent.

12. The adhesive agent according to claim 1 , further comprising conductive particles.

13. The adhesive agent according to claim 1 , wherein the solder particles are blended at an amount of 50 or more to less than 150 pts. mass with respect to 100 pts. mass of the epoxy compound.

14. A connection structure comprising:
a substrate having a wiring pattern;
an anisotropic conductive film formed on electrodes of the wiring pattern; and
a heat-generating electronic component mounted on the anisotropic conductive film;
wherein the anisotropic conductive film contains an epoxy compound, a resin binder and solder particles, and the solder particles are metal-bonded to terminal portions of the electronic component,
the resin binder contains an acrylic resin having a weight-average molecular weight of 50,000 to 900,000,
acrylic resin contains an acrylic acid at 0.5 to 10 wt % and an acrylic acid ester having a hydroxyl group at 0.5 to 10 wt %, and
the acrylic resin is contained at 1 to 5 pts. mass with respect to 100 pts. mass of the epoxy compound.

15. An adhesive agent comprising:
an epoxy compound, a cationic catalyst, an acrylic resin having a weight-average molecular weight of 50,000 to 900,000 and solder particles;
wherein the acrylic resin contains an acrylic acid at 0.5 to 10 wt % and an acrylic acid ester having a hydroxyl group at 0.5 to 10 wt %, and
wherein the acrylic resin is contained at 1 to 5 pts. mass with respect to 100 pts. mass of the epoxy compound.

16. The adhesive agent according to claim 15 , wherein the solder particles have a blending amount of 30 or more to less than 150 pts. mass with respect to 100 pts. mass of the epoxy compound.

17. The adhesive agent according to claim 16 , wherein the acrylic acid ester having a hydroxyl group is one or more substances selected from the group consisting of 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate.

18. The adhesive agent according to claim 16 , wherein the acrylic resin contains butyl acrylate, ethyl acrylate and acrylonitrile.

19. The adhesive agent according to claim 16 , wherein the cationic catalyst is an aluminum chelate-type latent curing agent.

20. The adhesive agent according to claim 16 , further comprising conductive particles.

21. The adhesive agent according to claim 15 , wherein the solder particles have an average particle diameter of 3 or more to less than 30 μm.

22. The adhesive agent according to claim 21 , wherein the acrylic acid ester having a hydroxyl group is one or more substances selected from the group consisting of 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate.

23. The adhesive agent according to claim 21 , wherein the acrylic resin contains butyl acrylate, ethyl acrylate and acrylonitrile.

24. The adhesive agent according to claim 21 , wherein the cationic catalyst is an aluminum chelate-type latent curing agent.

25. The adhesive agent according to claim 21 , further comprising conductive particles.

26. The adhesive agent according to claim 15 , wherein the acrylic acid ester having a hydroxyl group is one or more substances selected from the group consisting of 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate.

27. The adhesive agent according to claim 15 , wherein the acrylic resin contains butyl acrylate, ethyl acrylate and acrylonitrile.

28. The adhesive agent according to claim 15 , wherein the cationic catalyst is an aluminum chelate-type latent curing agent.

29. The adhesive agent according to claim 15 , further comprising conductive particles.

30. The adhesive agent according to claim 29 , wherein the solder particles have an average particle diameter which is more than an average particle diameter of the conductive particles.

31. The adhesive agent according to claim 15 , wherein the solder particles have a melting point of 180° C. or less.

32. A connection structure comprising:
a substrate having a wiring pattern which has an oxide formed on a surface thereof;
an anisotropic conductive film formed on electrodes of the wiring pattern; and
an electronic component mounted on the anisotropic conductive film;
wherein the anisotropic conductive film is a cured product of an anisotropic conductive adhesive containing an epoxy compound, a cationic catalyst, an acrylic resin having a weight-average molecular weight of 50,000 to 900,000, conductive particles and solder particles, the acrylic resin containing an acrylic acid at 0.5 to 10 wt %, an acrylic acid ester having a hydroxyl group at 0.5 to 10 wt % and the acrylic resin is contained at 1 to 5 pts. mass with respect to 100 pts. mass of the epoxy compound.

Assignees

• Dexerials Corp

Inventors

• Aoki Masaharu
• Kanisawa Shiyuki
• Namiki Hidetsugu
• Ishigami Akira

Classifications

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• C09J11/04 Primary

  inorganic · CPC title

• H01R11/01

  characterised by the form or arrangement of the conductive interconnection between the connecting locations · CPC title

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C09J133/00

  Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers · CPC title