CMOS-MEMS-CMOS platform

Patent metadata

Field	Value
Publication number	US-10093533-B2
Application number	US-201715711890-A
Country	US
Kind code	B2
Filing date	Sep 21, 2017
Priority date	Jun 12, 2015
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

A sensor chip includes a first substrate with a first surface and a second surface including at least one CMOS circuit, a first MEMS substrate with a first surface and a second surface on opposing sides of the first MEMS substrate, a second substrate, a second MEMS substrate, and a third substrate including at least one CMOS circuit. The first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the first MEMS substrate. The second surface of the first MEMS substrate is attached to the second substrate. The first substrate, the first MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects.

First claim

What is claimed is:

1. A sensor chip comprising:
a first substrate with a first surface and a second surface comprising at least one CMOS circuit;
a first MEMS substrate with a first surface and a second surface, wherein the first surface and the second surface of the first MEMS substrate are on opposing sides of the first MEMS substrate;
a second substrate;
a second MEMS substrate; and
a third substrate comprising at least one CMOS circuit;
wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the first MEMS substrate; and
wherein the second surface of the first MEMS substrate is attached to the second substrate; and
wherein the first substrate, the first MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects.

2. The sensor chip of claim 1 , wherein the second substrate comprises at least one CMOS circuit.

3. The sensor chip of claim 1 , wherein the second substrate comprises a cap layer for the first MEMS substrate and the second MEMS substrate.

4. The sensor chip of claim 1 , wherein the second MEMS substrate is connected to the second substrate by a eutectic or a fusion bond.

5. The sensor chip of claim 1 , wherein the second MEMS substrate is connected to the third substrate by a eutectic or a fusion bond.

6. The sensor chip of claim 1 , wherein the first MEMS substrate and the second MEMS substrate are of different thickness.

7. The sensor chip of claim 1 , wherein the second MEMS substrate further comprises any of a blank substrate, a patterned non-active silicon substrate, a substrate containing a MEMS structure and a combination thereof.

8. The sensor chip of claim 1 , wherein the first MEMS substrate comprises a first etched cavity and the second MEMS substrate comprises a second etched cavity to form standoffs, wherein the standoffs define a first vertical gap formed by the first etched cavity between the first MEMS substrate and the first substrate and a second vertical gap formed by the second etched cavity between the second MEMS substrate and the second substrate.

9. The sensor chip of claim 8 , wherein the first vertical gap is different from the second vertical gap.

10. The sensor chip of claim 1 , wherein the first MEMS substrate comprises at least one MEMS structure.

11. The sensor chip of claim 10 , wherein the MEMS structure comprises any of a gyroscope, an accelerometer, a resonator, a magnetometer or a combination thereof.

12. The sensor chip of claim 1 , wherein the second MEMS substrate comprises at least one MEMS structure.

13. A sensor chip comprising:
a first substrate with a first surface and a second surface comprising at least one CMOS circuit;
a MEMS substrate with a first surface and a second surface, wherein the MEMS substrate comprises at least one MEMS structure, and wherein the first surface and the second surface of the first MEMS substrate are on opposing sides of the first MEMS substrate; and
a second substrate comprising a cap layer;
wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate; and
wherein the second surface of the MEMS substrate is attached to the second substrate;
wherein the first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical interconnects; and
wherein the MEMS structure is enclosed within the first and the second substrates, wherein the second substrate forms an enclosure for the at least one MEMS structure.

14. The sensor chip of claim 13 , wherein the at least one MEMS structure comprises any of a gyroscope, an accelerometer, a resonator, a magnetometer or a combination thereof.

15. The sensor chip of claim 13 , wherein the second substrate comprises at least one CMOS circuit.

16. The sensor chip of claim 15 , wherein the second substrate comprising at least one CMOS circuit further comprises at least one sensor, wherein the at least one sensor comprises any of a magnetometer, a temperature sensor, a gas sensor, a pressure sensor, a humidity sensor, an Infra-Red radiation sensor, an acoustic sensor, a proximity sensor, an ambient light sensor or a combination thereof.

17. The sensor chip of claim 13 , wherein the cap layer further comprises at least one etched cavity.

18. A sensor chip comprising:
a first substrate with a first surface and a second surface comprising at least one CMOS circuit, the first substrate comprising a first recess in the second surface of the first substrate;
a MEMS substrate with a first surface and a second surface, wherein the first surface and the second surface of the first MEMS substrate are on opposing sides of the first MEMS substrate; and
a second substrate comprising at least one CMOS circuit;
wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate;
wherein the second surface of the MEMS substrate is attached to the second substrate; and
wherein the first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical interconnects.

19. The sensor chip of claim 18 , wherein the second substrate comprises a recess on a surface attached to the MEMS substrate.

20. The sensor chip of claim 18 , wherein the MEMS substrate further comprises at least one MEMS structure, wherein the MEMS structure comprises any of a gyroscope, an accelerometer, a resonator, a magnetometer or a combination thereof.

Assignees

• Invensense Inc

Inventors

• Smeys Peter
• Lim Martin

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/752

  between stacked chips · CPC title

• B81B2201/0242

  Gyroscopes · CPC title

• B81B2201/0278

  Temperature sensors · CPC title

• B81B2201/0235

  Accelerometers · CPC title