Packaging system and process for inertial sensor modules using moving-gate transducers

Patent metadata

Field	Value
Publication number	US-9400288-B2
Application number	US-201314094450-A
Country	US
Kind code	B2
Filing date	Dec 2, 2013
Priority date	Dec 5, 2012
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

A sensor device includes a first CMOS chip and a second CMOS chip with a first moving-gate transducer formed in the first CMOS chip for implementing a first 3-axis inertial sensor and a second moving-gate transducer formed in the second CMOS chip for implementing a second 3-axis inertial sensor. An ASIC for evaluating the outputs of the first 3-axis inertial sensor and the second 3-axis inertial sensor is distributed between the first CMOS chip and the second CMOS chip.

First claim

What is claimed is:

1. A sensor device comprising:
a first complementary metal-oxide semiconductor (CMOS) chip having a first mounting side and including first bonding structures and first chip-to-chip electrical contacts on the first mounting side;
a second CMOS chip having a second mounting side arranged facing the first mounting side and including second bonding structures and second chip-to-chip electrical contacts on the second facing side, the second bonding structures being bonded to the first bonding structures and the second chip-to-chip contacts being electrically connected to the first chip-to-chip contacts;
a first moving-gate transducer formed in the first CMOS chip, the first moving-gate transducer implementing a first 3-axis inertial sensor;
a second moving-gate transducer formed in the second CMOS chip, the second moving-gate transducer implementing a second 3-axis inertial sensor;
a sensor application-specific integrated circuit (ASIC) operably coupled to receive and evaluate outputs of the first 3-axis inertial sensor and the second 3-axis inertial sensor, the sensor ASIC including a first ASIC portion formed in the first CMOS chip and a second ASIC portion formed in the second CMOS chip, the first and the second ASIC portions being coupled via the first and the second chip-to-chip contacts.

2. The device of claim 1 , wherein the sensor ASIC includes a first inertial sensor ASIC for evaluating output of the first 3-axis inertial sensor, a second 3-axis inertial sensor ASIC for evaluating output of the second inertial sensor, and a combined sensor ASIC for evaluating the output of the first 3-axis inertial sensor and the second 3-axis inertial sensor with respect to each other.

3. The device of claim 2 , wherein the first 3-axis inertial sensor and the second 3-axis inertial sensor each comprise one of a 3-axis MEMS accelerometer and a 3-axis MEMS gyroscope.

4. The device of claim 3 , further comprising:
a third 3-axis inertial sensor formed in either the first CMOS chip or the second CMOS chip, and
wherein the sensor ASIC includes a third inertial sensor ASIC for evaluating output of the third 3-axis inertial sensor.

5. The device of claim 4 , wherein the third 3-axis inertial sensor comprises a magnetic field sensor.

6. The device of claim 5 , wherein the magnetic field sensor is implemented using 3-axis Hall effect sensor.

7. The device of claim 6 , wherein the first CMOS chip and the second CMOS chip are bonded together to form a package having a footprint size that is 2 mm by 2 mm or less.

8. The device of claim 7 , wherein the package has a height of 0.8 mm or less.

9. A method of fabricating an inertial sensor module, the method comprising:
fabricating a first CMOS chip with first bonding structures and first chip-to-chip contacts and at least one ASIC block;
fabricating a second CMOS chip second bonding structures and second chip-to-chip electrical contacts and at least one ASIC block;
forming a first moving-gate transducer in one of the first CMOS chip and the second CMOS chip, the first moving-gate transducer being configured to implement a first 3-axis inertial sensor;
forming a second moving-gate transducer in one of the first CMOS chip and the second CMOS chip, the second moving-gate transducer being configured to implement a second 3-axis inertial sensor; and
wherein an ASIC for evaluating signals produced by the first and the second 3-axis inertial sensors is distributed between the at least one ASIC block of the first CMOS chip and the at least one ASIC block of the second CMOS chip.

10. The method of claim 9 , further comprising:
forming a first inertial sensor ASIC in at least one of the at least one ASIC block of the first CMOS chip and the at least one ASIC block of the second CMOS chip, the first inertial sensor ASIC for evaluating output of the first 3-axis inertial sensor;
forming a second inertial sensor ASIC in at least one of the at least one ASIC block of the first CMOS chip and the at least one ASIC block of the second CMOS chip, the second inertial sensor ASIC for evaluating output of the second 3-axis inertial; and
forming an overall sensor ASIC in at least one of the at least one ASIC block of the first CMOS chip and the at least one ASIC block of the second CMOS chip for evaluating outputs of the first 3-axis inertial sensor and the second 3-axis inertial sensor with respect to each other.

11. The method of claim 9 , wherein the first 3-axis inertial sensor and the second 3-axis inertial sensor each comprise one of a 3-axis MEMS accelerometer and a 3-axis MEMS gyroscope.

12. The method of claim 9 , further comprising:
forming a third 3-axis inertial sensor in one of the first CMOS chip and the second CMOS chip; and
forming a third inertial sensor ASIC in one of the first ASIC portion and the second ASIC portion for evaluating output of the third 3-axis inertial sensor.

13. The method of claim 12 , wherein the third 3-axis inertial sensor comprises a magnetic field sensor.

14. The method of claim 13 , wherein the magnetic field sensor is implemented using 3-axis Hall effect sensor.

15. The method of claim 14 , further comprising:
bonding the first CMOS chip and the second CMOS chip together to form a package.

16. The method of claim 15 , wherein the bonding structures of the first CMOS chip and the second CMOS chip being bonded together to form a bond frame.

17. The method of claim 16 , wherein the first CMOS chip and the second CMOS chip via the chip-to-chip contacts of the first and second CMOS chips.

18. The method of claim 17 , wherein the package has a footprint size that is 2 mm by 2 mm or less.

19. The method of claim 17 , wherein the package has a height of 0.8 mm or less.

20. The method of claim 17 , further comprising:
forming through-silicon-vias that extend through a back side of at least one of the first CMOS chip and the second CMOS chip and include terminals for electrically connecting the first 3-axis inertial sensor, the second 3-axis inertial sensor, the third 3-axis inertial sensor, and the first ASIC, the second ASIC, the third ASIC, and the sensor ASIC to external circuitry.

21. The method of claim 14 , further comprising:
forming a third ASIC block in the first CMOS chip and a fourth ASIC block in the second CMOS chip; and
distributing the first, second, and third inertial sensor ASICS and the overall sensor ASIC between the first, second, third, and fourth ASIC blocks of the first and second CMOS chips.

22. The method of claim 14 , wherein the first moving-gate transducer is formed in the first CMOS chip and the second moving-gate transducer is formed in the second CMOS chip.

23. The method of claim 14 , wherein the first moving-gate transducer, the second moving-gate transducer, and an analog portion (frontend) of the ASIC for signal evaluation are formed in the first CMOS chip, and
wherein a digital portion (backend) of the ASIC for signal evaluation is formed in the second CMOS chip.

24. The method of claim 22 , further comprising:
forming a first cavity in the first CMOS chip for the first moving-gate transducer and a second cavity in the first CMOS chip for the second moving-gate transducer, the first cavity having a first pressure and the second cavity having a second pressure.

25. The method of claim 23 , further comprising:
forming a single cavity in the first CMOS chip for both the first moving-gate transdu

Assignees

• Bosch Gmbh Robert

Inventors

• Feyh Ando
• Chen Po-Jui

Classifications

• B81B2207/015

  the micromechanical device and the control or processing electronics being integrated on the same substrate · CPC title

• G01P15/08 Primary

  with conversion into electric or magnetic values · CPC title

• G01P15/18

  in two or more dimensions · CPC title

• B81B7/02

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title

• G01P15/105

  by magnetically sensitive devices · CPC title