Electrostatic chuck design for cooling-gas light-up prevention

Patent metadata

Field	Value
Publication number	US-10083853-B2
Application number	US-201514887166-A
Country	US
Kind code	B2
Filing date	Oct 19, 2015
Priority date	Oct 19, 2015
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

An Electrostatic Chuck (ESC) in a chamber of a semiconductor manufacturing apparatus is presented for eliminating cooling-gas light-up. One wafer support includes a baseplate connected to a radiofrequency power source, a dielectric block, gas supply channels for cooling the wafer bottom, and first and second electrodes. The dielectric block is situated above the baseplate and supports the wafer when present. The first electrode is embedded in the top half of the dielectric block, where the top surface of the first electrode is substantially parallel to a top surface of the dielectric block, and the first electrode is connected to a DC power source. Further, the second electrode is embedded in a bottom half of the dielectric block, the second electrode being electrically connected to the first electrode, where the bottom surface of the second electrode is substantially parallel to a top surface of the baseplate.

First claim

What is claimed is:

1. A wafer support structure in a chamber of a semiconductor manufacturing apparatus, the wafer support structure comprising:
a baseplate connected to a radio frequency (RF) power source;
a dielectric block, situated above the baseplate, the dielectric block having a bottom surface interfaced with the baseplate and a top surface for supporting a wafer when present;
a plurality of gas supply channels disposed in the baseplate and extending from the baseplate and through the dielectric block to a location proximate to the top surface of the dielectric block;
a first electrode embedded in a top half of the dielectric block, the first electrode being proximate and directly below the top surface of the dielectric block, wherein a top surface of the first electrode is substantially parallel to the top surface of the dielectric block, wherein the first electrode is connected to a direct current (DC) power source; and
a second electrode embedded in a bottom half of the dielectric block, the second electrode having a surface that is proximate and above a top surface of the baseplate, wherein a separation distance in the dielectric block is defined between the first electrode and the second electrode, the second electrode being electrically connected to the first electrode by vertical connectors that are arranged circularly near an outer diameter of the dielectric block, wherein a bottom surface of the second electrode is substantially parallel to a top surface of the baseplate.

2. The wafer support structure as recited in claim 1 , wherein the dielectric block is defined by a ceramic puck and a bonding layer, the bonding layer bonding the ceramic puck to the baseplate.

3. The wafer support structure as recited in claim 1 , wherein the second electrode is connected to the first electrode through said vertical connectors defined as one or more vertical vias embedded in the dielectric block, the one or more vertical vias disposed below the first electrode and proximate to a periphery of the first electrode.

4. The wafer support structure as recited in claim 1 , wherein a first capacitance is formed between the top surface of the dielectric block and the top surface of the first electrode and a second capacitance is formed between the top surface of the second electrode and a top surface of the baseplate.

5. The wafer support structure as recited in claim 4 , wherein an impedance to the RF power through the dielectric block is associated with the first capacitance and the second capacitance.

6. The wafer support structure as recited in claim 1 , wherein a distance between the top surface of the dielectric block and the top surface of the first electrode is in a range of 0.2 mm to 0.5 mm, wherein a distance from the second electrode to the baseplate is in a range from 1 mm to 3 mm.

7. The wafer support structure as recited in claim 1 , wherein a distance from the first electrode to the second electrode is greater than a distance from the top surface of the dielectric block to the first electrode, wherein the distance from the first electrode to the second electrode is greater than a distance from the second electrode to the baseplate.

8. The wafer support structure as recited in claim 1 , wherein the baseplate is conductive, wherein the dielectric block is nonconductive.

9. The wafer support structure as recited in claim 1 , wherein the baseplate is not connected to the DC power source.

10. A wafer support structure in a chamber of a semiconductor manufacturing apparatus, the wafer support structure comprising:
a baseplate connected to a radio frequency (RF) power source;
a dielectric block, situated above the baseplate, the dielectric block having a bottom surface interfaced with the baseplate and a top surface for supporting a wafer when present, the dielectric block is defined by a ceramic puck and a bonding layer which is below the ceramic puck and above the baseplate;
a plurality of gas supply channels disposed in the baseplate and extending from the baseplate and through the dielectric block to a location proximate to the top surface of the dielectric block;
a first electrode embedded in a top half of the ceramic puck, the first electrode being proximate and below the top surface of the ceramic puck, wherein a top surface of the first electrode is substantially parallel to the top surface of the ceramic puck and separated from the top surface of the ceramic puck by material of said ceramic puck, wherein the first electrode is connected through a vertical connector to a direct current (DC) power source below the baseplate; and
a second electrode embedded in a bottom half of the ceramic puck, the second electrode having a surface that is proximate and above a top surface of the baseplate, wherein a separation distance in the ceramic puck is defined between the first electrode and the second electrode, the second electrode being electrically connected to the first electrode through a plurality of vertical conductive vias that are arranged circularly proximate to an outer diameter of the ceramic puck, wherein a bottom surface of the second electrode is substantially parallel to a top surface of the baseplate.

11. The wafer support structure as recited in claim 10 , wherein a first capacitance is formed between the top surface of the ceramic puck and the top surface of the first electrode and a second capacitance is formed between the top surface of the second electrode and a top surface of the baseplate, wherein an impedance to the RF power through the ceramic puck is associated with the first capacitance and the second capacitance.

12. The wafer support structure as recited in claim 10 , wherein a distance between the top surface of the ceramic puck and the top surface of the first electrode is in a range of 0.2 mm to 0.5 mm, wherein a distance from the second electrode to the baseplate is in a range from 1 mm to 3 mm.

13. A wafer support structure in a chamber of a semiconductor manufacturing apparatus, the wafer support structure comprising:
a baseplate connected to a radio frequency (RF) power source;
a dielectric block, situated above the baseplate, the dielectric block having a bottom surface interfaced with the baseplate and a top surface for supporting a wafer when present;
a plurality of gas supply channels disposed in the baseplate and extending from the baseplate and through the dielectric block to a location proximate to the top surface of the dielectric block;
a first electrode embedded in a top half of the dielectric block, the first electrode being proximate and below the top surface of the dielectric block, wherein a top surface of the first electrode is substantially parallel to the top surface of the dielectric block, wherein the first electrode is connected to a direct current (DC) power source; and
a second electrode embedded in the dielectric block proximate and below the first electrode, a separation distance in the dielectric block is defined between the second electrode and the baseplate, the second electrode being electrically connected to the baseplate that is connected to the RF power source,
wherein the second electrode is connected to the base plate through a plurality of vias embedded in the dielectric block and oriented proximate to a periphery of the second electrode;
wherein a bottom surface of the second electrode is substantially parallel to a top surface of the baseplate.

14. The wafer support structure as recited in claim 13 , wherein the second electrode is embedded on the top half of the dielectric block.

15. The wafer support structure as recited in claim 13 , wher

Assignees

• Lam Res Corp

Inventors

• Matyushkin Alexander
• Marakhtanov Alexei
• Holland John Patrick
• Gaff Keith
• Kozakevich Felix

Classifications

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/7624 Primary

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H01L21/67109

  Electricity · mapped topic

• H01L21/68785 Primary

  Electricity · mapped topic