Magnetically coupled galvanically isolated communication using lead frame

Patent metadata

Field	Value
Publication number	US-10079543-B2
Application number	US-201615096515-A
Country	US
Kind code	B2
Filing date	Apr 12, 2016
Priority date	Nov 14, 2012
Publication date	Sep 18, 2018
Grant date	Sep 18, 2018

Abstract

An integrated circuit package includes an electromagnetic communication link formed by a portion of a lead frame within an encapsulation. The lead frame includes a first conductor forming a first conductive loop a second conductor forming a second conductive loop galvanically isolated from the first conductive loop. The second conductive loop is magnetically coupled to the first conductive loop to provide a magnetic communication link between the first and second conductors. A first transceiver circuit includes a transmit circuit coupled to the first conductive loop. A second transceiver circuit includes a receive circuit coupled to the second conductive loop. A signal transmitted from the transmit circuit included in first transceiver circuit and coupled to the first conductor is coupled to be magnetically communicated through the magnetic communication link to the receive circuit included in second transceiver circuit and coupled to the second conductor.

First claim

What is claimed is:

1. An integrated circuit package, comprising:
an electromagnetic communication link formed by a portion of a lead frame within an encapsulation disposed inside the integrated circuit package, the lead frame including:
a first conductor forming a first conductive loop; and
a second conductor forming a second conductive loop galvanically isolated from the first conductive loop, wherein second conductive loop is proximate to and magnetically coupled to the first conductive loop to provide a magnetic communication link between the first and second conductors;

a first transceiver circuit disposed within the integrated circuit package, wherein the first transceiver circuit includes a transmit circuit coupled to the first conductive loop; and
a second transceiver circuit disposed within the integrated circuit package, wherein the second transceiver circuit includes a receive circuit coupled to the second conductive loop, wherein a signal transmitted from the transmit circuit is coupled to be magnetically communicated through the magnetic communication link to the receive circuit, wherein the first conductor is an outer loop, and wherein the second conductor is an inner loop such that substantially all of the outer loop is outside the inner loop.

2. The integrated circuit package of claim 1 , wherein a transfer of data between the first and second transceiver circuits is bidirectional, wherein the first transceiver circuit is coupled to transmit data coupled to be received by the second transceiver circuit, and wherein the second transceiver circuit is coupled to transmit data coupled to be received by the first transceiver circuit.

3. The integrated circuit package of claim 1 , wherein the first transceiver circuit when transmitting data is coupled to generate a first transceiver current having predefined rising and falling slopes to induce a pulsating voltage coupled to be received by the second transceiver circuit, and wherein the second transceiver circuit when transmitting data is coupled to generate a second transceiver current having the predefined rising and falling slopes to induce the pulsating voltage coupled to be received by the first transceiver circuit.

4. The integrated circuit package of claim 3 , wherein a pulse width of the pulsating voltage is proportional to the predetermined rising and falling slopes, and wherein an amplitude of the pulsating voltage is positive during a rising time of the first transceiver current, and wherein the amplitude of the pulsating voltage is negative during a falling time of the first transceiver current, wherein the receive circuit includes a comparator coupled to be responsive to the amplitude of the pulsating voltage.

5. The integrated circuit package of claim 1 , further comprising a first bond wire disposed within the integrated circuit package and coupling together portions of the first conductive loop, wherein the first bond wire forms part of a current path in the first conductive loop.

6. The integrated circuit package of claim 1 , further comprising a second bond wire disposed within the integrated circuit package and coupling together portions of the second conductive loop, wherein the second bond wire forms part of a current path in the second conductive loop.

7. The integrated circuit package of claim 1 , wherein magnetically coupled portions of the first and second conductive loops are disposed substantially in a same plane.

8. The integrated circuit package of claim 1 , wherein the first and second conductive loops each consist of one turn.

9. The integrated circuit package of claim 1 , wherein substantial portions of the first and second conductive loops are encapsulated in a molded non-ferrous insulating material.

10. The integrated circuit package of claim 1 , wherein the receive circuit is disposed within the integrated circuit package, and wherein the receive circuit is coupled to and completes the first conductive loop.

11. The integrated circuit package of claim 1 , wherein the receive circuit is included in a first integrated circuit die disposed within the integrated circuit package, wherein the first integrated circuit die is coupled to and completes the first conductive loop.

12. The integrated circuit package of claim 1 , wherein the receive circuit is included in a first integrated circuit die mounted on the lead frame, wherein the first integrated circuit die is coupled to and completes the first conductive loop.

13. The integrated circuit package of claim 1 , wherein the transmit circuit is disposed within the integrated circuit package, and wherein the transmit circuit is coupled to the second conductive loop.

14. The integrated circuit package of claim 13 , wherein the transmit circuit is included in a second integrated circuit die disposed within the integrated circuit package, wherein the second integrated circuit die is coupled to the second conductive loop.

15. The integrated circuit package of claim 13 , wherein the transmit circuit is included in a second integrated circuit die mounted on the lead frame, wherein the second integrated circuit die is coupled to the second conductive loop.

16. The integrated circuit package of claim 1 , wherein the first conductor is coupled to a first reference ground and wherein the second conductor is coupled to a second reference ground, wherein the first reference ground and the second reference ground are electrically isolated from one another.

Assignees

• Power Integrations Inc
• Power Intergrations Inc

Inventors

• Balakrishnan Balu
• Matthews David Michael Hugh

Classifications

• H10W90/293

  characterised by non-galvanic coupling between the chips, e.g. capacitive coupling · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title