Switch mode power converters using magnetically coupled galvanically isolated lead frame communication

US8976561B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8976561-B2
Application numberUS-201213677120-A
CountryUS
Kind codeB2
Filing dateNov 14, 2012
Priority dateNov 14, 2012
Publication dateMar 10, 2015
Grant dateMar 10, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An integrated circuit package for use in a switch mode power converter comprises an encapsulation and a lead frame. A portion of the lead frame is disposed within the encapsulation. The lead frame includes a first conductor having a first conductive loop disposed substantially within the encapsulation. The lead frame also includes a second conductor galvanically isolated from the first conductor. The second conductor includes a second conductive loop disposed substantially within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors. A first control die including a first control circuit is coupled to the first conductor. A second control die including a second control circuit is coupled to the second conductor. One or more control signals are communicated between the first and second control dice through the communication link.

First claim

Opening claim text (preview).

What is claimed is: 1. An integrated circuit package for use in a switch mode power converter, comprising: an encapsulation; a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame including a first conductor having a first conductive loop disposed substantially within the encapsulation, wherein the lead frame further includes a second conductor galvanically isolated from the first conductor, wherein the second conductor includes a second cond…

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What does patent US8976561B2 cover?
An integrated circuit package for use in a switch mode power converter comprises an encapsulation and a lead frame. A portion of the lead frame is disposed within the encapsulation. The lead frame includes a first conductor having a first conductive loop disposed substantially within the encapsulation. The lead frame also includes a second conductor galvanically isolated from the first conducto…
Who is the assignee on this patent?
Power Integrations Inc
What technology area does this patent fall under?
Primary CPC classification H10W90/811. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).