Semiconductor device
US-2024421048-A1 · Dec 19, 2024 · US
US8976561B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8976561-B2 |
| Application number | US-201213677120-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 14, 2012 |
| Priority date | Nov 14, 2012 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Official abstract text for this publication.
An integrated circuit package for use in a switch mode power converter comprises an encapsulation and a lead frame. A portion of the lead frame is disposed within the encapsulation. The lead frame includes a first conductor having a first conductive loop disposed substantially within the encapsulation. The lead frame also includes a second conductor galvanically isolated from the first conductor. The second conductor includes a second conductive loop disposed substantially within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors. A first control die including a first control circuit is coupled to the first conductor. A second control die including a second control circuit is coupled to the second conductor. One or more control signals are communicated between the first and second control dice through the communication link.
Opening claim text (preview).
What is claimed is: 1. An integrated circuit package for use in a switch mode power converter, comprising: an encapsulation; a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame including a first conductor having a first conductive loop disposed substantially within the encapsulation, wherein the lead frame further includes a second conductor galvanically isolated from the first conductor, wherein the second conductor includes a second cond…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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