Electronic package and manufacturing method thereof
US-2026082926-A1 · Mar 19, 2026 · US
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Tsai Ming-Fan patents
Tsai Ming-Fan is listed as an inventor on 25 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tsai Ming-Fan |
| Total patents | 25 |
| First publication | Jul 2, 2015 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic package and manufacturing method thereof
US-12532745-B2 · Jan 20, 2026 · US
Electronic package and manufacturing method thereof
US-2024290728-A1 · Aug 29, 2024 · US
Electronic package and method for manufacturing the same
US-11764162-B2 · Sep 19, 2023 · US
Electronic device and circuit board thereof
US-11723144-B2 · Aug 8, 2023 · US
Method for fabricating electronic package structure
US-11476572-B2 · Oct 18, 2022 · US
Electronic device and circuit board thereof
US-2022225493-A1 · Jul 14, 2022 · US
Electronic package
US-11069633-B2 · Jul 20, 2021 · US
Electronic package and method for manufacturing the same
US-2021210435-A1 · Jul 8, 2021 · US
Method for fabricating electronic package structure
US-2020161756-A1 · May 21, 2020 · US
Recent patents
Latest publications not already listed above.
Electronic package structure and fabrication method thereof
US-10587041-B2 · Mar 10, 2020 · US
Electronic package
US-2019214352-A1 · Jul 11, 2019 · US
Electronic package
US-10199317-B2 · Feb 5, 2019 · US
Electronic package with antenna structure
US-10074621-B2 · Sep 11, 2018 · US
Electronic package
US-9999132-B2 · Jun 12, 2018 · US
Electronic package structure and fabrication method thereof
US-2018090835-A1 · Mar 29, 2018 · US
Electronic package with antenna structure
US-2017278807-A1 · Sep 28, 2017 · US
Electronic package
US-2017231095-A1 · Aug 10, 2017 · US
Electronic package
US-2017201023-A1 · Jul 13, 2017 · US
Electronic package
US-2017181287-A1 · Jun 22, 2017 · US
Electronic device
US-2016300660-A1 · Oct 13, 2016 · US
Substrate structure
US-2016240302-A1 · Aug 18, 2016 · US
Electronic package
US-2016155559-A1 · Jun 2, 2016 · US
Balanced-to-unbalanced converter
US-9148113-B2 · Sep 29, 2015 · US
Circuit structure
US-2015188510-A1 · Jul 2, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Siliconware Precision Industries Co Ltd | 25 |
| Silicon Prec Industries Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W44/248 | 13 |
| H10W44/20 | 13 |
| H10W70/65 | 12 |
| H10W42/20 | 12 |
| H01L23/49838 | 12 |