Substrate processing method and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10074542-B2
Application number	US-201615267183-A
Country	US
Kind code	B2
Filing date	Sep 16, 2016
Priority date	Sep 28, 2015
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.

First claim

What is claimed is:

1. A substrate processing method comprises:
polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and
bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.

2. The method of claim 1 , wherein the polishing of the rear surface of the substrate is performed to reduce friction between the rear surface of the substrate and top surfaces of a plurality of protrusions formed in a substrate stage of a pattern exposure device, the substrate being mounted on the substrate stage of the pattern exposure device in a suctioned state.

3. The method of claim 1 , wherein the polishing further includes forming grooves in the rear surface of the substrate in a circumferential direction of the substrate, wherein the grooves are formed at different positions from a center of the substrate in a radial direction of the substrate.

4. The method of claim 1 , further comprising: after the polishing, cleaning the rear surface of the substrate by a pure water.

5. The method of claim 1 , wherein the polishing further includes scanning a polishing body between a central portion of the rear surface of the substrate and a peripheral portion of the rear surface while rotating the substrate.

6. A substrate processing apparatus which forms a resist film on a substrate and develops the substrate after a pattern exposure, comprising:
a polishing treatment part configured to polish a rear surface of the substrate such that the rear surface of the substrate is subjected to a roughening treatment before the pattern exposure,
wherein a roughness alleviating treatment is not performed on the polished rear surface.

7. The apparatus of claim 6 , wherein the polishing treatment part includes:
a mechanism configured to hold a peripheral portion of the rear surface of the substrate or an outer periphery end of the substrate and to rotate the substrate;
a polishing body configured to polish the rear surface of the substrate; and
a moving mechanism configured to move the polishing body between a central portion of the substrate and a peripheral portion of the substrate.

8. The apparatus of claim 7 , further comprising:
a mechanism used in polishing the peripheral portion of the rear surface of the substrate by the polishing body, and configured to hold a central portion of the rear surface of the substrate in a suctioned state and to rotate the substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Kubo Akihiro
• Kodama Teruhiko

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title