Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation

Patent metadata

Field	Value
Publication number	US-10073351-B2
Application number	US-201514964033-A
Country	US
Kind code	B2
Filing date	Dec 9, 2015
Priority date	Dec 23, 2014
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

A photoresist or semiconductor manufacturing residue stripping and cleaning composition comprising water, one or more alkaline compounds, one or more corrosion inhibitors, and one or more oxidized products of one or more antioxidants, the method of making the composition and the method of using the composition.

First claim

The invention claimed is:

1. A photoresist or semiconductor manufacturing residue stripping and cleaning composition, comprising about 70 to 85% by weight of one or more alkaline compounds wherein said alkaline compound comprises one or more alkanolamines, about 0.5 to 2.5% by weight of one or more antioxidant corrosion inhibitors, 0.001 to 1% of one or more oxidation products of one or more antioxidants, and 9.9 to 28.99 wt. % water.

2. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 1 , wherein said one or more oxidized products of one or more antioxidants are formed by oxidizing said one or more antioxidant corrosion inhibitors.

3. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 1 , wherein said one or more oxidized products of one or more antioxidants were formed in situ by adding oxygen-containing gas, peroxides or nitrates to said composition.

4. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 1 , wherein said one or more antioxidant corrosion inhibitors are selected from the group consisting of catechol, t-butyl catechol, resorcinol, pyrogallol, gallic acid, esters of gallic acid and ascorbic acid.

5. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 1 , further comprising one or more passivation corrosion inhibitors.

6. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 5 , wherein said one or more passivation corrosion inhibitors are selected from the group consisting of anthranilic acid, benzoic acid, isophthalic acid, maleic acid, fumaric acid, D,L-malic acid, malonic acid, phthalic acid, maleic anhydride, phthalic anhydride, benzotriazole (BZT), carboxybenzotriazole, diethyl hydroxylamine, lactic acid and citric acid salts thereof, pyrogallol, fructose, ammonium thiosulfate, glycine, lactic acid, tetramethylguanidine, iminodiacetic acid, and dimethylacetoacetamide, trihydroxybenzene, dihydroxybenzene, and salicylhydroxamic acid.

7. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 1 wherein said one or more alkaline compounds are said one or more alkanolamines selected from the group consisting of ethanolamine, N-methyl ethanolamine, N-ethyl ethanolamine, N-propyl ethanolamine, N-butyl ethanolamine, N-methyl isopropanol amine, N-ethyl-isopropanol amine, N-propyl isopropanol amine, 2-aminopropane-1-ol, N-methyl-2-aminopropane-1-ol, N-ethyl-2-aminopropane-1-ol, 1-aminopropane-3-ol, N-methyl-1-aminopropane-3-ol, N-ethyl-1-aminopropane-3-ol, 1-aminobutane-2-ol, N-methyl-1-aminobutane-2-ol, N-ethyl-1-aminobutane-2-ol, 2-aminobutan-1-ol, N-methyl-2-aminobutane-1-ol, N-ethyl-2-aminobutane-1-ol, N-hydroxymethyl ethanol amine, N-hydroxymethyl ethylene diamine, N,N′-bis (hydroxymethyl) ethylene diamine, N-hydroxymethyl isopropanol amine, N-methylethanolamine (NMEA), monoethanolamine (MEA), diethanolamine, mono-, di- and tri-isopropanolamine, 2-(2-aminoethylamino) ethanol, 2-(2-aminoethoxy) ethanol, triethanolamine.

8. The photoresist or semiconductor manufacturing residue stripping and cleaning composition claim 1 , wherein said alkaline compound further comprises one or more amines selected from the group consisting of morpholine, cyclohexylamine, piperidine alkylamines (where the alkyl group has 1 to 5 carbons) and alkylene diamines (having 1 to 5 carbons).

9. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 1 , wherein said alkaline compound further comprises one or more hydroxylamines.

10. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 1 , wherein said one or more antioxidant corrosion inhibitors comprises gallic acid or catechol or mixtures of gallic acid and catechol.

11. A process for removing a photoresist or residue on a silicon substrate comprising silicon, the process comprising the steps of: contacting said substrate with a stripping and cleaning effective amount of the composition of claim 1 ; permitting said stripping composition to contact said substrate for a stripping effective period of time; and removing the photoresist or the photoresist residues from said substrate, wherein said silicon of said silicon substrate is etched at a rate that is less than 1 Å/min.

12. The process of making the composition of claim 1 , comprising the steps of combining water, one or more alkaline compounds, one or more antioxidant corrosion inhibitors in a container and adding oxygen-containing gas to said composition to form one or more oxidized products of one or more antioxidant corrosion inhibitors in said composition.

13. The process of claim 12 wherein said adding step is performed by bubbling oxygen-containing gas through said composition in said container.

14. A photoresist or semiconductor manufacturing residue stripping and cleaning composition comprising about 70 to 85% by weight of one or more alkaline compounds, wherein said alkaline compounds comprise one or more alkanolamines, about 0.5 to 10% by weight of one or more antioxidant corrosion inhibitors, 0.001 to 5% of one or more oxidation products of one or more antioxidants, and 9.9 to 28.99 wt. % water.

15. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 14 , wherein said one or more alkaline compounds are selected from the group consisting of primary, secondary and tertiary alkanolamines having from 1 to 5 carbon atoms.

16. The photoresist or semiconductor manufacturing residue stripping and cleaning composition of claim 14 , wherein said one or more alkaline compound further comprises one or more hydroxylamines.

Assignees

• Air Prod & Chem
• Versum Mat Us Llc

Inventors

• Agarwal Rajiv Krishan
• Brown Mark Richard
• Wu Aiping
• Rennie David Barry
• Lee Yi-Chia
• Parris Gene Everad

Classifications

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P14/6528

  In-situ cleaning after layer formation, e.g. removing process residues · CPC title

• H01L21/02334

  Electricity · mapped topic

• C11D7/3218

  Alkanolamines or alkanolimines · CPC title

• C11D7/265

  Carboxylic acids or salts thereof · CPC title