Selective plasma enhanced atomic layer deposition
US-12518966-B2 · Jan 6, 2026 · US
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Wu Aiping patents
Wu Aiping is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wu Aiping |
| Total patents | 26 |
| First publication | Dec 1, 2015 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Formulated Alkaline Chemistry For Polysilicon Exhume
US-2025304856-A1 · Oct 2, 2025 · US
Photoresist remover
US-12325844-B2 · Jun 10, 2025 · US
Composition comprising three alkanolamines and a hydroxylamine for removing etch residues
US-12298669-B2 · May 13, 2025 · US
Etching composition and method for selectively removing silicon nitride during manufacture of a semiconductor device
US-12281251-B2 · Apr 22, 2025 · US
Compositions For Removing Photoresist And Etch Residue From A Substrate With Copper Corrosion Inhibitor And Uses Thereof
US-2025002823-A1 · Jan 2, 2025 · US
Post-Dry Etching Photoresist And Metal Containing Residue Removal Formulation
US-2024392194-A1 · Nov 28, 2024 · US
Etching composition and method for selectively removing silicon nitride during manufacture of a semiconductor device
US-12110435-B2 · Oct 8, 2024 · US
Etching Solution For Selectively Removing Silicon-Germanium Alloy From A Silicon-Germanium/ Silicon Stack During Manufacture Of A Semiconductor Device
US-2024271040-A1 · Aug 15, 2024 · US
Selective thermal atomic layer deposition
US-2024047196-A1 · Feb 8, 2024 · US
Recent patents
Latest publications not already listed above.
Selective plasma enhanced atomic layer deposition
US-2024014036-A1 · Jan 11, 2024 · US
Composition For Removing Etch Residues, Methods Of Using And Use Thereof
US-2022380705-A1 · Dec 1, 2022 · US
Photoresist Remover
US-2022333044-A1 · Oct 20, 2022 · US
Etching Composition And Method For Selectively Removing Silicon Nitride During Manufacture Of A Semiconductor Device
US-2022298182-A1 · Sep 22, 2022 · US
Liquid Compositions For Selectively Removing Polysilicon Over P-Doped Silicon And Silicon-Germanium During Manufacture Of A Semiconductor Device
US-2022298417-A1 · Sep 22, 2022 · US
Cleaning Composition For Semiconductor Substrates
US-2022243150-A1 · Aug 4, 2022 · US
Etching Composition And Method For Selectively Removing Silicon Nitride During Manufacture Of A Semiconductor Device
US-2022228062-A1 · Jul 21, 2022 · US
Post etch residue cleaning compositions and methods of using the same
US-11091727-B2 · Aug 17, 2021 · US
Post etch residue cleaning compositions and methods of using the same
US-2020032177-A1 · Jan 30, 2020 · US
Etching compositions and methods for using same
US-10400167-B2 · Sep 3, 2019 · US
Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation
US-10073351-B2 · Sep 11, 2018 · US
Etching Compositions and Methods for Using Same
US-2017145311-A1 · May 25, 2017 · US
Cleaning formulations
US-9536730-B2 · Jan 3, 2017 · US
Semi-Aqueous Photoresist or Semiconductor Manufacturing Residue Stripping and Cleaning Composition with Improved Silicon Passivation
US-2016179011-A1 · Jun 23, 2016 · US
Stripping and Cleaning Compositions for Removal of Thick Film Resist
US-2016152930-A1 · Jun 2, 2016 · US
Water-rich stripping and cleaning formulation and method for using same
US-9201308-B2 · Dec 1, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Versum Mat Us Llc | 21 |
| Air Prod & Chem | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G03F7/425 | 12 |
| C11D7/265 | 12 |
| C11D7/3218 | 12 |
| C11D7/261 | 12 |
| C11D2111/22 | 12 |