Cooling structure for portable electronic device

Patent metadata

Field	Value
Publication number	US-2016282914-A1
Application number	US-201415036081-A
Country	US
Kind code	A1
Filing date	Oct 27, 2014
Priority date	Nov 14, 2013
Publication date	Sep 29, 2016
Grant date	—

Abstract

A cooling structure for a portable electronic device is provided, configured to accommodate, within a case having a sealing structure, a substrate on which a heat-generating component that generates heat during operation is mounted, and provided with a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component. The heat sink is integrated into an inner surface of an area corresponding to a front cover of the case or an inner surface of an area corresponding to a rear cover of the case, and a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end is attached by being sandwiched between the heat-generating component and the heat sink while another end is arranged in close contact with the heat sink.

First claim

1 - 5 . (canceled)

6 . A cooling structure for a portable electronic device configured to accommodate, within a case having a sealing structure, a substrate on which a heat-generating component that generates heat during operation is mounted, and provided with a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component, wherein
the heat sink is integrated into an inner surface of an area corresponding to a front cover of the case or an inner surface of an area corresponding to a rear cover of the case, and a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end of the flat heat pipe is arranged at a position for receiving the heat from the heat-generating component and another end of the flat heat pipe is arranged so as to be in close contact with the heat sink, the cooling structure for the portable electronic device further comprising a shield plate covering a top surface side of the heat-generating component, the shield plate including a stepped portion bent toward the substrate such that a thickness of the shield plate is smaller than a thickness of the heat-generating component at a place shifted away from the heat-generating component in a width direction or a length direction of the heat-generating component, the one end of the flat heat pipe being sandwiched between the stepped portion and the heat sink.

7 . The cooling structure for the portable electronic device according to claim 6 , wherein the heat sink has a thinner plate thickness at a place where the flat heat pipe is bonded than a plate thickness at a place where the flat heat pipe is not bonded.

8 - 9 . (canceled)

10 . The cooling structure for the portable electronic device according to claim 6 , wherein the case is formed using synthetic resin, the heat sink is formed using metal, and the heat sink is built into a portion of the case so as to be integrated into the case.

11 . The cooling structure for the portable electronic device according to claim 7 , wherein the case is formed using synthetic resin, the heat sink is formed using metal, and the heat sink is built into a portion of the case so as to be integrated into the case.

Assignees

• Fujikura Ltd

Inventors

• Saito Yuji
• Ahamed Mohammad Shahed
• Takahashi Makoto
• Takamiya Akihiro

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28D15/043

  forming loops, e.g. capillary pumped loops · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• H04M1/0202

  Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03) · CPC title