Inspection of microelectronic devices using near-infrared light

Patent metadata

Field	Value
Publication number	US-10066927-B2
Application number	US-201615245442-A
Country	US
Kind code	B2
Filing date	Aug 24, 2016
Priority date	Mar 28, 2014
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

Inspection of microelectronic devices is described using near infrared light. In one example, a dielectric material layer on a substrate is illuminated with a near infrared light beam. The substrate has at least one contact land, the dielectric material layer overlies at least a portion of the contact land, and the substrate has at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land. Reflected near infrared light is reflected from the substrate at a camera. The position of the via is determined relative to the contact land from the reflected light beam using an image processing device.

First claim

The invention claimed is:

1. A method comprising:
illuminating a dielectric material layer on a substrate with a near infrared light beam, wherein the substrate has at least one contact land, the dielectric material layer overlying at least a portion of the contact land, the substrate having at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land;
receiving a reflected near infrared light beam from the substrate at a camera; and
determining the position of the via relative to the contact land from the reflected near infrared light beam using an image processing device.

2. The method of claim 1 , further comprising accepting or rejecting the substrate based on the position of the via relative to the contact land.

3. The method of claim 1 , wherein the illuminating the dielectric material layer comprises directing a first light beam having light wavelengths between about 700 nm and 1150 nm to the dielectric material layer.

4. The method of claim 1 , further comprising determining alignment as the distance between a center of the via and a center of the contact land.

5. The method of claim 1 , wherein the substrate comprises a package substrate having alternating dielectric and metal path way layers.

6. The method of claim 1 , further comprising adjusting a position of a photolithography mask based on the determined position.

7. The method of claim 1 , further comprising moving the substrate during illuminating to scan the near infrared light beam over an area of a silicon device.

8. The method of claim 1 , wherein the near infrared light beam is selected so that a silicon device is substantially transparent to the near infrared light beam.

9. The method of claim 1 , wherein the near infrared light beam has a wavelength of 1300 nm or longer.

10. The method of claim 1 , wherein a silicon device has a top on a side opposite the substrate and wherein directing the near infrared light beam comprises directing the near infrared light beam on the top of the silicon device.

11. The method of claim 1 , further comprising transmitting information from determining the position of the via relative to the contact land.

12. The method of claim 11 , further comprising altering a position of via formation in subsequently formed substrates.

13. An apparatus comprising:
a near infrared light beam source to illuminate a dielectric material layer on a substrate, wherein the substrate has at least one contact land, the dielectric material layer overlying at least a portion of the contact land, the substrate having at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land;
a camera to receive a reflected near infrared light beam from the substrate; and
an image processing device to determine the position of the via relative to the contact land from the reflected near infrared light beam.

14. The apparatus of claim 13 , wherein the image processing device determines alignment as the distance between a center of the via and a center of the contact land.

15. The apparatus of claim 13 , further comprising a scanner to move the substrate during illuminating to scan the near infrared light beam over an area of a silicon device.

16. The apparatus of claim 13 , wherein the near infrared light beam source illuminates a silicon device with light that has a wavelength of 1300 nm or longer.

17. The apparatus of claim 13 , wherein a silicon device has a top on a side opposite the substrate and wherein the near infrared light beam source directs the near infrared light beam on the top of the silicon device.

Assignees

• Intel Corp

Inventors

• Zhang Liang W
• Zou Zhihua
• Martin Iii Osborne A
• Wiedmaier Robert F

Classifications

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• G01L1/241

  by photoelastic stress analysis · CPC title

• G01N2021/8841

  Illumination and detection on two sides of object · CPC title

• G01L1/248

  using infrared (G01L1/241, G01L1/242 take precedence) · CPC title

• G01B11/272

  using photoelectric detection means · CPC title