Apparatus of aligning substrate and method of aligning substrate

Patent metadata

Field	Value
Publication number	US-10056283-B2
Application number	US-201514935207-A
Country	US
Kind code	B2
Filing date	Nov 6, 2015
Priority date	Jun 2, 2015
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

An apparatus and a method for aligning a substrate are disclosed. In one aspect, the substrate aligning apparatus includes a stage configured to support a plurality of substrates, a supporting pin placed in the stage to support the substrates and an alignment clamp configured to respectively move each of the substrates to align the substrates. The alignment clamp can respectively align at least two of the substrates with reference to an alignment reference position as a two-dimensional coordinate system which includes a first axis and a second axis crossing the first axis and is set on an imaginary plane by the first and second axes.

First claim

What is claimed is:

1. A substrate aligning apparatus comprising:
a stage having an alignment reference position formed thereon and configured to support a plurality of substrates;
a supporting pin placed in the stage to support the substrates; and
an alignment clamp configured to respectively move each of the substrates to align the substrates,
wherein the alignment clamp is further configured to respectively align at least two of the substrates with reference to the alignment reference position as a two-dimensional coordinate system which includes a first axis and a second axis crossing the first axis and is set on an imaginary plane by the first and second axes,
wherein the alignment clamp includes:
a first clamp configured to clamp first opposing sides of each of the at least two substrates; and
a second clamp configured to clamp second opposing sides of each of the at least two substrates which are perpendicular to the first opposing sides.

2. The substrate aligning apparatus of claim 1 , wherein the stage is placed so that an upper surface is substantially parallel to the imaginary plane.

3. The substrate aligning apparatus of claim 1 , wherein the supporting pin is configured to respectively support a lower portion of the substrates.

4. The substrate aligning apparatus of claim 3 , wherein the supporting pin comprises a plurality of supporting pins that are respectively configured to rise and fall toward the substrates with reference to the stage.

5. The substrate aligning apparatus of claim 1 , wherein the alignment clamp is configured to move on the stage to clamp and fix a portion of at least one of the substrates, and wherein a moving trajectory of the substrate by the alignment clamp is substantially parallel to the imaginary plane.

6. The substrate aligning apparatus of claim 5 ,
wherein the first clamp is configured to axially align the clamped substrates with reference to the first axis and
wherein the second clamp is configured to axially align the clamped substrates with reference to the second axis.

7. The substrate aligning apparatus of claim 1 , wherein the alignment clamp is configured to move all of the substrates in a direction parallel to a top surface of the stage.

8. The substrate aligning apparatus of claim 1 , wherein the alignment clamp includes a first pair of clamps opposing each other and configured to move one of the substrates in a first direction and a second pair of clamps opposing each other and configured to move another one of the substrates in a second direction crossing the first direction.

9. The substrate aligning apparatus of claim 1 , wherein the alignment clamp is further configured to move all of the substrates toward the alignment reference position.

10. A method for aligning a substrate comprising:
mounting a plurality of substrates on a stage having an alignment reference position formed thereon;
clamping first opposing sides of each of at least two of the substrates;
clamping second opposing sides of each of the at least two substrates which are perpendicular to the first opposing sides;
aligning the substrates with reference to the alignment reference position as a two-dimensional coordinate system which includes a first axis and a second axis crossing the first axis and is set on an imaginary plane by the first and second axes; and
testing the alignment of the substrates.

11. The method of claim 10 , further comprising, after at least one of the substrates is mounted on a supporting pin installed on the stage, lowering the supporting pin and the substrate toward the upper surface of the stage.

12. The method of claim 10 , wherein the aligning includes
first axially aligning the clamped substrates with reference to the first axis; and
second axially aligning the clamped substrates with reference to the second axis.

13. The method of claim 12 , wherein the first axially aligning and the second axially aligning are simultaneously or concurrently performed.

14. The method of claim 10 , wherein a moving trajectory of the clamped substrates is substantially parallel to the imaginary plane.

15. The method of claim 10 , wherein the aligning comprises performing a fine alignment for the clamped substrates to be substantially parallel to the imaginary plane.

16. The method of claim 10 , wherein the aligning comprises detecting an alignment mark formed in the clamped substrates.

17. A substrate aligning apparatus comprising:
a stage having an alignment reference position formed thereon and configured to support a plurality of substrates; and
an alignment clamp configured to respectively move each of the substrates to align the substrates, wherein the alignment clamp is configured to respectively align at least two of the substrates with reference to the alignment reference position as a two-dimensional coordinate system which includes a first axis and a second axis crossing the first axis and is set on an imaginary plane by the first and second axes,
wherein the alignment clamp includes:
a first clamp configured to clamp first opposing sides of each of the at least two substrates; and
a second clamp configured to clamp second opposing sides of each of the at least two substrates which are perpendicular to the first opposing sides.

18. The substrate aligning apparatus of claim 17 , further comprising a supporting pin placed in the stage to support the substrates.

19. The substrate aligning apparatus of claim 18 , wherein the supporting pin is configured to respectively support a lower portion of the substrates.

20. The substrate aligning apparatus of claim 18 , wherein the supporting pin comprises a plurality of supporting pins that are respectively configured to rise and fall toward the substrates with reference to the stage.

21. The substrate aligning apparatus of claim 17 , wherein the alignment clamp is configured to move on the stage to clamp and fix a portion of at least one of the substrates.

22. The substrate aligning apparatus of claim 21 ,
wherein the first clamp is configured to axially align the clamped substrates with reference to the first axis and
wherein the second clamp is configured to axially align the clamped substrates with reference to the second axis.

Assignees

• Samsung Display Co Ltd

Inventors

• Park Jin Wan
• Park Ji Hwan

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/7621

  characterised by supporting two or more semiconductor substrates · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/50 Primary

  for positioning, orientation or alignment · CPC title