Method of processing SiC wafer

Patent metadata

Field	Value
Publication number	US-10056263-B2
Application number	US-201715485987-A
Country	US
Kind code	B2
Filing date	Apr 12, 2017
Priority date	Apr 19, 2016
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

A SiC wafer is processed by a laser beam having a wavelength that transmits SiC to form a peeling plane in a region of the wafer which corresponds to a device area of a first surface of the wafer. A plurality of devices demarcated by a plurality of intersecting projected dicing lines in the device area are formed on the first surface. An annular groove is formed on a second surface of the wafer which is opposite the first surface, in a boundary region of the wafer between the device area and an outer peripheral excessive area surrounding the device area. A portion of the wafer which is positioned radially inwardly of the annular groove is peeled from the peeling plane, thereby thinning the device area and forming an annular stiffener area on a region of the second surface which corresponds to the outer peripheral excessive area.

First claim

What is claimed is:

1. A method of processing an SiC wafer having a first surface and a second surface which is opposite the first surface, the first surface including a device area where a plurality of devices are formed and an outer peripheral excessive area surrounding the device area, the method comprising:
a peeling plane forming step of positioning, in a region of the SiC wafer which corresponds to the device area, a focused point of a pulsed laser beam to be applied at a depth corresponding to a finished thickness of the device area of the SiC wafer as viewed from the first surface thereof, and, while moving the SiC wafer relative to the focused point, irradiating the SiC wafer with the laser beam having a wavelength, that transmits through the SiC wafer, from the first surface or the second surface, thereby forming a plurality of straight reduced strength areas each including a modified layer and cracks in the region of the SiC wafer which corresponds to the device area, at the depth corresponding to the finished thickness of the device area of the SiC wafer as viewed from the first surface thereof, thereby forming a peeling plane jointly made up of said straight reduced strength areas;
a device forming step of forming a plurality of devices demarcated by a plurality of intersecting projected dicing lines in the device area after performing the peeling plane forming step;
an annular groove forming step of forming an annular groove in a region of the SiC wafer which corresponds to a boundary region between the device area and the outer peripheral excessive area, from the second surface, leaving a layer having a thickness which corresponds to the finished thickness of the SiC wafer, near the first surface after performing the device forming step;
a thinning step of peeling off a portion of the SiC wafer positioned next to the second surface radially inwardly of said annular groove from said peeling plane that serves as a boundary face, thereby thinning the device area of the SiC wafer to the finished thickness and forming an annular stiffener area on a region of the second surface which corresponds to the outer peripheral excessive area after performing the annular groove forming step; and
a planarizing step of grinding the peeling plane of the SiC wafer which is surrounded by said annular stiffener areas, thereby planarizing the peeling plane after performing the thinning step.

2. The method of processing an SiC wafer according to claim 1 , further comprising:
a step of forming sub-devices in areas of the planarized peeling plane which correspond to the respective devices after performing the planarizing step.

3. The method of processing an SiC wafer according to claim 1 ,
wherein the SiC wafer has a c-axis inclined with respect to a vertical axis which extends perpendicularly to the first surface, and
wherein the peeling plane forming step includes:
a reduced strength area forming step of, while moving the SiC wafer relative to the focused point in a direction perpendicular to the direction in which the c-axis is inclined, irradiating the SiC wafer with the laser beam having a wavelength, that transmits through SiC, thereby forming the straight reduced strength areas each including the modified layer and the cracks which extend from the modified layer along a c-plane of the SiC wafer; and
an indexing step of indexing-feeding the SiC wafer relative to the focused point by a predetermined distance in the direction in which the c-axis is inclined.

4. The method of processing an SiC wafer according to claim 1 , wherein the thinning step comprises peeling off a portion of the SiC wafer through ultrasonic vibrations of a surface of a rotatable suction member in contact with one of said first or second surfaces of the SiC wafer.

5. The method of processing an SiC wafer according to claim 1 , wherein the thinning step comprises peeling off a portion of the SiC wafer through rotation of a surface of a rotatable suction member in contact with one of said first or second surfaces of the SiC wafer.

Assignees

• Disco Corp

Inventors

• Suzuki Katsuhiko

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P36/00

  Gettering within semiconductor bodies · CPC title

• H10P34/42

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title