Apparatus and method for forming interconnection lines having variable pitch and variable widths

Patent metadata

Field	Value
Publication number	US-10043703-B2
Application number	US-201615379605-A
Country	US
Kind code	B2
Filing date	Dec 15, 2016
Priority date	Dec 15, 2016
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

A semiconductor cell includes a dielectric layer. An array of at least four parallel metal lines is disposed within the dielectric layer, the metal lines having line widths that are substantially equal to or greater than a predetermined minimum line width. Line spacers are disposed between the metal lines, the line spacers having line spacer widths that are substantially equal to or greater than a predetermined minimum line spacer width. An overall cell height of the cell is substantially equal to an integer multiple of a plurality of cell tracks, each cell track being a minimum pitch of the cell. The minimum pitch being defined by the minimum line width plus the minimum line spacer width. The minimum pitch is equal to or less than 36 nm. Not all of the line widths are substantially equal and every other line spacer width is substantially equal.

First claim

What is claimed is:

1. A semiconductor cell comprising:
a dielectric layer composed of a dielectric isolation material;
an array of four substantially parallel metal lines disposed within the dielectric layer, the metal lines having line widths that are substantially equal to or greater than a predetermined minimum line width;
a first, a second, a third and a fourth line spacer disposed respectively between the metal lines and having the dielectric isolation material of the dielectric layer disposed therein, the line spacers having line spacer widths that are substantially equal to or greater than a predetermined minimum line spacer width adequate to provide electrical isolation between the metal lines;
an overall cell height being substantially equal to an integer multiple of a plurality of cell tracks, each cell track being a minimum pitch of the cell, the minimum pitch defined by the minimum line width plus the minimum line spacer width, the minimum pitch being equal to or less than 36 nm; and
wherein not all of the line widths are substantially equal,
wherein the first and third line spacers have a substantially equal line spacer width,
wherein the second and fourth line spacers have a substantially equal line spacer width, and
wherein the line spacer width of the first and third line spacers is substantially different from the line spacer width of the second and fourth line spacers.

2. The semiconductor cell of claim 1 wherein the array includes at least four metal lines, the line widths of at least three metal lines being substantially equal to the predetermined minimum line width.

3. The semiconductor cell of claim 2 wherein the line width of one metal line is greater than twice the minimum line width.

4. The semiconductor cell of claim 2 wherein the line width of one metal line is substantially equal to twice the minimum line width plus a line spacer width.

5. The semiconductor cell of claim 2 wherein three of the metal lines are signal lines and one of the metal lines is a power line.

6. The semiconductor cell of claim 1 wherein every other line spacer width is equal to within plus or minus 2 nanometers.

7. The semiconductor cell of claim 1 wherein the minimum line width is greater than or equal to 12 nm and has a tolerance that is greater than or equal to plus or minus 4 nm.

8. The semiconductor cell of claim 1 wherein the minimum pitch is equal to or less than one of 32 nm pitch, 28 nm pitch and 26 nm pitch.

Assignees

• Globalfoundries Inc

Inventors

• Bouche Guillaume
• Licausi Nicholas Vincent

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P50/691

  for Group V materials or Group III-V materials · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H10W20/427

  Power or ground buses · CPC title