Lithographic projection objective

US10042265B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10042265-B2
Application numberUS-201615294281-A
CountryUS
Kind codeB2
Filing dateOct 14, 2016
Priority dateJul 3, 2006
Publication dateAug 7, 2018
Grant dateAug 7, 2018

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  1. Title

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Abstract

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Projection objectives, such as projection objectives of lithography projection exposure apparatuses, as well as related systems, components and methods, such as methods of revising and/or repairing such objectives, are disclosed.

First claim

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What is claimed is: 1. A method of modifying a catadioptric lithography projection objective comprising a plurality of optical elements between an object plane of the catadioptric lithography projection objective and an image plane of the catadioptric lithography projection objective, the plurality of optical elements comprising a first optical element disposed at a first location of the catadioptric lithography projection objective and a second optical element disposed at a second location of the catadioptric lithography projection objective, the second location being different from the first location, the second location being near a field plane or a pupil plane, the method comprising: removing the first optical element from the first location of the catadioptric lithography projection objective; inserting a first spare optical element into the catadioptric lithography projection objective at the first location; removing the second optical element from the second location of the the catadioptric lithography projection objective; and inserting a second spare optical element into the catadioptric lithography projection objective at the second location, wherein: the first optical element has a refractive power; and the second spare optical element is designed depending on: a) a desired image quality of the catadioptric projection objective based on a simulation of the image quality of the catadioptric projection objective; orb) a desired image quality of the catadioptric projection objective based on a measured image quality of optical effect of the catadioptric projection objective. 2. The method of claim 1 , wherein the catadioptric lithography projection objective comprises in order along a path of light propagation through the catadioptric lithography projection objective from the object plane to the image plane: a first objective part; a first folding mirror; a second objective part; a second folding mirror; and a third objective part which comprises a third mirror. 3. The method of claim 2 , wherein: the first objective part is configured to image an object in the object plane into a first intermediate image; the second objective part is configured to image the first intermediate image into a second intermediate image; and the third projective projection part is configured to image the second intermediate image into the image plane. 4. The method of claim 3 , wherein the second objective part comprises a negative lens. 5. The method of claim 3 , wherein the third mirror is in a pupil plane. 6. The method of claim 1 , wherein the catadioptric lithography projection objective comprises in order along a path of light propagation from the object plane to the image plane: a first objective part configured to image an object in the object plane into a first intermediate image; a first imaging mirror; a second imaging mirror, the first and second mirrors configured to image the first intermediate image into a second intermediate image; and a second objective part configured to image the second intermediate image into the image plane. 7. The method of claim 1 , wherein the first spare optical element is inserted into the catadioptric lithography projection objective at a location that is near a field plane or that is near a pupil plane. 8. The method of claim 1 , wherein the second spare optical element is without refractive power except as provided by the shape of the surface of the second spare optical element. 9. The method of claim 1 , further comprising, prior to inserting the second spare optical element into the catadioptric lithography projection objective, working the second spare optical element to provide the second spare optical component with the shape of the surface of the second spare optical element. 10. A method of modifying a catadioptric lithography projection objective comprising a plurality of optical elements between an object plane of the catadioptric lithography projection objective and an image plane of the catadioptric lithography projection objective, the plurality of optical elements comprising a first optical element disposed at a first location of the catadioptric lithography projection objective and a second optical element disposed at a second location of the catadioptric lithography projection objective, the second location being different from the first location, the second location being near a field plane or a pupil plane, the method comprising: removing the first optical element from the first location of the catadioptric lithography projection objective; inserting a first spare optical element into the catadioptric lithography projection objective at the first location; measuring an image quality of the catadioptric lithography projection objective; determining a second spare optical element based on a difference between a desired image quality of the catadioptric lithography projection objective and the measured image quality of the catadioptric lithography projection objective; removing the second optical element from the second location of the the catadioptric lithography projection objective; and inserting the second spare optical element into the catadioptric lithography projection objective at the second location, wherein the first optical element has a refractive power. 11. A method of modifying a catadioptric lithography projection objective comprising a plurality of optical elements between an object plane of the catadioptric lithography projection objective and an image plane of the catadioptric lithography projection objective, the plurality of optical elements comprising a first optical element disposed at a first location of the catadioptric lithography projection objective and a second optical element disposed at a second location of the catadioptric lithography projection objective, the second location being different from the first location, the second location being near a field plane or a pupil plane, the method comprising: removing the first optical element from the first location of the catadioptric lithography projection objective; inserting a first spare optical element into the catadioptric lithography projection objective at the first location; simulating an image quality of the catadioptric lithography projection objective; determining a second spare optical element based on a difference between a desired image quality of the catadioptric lithography projection objective and the measured image quality of the catadioptric lithography projection objective; removing the second optical element from the second location of the catadioptric lithography projection objective; and inserting the second spare optical element into the catadioptric lithography projection objective at the second location, wherein the first optical element has a refractive power.

Assignees

Inventors

Classifications

  • Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system · CPC title

  • Assembly, maintenance, transport or storage of apparatus · CPC title

  • Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like · CPC title

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Frequently asked questions

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What does patent US10042265B2 cover?
Projection objectives, such as projection objectives of lithography projection exposure apparatuses, as well as related systems, components and methods, such as methods of revising and/or repairing such objectives, are disclosed.
Who is the assignee on this patent?
Zeiss Carl Smt Gmbh
What technology area does this patent fall under?
Primary CPC classification G03F7/70258. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 07 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).