Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus

Patent metadata

Field	Value
Publication number	US-10040924-B2
Application number	US-201615295514-A
Country	US
Kind code	B2
Filing date	Oct 17, 2016
Priority date	Nov 2, 2015
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

The present invention provides an adhesion promoter for promoting adhesiveness of a cured product of an addition curable organopolysiloxane resin composition, the adhesion promoter comprising at least one alkoxy group bonded to a silicon atom, and at least one cyano group-containing organic group bonded to a silicon atom in one molecule. There can be provided an adhesion promoter which can make a cured product of an addition curable organopolysiloxane resin composition excellent in heat resistance, workability, adhesiveness, and gas barrier property by adding it to the composition.

First claim

The invention claimed is:

1. An adhesion promoter for promoting adhesiveness of a cured product of an addition curable organopolysiloxane resin composition,
the adhesion promoter comprising at least one alkoxy group bonded to a silicon atom, and at least one cyano group-containing organic group bonded to a silicon atom in one molecule,
wherein the adhesion promoter is a material having two or more alkenyl groups.

2. The adhesion promoter according to claim 1 , wherein the adhesion promoter is a material represented by the following average formula (1),
R 1 a SiO (4-a)/2   (1)

wherein, R 1 represents a hydrogen atom, or a group selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an epoxy group-containing organic group having 3 to 10 carbon atoms, and a cyano group-containing organic group having 1 to 10 carbon atoms other than a cyano group; the material has at least one alkoxy group and at least one cyano group-containing organic group in the molecule; and “a” represents a number satisfying 1.0≤a<4.0.

3. An addition curable organopolysiloxane resin composition which comprises
(A) an organopolysiloxane having two or more alkenyl groups bonded to the silicon atom,
(B) an organohydrogen polysiloxane having two or more hydrogen atoms bonded to the silicon atom,
(C) the adhesion promoter according to claim 2 , and
(D) a catalyst for hydrosilylation reaction.

4. The adhesion promoter according to claim 1 , wherein the adhesion promoter is a material represented by the following formula (2),
R 2 SiX b R 3 3-b   (2)

wherein, R 2 represents a cyano group-containing organic group having 1 to 10 carbon atoms which is other than the cyano group, X represents an alkoxy group having 1 to 10 carbon atoms, R 3 represents a hydrocarbon group having 1 to 8 carbon atoms, and “b” represents an integer of 1 to 3.

5. An addition curable organopolysiloxane resin composition which comprises
(A) an organopolysiloxane having two or more alkenyl groups bonded to the silicon atom,
(B) an organohydrogen polysiloxane having two or more hydrogen atoms bonded to the silicon atom,
(C) the adhesion promoter according to claim 4 , and
(D) a catalyst for hydrosilylation reaction.

6. An addition curable organopolysiloxane resin composition which comprises
(A) an organopolysiloxane having two or more alkenyl groups bonded to the silicon atom,
(B) an organohydrogen polysiloxane having two or more hydrogen atoms bonded to the silicon atom,
(C) the adhesion promoter according to claim 1 , and
(D) a catalyst for hydrosilylation reaction.

7. A semiconductor apparatus encapsulated by the addition curable organopolysiloxane resin composition according to claim 6 .

8. A semiconductor apparatus encapsulated by an addition curable organopolysiloxane resin composition which comprises
(A) an organopolysiloxane having two or more alkenyl groups bonded to the silicon atom,
(B) an organohydrogen polysiloxane having two or more hydrogen atoms bonded to the silicon atom,
(C) an adhesion promoter for promoting adhesiveness of a cured product of the addition curable organopolysiloxane resin composition, and
(D) a catalyst for hydrosilylation reaction,
wherein the adhesion promoter comprises at least one alkoxy group bonded to a silicon atom, and at least one cyano group-containing organic group bonded to a silicon atom in one molecule.

9. The semiconductor apparatus according to claim 8 , wherein the adhesion promoter is a material represented by the following average formula (1),
R 1 a SiO (4-a)/2   (1)

wherein, R 1 represents a hydrogen atom, or a group selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an epoxy group-containing organic group having 3 to 10 carbon atoms, and a cyano group-containing organic group having 1 to 10 carbon atoms other than a cyano group; the material has at least one alkoxy group and at least one cyano group-containing organic group in the molecule; and “a” represents a number satisfying 1.0≤a<4.0.

10. The semiconductor apparatus according to claim 8 , wherein the adhesion promoter is a material represented by the following formula (2),
R 2 SiX b R 3 3-b   (2)

wherein, R 2 represents a cyano group-containing organic group having 1 to 10 carbon atoms which is other than the cyano group, X represents an alkoxy group having 1 to 10 carbon atoms, R 3 represents a hydrocarbon group having 1 to 8 carbon atoms, and “b” represents an integer of 1 to 3.

11. The semiconductor apparatus according to claim 10 , wherein the adhesion promoter represented by the formula (2) is 2-cyanoethyltrialkoxysilane.

Assignees

• Shinetsu Chemical Co

Inventors

• Mizunashi Tomoyuki
• Iguchi Hiroyuki

Classifications

• C08K5/5475 Primary

  containing at least one C≡N bond · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

• C08L83/04

  Polysiloxanes · CPC title

• C08L2201/14

  Gas barrier composition · CPC title

• C08L2201/08

  Stabilised against heat, light or radiation or oxydation · CPC title