Methods for passivating sidewalls of semiconductor wafers and semiconductor devices incorporating semiconductor wafers
US-11948803-B2 · Apr 2, 2024 · US
US10038305B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10038305-B2 |
| Application number | US-201715460828-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 16, 2017 |
| Priority date | Mar 22, 2016 |
| Publication date | Jul 31, 2018 |
| Grant date | Jul 31, 2018 |
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A light emitting component includes plural transfer elements, plural setting thyristors, and plural light emitting elements. The transfer elements are configured to be sequentially brought into an ON state. The setting thyristors are connected to the transfer elements, respectively. The setting thyristors are configured to be brought into a state where the setting thyristors are capable of changing to the ON state when the transfer elements are brought into the ON state. The light emitting elements are stacked on the setting thyristors through tunnel junctions, respectively. The light emitting elements are configured to emit light of increase a light emission amount when the setting thyristors are brought into the ON state.
Opening claim text (preview).
What is claimed is: 1. A light emitting component comprising: a plurality of transfer elements configured to be sequentially brought into an ON state; a plurality of setting thyristors connected to the plurality of transfer elements, respectively, and configured to be brought into a state where the setting thyristors are capable of changing to the ON state when the transfer elements are brought into the ON state; and a plurality of light emitting elements stacked on the plurality of setting thyristors through tunnel junctions, respectively, and configured to emit light or increase a light emission amount when the setting thyristors are brought into the ON state. 2. The light emitting component according to claim 1 , wherein a plurality of semiconductor layers that constitute each setting thyristor and a plurality of semiconductor layers that constitute the corresponding light emitting element are stacked through a semiconductor layer that constitutes the corresponding tunnel junction. 3. The light emitting component according to claim 2 , wherein the tunnel junction is configured to be set to reverse bias when the light emitting element is set to forward bias. 4. The light emitting component according to claim 3 , wherein any semiconductor layer among the plurality of semiconductor layers that constitutes each setting thyristor, the plurality of semiconductor layers that constitutes the corresponding light emitting element, and the semiconductor layer that constitutes the tunnel junction confines a current path in the light emitting element. 5. The light emitting component according to claim 4 , wherein the semiconductor layer that constitutes the corresponding tunnel junction confines the current path in each light emitting element. 6. The light emitting component according to claim 2 , wherein any semiconductor layer among the plurality of semiconductor layers that constitutes each setting thyristor, the plurality of semiconductor layers that constitutes the corresponding light emitting element, and the semiconductor layer that constitutes the tunnel junction confines a current path in the light emitting element. 7. The light emitting component according to claim 6 , wherein the semiconductor layer that constitutes the corresponding tunnel junction confines the current path in each light emitting element. 8. The light emitting component according to claim 1 , wherein the tunnel junction is configured to be set to reverse bias when the light emitting element is set to forward bias. 9. The light emitting component according to claim 8 , wherein any semiconductor layer among a plurality of semiconductor layers that constitutes each setting thyristor, a plurality of semiconductor layers that constitutes the corresponding light emitting element, and a semiconductor layer that constitutes the tunnel junction confines a current path in the light emitting element. 10. The light emitting component according to claim 9 , wherein the semiconductor layer that constitutes the corresponding tunnel junction confines the current path in each light emitting element. 11. The light emitting component according to claim 1 , wherein any semiconductor layer among a plurality of semiconductor layers that constitutes each setting thyristor, a plurality of semiconductor layers that constitutes the corresponding light emitting element, and a semiconductor layer that constitutes the tunnel junction confines a current path in the light emitting element. 12. The light emitting component according to claim 11 , wherein the semiconductor layer that constitutes the corresponding tunnel junction confines the current path in each light emitting element. 13. The light emitting component according to claim 1 , wherein a part or an entirety of at least one semiconductor layer among a plurality of semiconductor layers that constitute each setting thyristor and a plurality of semiconductor layers that constitute the corresponding light emitting element is a distributed Bragg reflector layer. 14. The light emitting component according to claim 1 , wherein each tunnel junction is configured with a plurality of semiconductor layers, and a wavelength that corresponds to a band gap of at least one semiconductor layer among the plurality of semiconductor layers of each tunnel junction is longer than a wavelength of light emitted from the corresponding light emitting element. 15. The light emitting component according to claim 1 , wherein each tunnel junction is located at a node of a standing wave generated by light emission from the corresponding light emitting element. 16. A print head comprising: a light emitting unit including a plurality of transfer elements configured to be sequentially brought into an ON state, a plurality of setting thyristors connected to the plurality of transfer elements, respectively, and configured to be brought into a state where the setting thyristors are capable of changing to the ON state when the transfer elements are brought into the ON state, and a plurality tight emitting elements stacked on the plurality of setting thyristors through tunnel junctions, respectively, and configured to emit light or increase a light emission amount when the setting thyristors are brought into the ON state; and an optical unit configured to form an image by using light emitted from the light emitting unit. 17. An image forming apparatus comprising: an image carrier; a charging unit configured to charge the image carrier; an exposing unit including a plurality of transfer elements configured to be sequentially brought into an ON state, a plurality of setting thyristors connected to the plurality of transfer elements, respectively, and configured to be brought into a state where the setting thyristors are capable of changing to the ON state when the transfer elements are brought into the ON state, and a plurality of light emitting elements stacked on the plurality of setting thyristors through tunnel junctions, respectively, and configured to emit light or increase a light emission amount when the setting thyristors are brought into the ON state, the exposing unit configured to expose the image carrier through an optical unit; a developing unit configured to develop an electrostatic latent image formed on the image carrier exposed by the exposing unit; and a transfer unit configured to transfer the image developed on the image carrier to a transfer target member.
comprising special burying or current confinement layers · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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