Method for cutting display panel

Patent metadata

Field	Value
Publication number	US-10038170-B2
Application number	US-201615159153-A
Country	US
Kind code	B2
Filing date	May 19, 2016
Priority date	Sep 23, 2015
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components. The method includes: forming multiple display modules by cutting the substrate and the cover plate of the display panel at a position between adjacent display components; and edging a display module obtained through the cutting with an edging machine by a distance from an edge of the display module to inward of the encapsulation glue, until the encapsulation glue is grinded to a preset width. A design of slim bezel can be achieved for the display panel with high accuracy by the method for cutting the display panel according to the disclosure.

First claim

What is claimed is:

1. A method for cutting a display panel, the display panel comprising a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components, the method comprising:
forming multiple display modules by cutting the substrate and the cover plate of the display panel at positions between any two adjacent ones of the multiple display components, each one of the multiple display modules corresponding to one of the multiple display components; and
edging, using an edging machine, a display module selected from the multiple display modules from an edge of the display module toward encapsulation glue surrounding a corresponding display component, until the encapsulation glue is grinded to a preset width.

2. The method as claimed in claim 1 , wherein the edging machine comprises a grinding tool, and the step of edging the display module comprises:
enabling the grinding tool to contact against the edge of the display module; and
moving at least one of the grinding tool and the display module, such that the edge of the display module contacting against the grinding tool is grinded by the grinding tool.

3. The method as claimed in claim 2 , wherein the step of moving the at least one of the grinding tool and the display module comprises:
moving the display module along a direction opposite to a grinding direction; and
moving the grinding tool along a direction perpendicular to the grinding direction.

4. The method as claimed in claim 2 , wherein the step of moving the at least one of the grinding tool and the display module comprises:
moving the grinding tool along a grinding direction; and
moving the display module along a direction perpendicular to the grinding direction.

5. The method as claimed in claim 2 , wherein the display module is in shape of a circle, the step of moving the at least one of the grinding tool and the display module comprises:
rotating the display module around a center of the circle; and
moving the grinding tool to approach the display module along a grinding direction.

6. The method as claimed in claim 2 , wherein a grinding precision of the grinding tool is configured as 20 μm.

7. The method as claimed in claim 2 , wherein the grinding tool is a grinding wheel or a cutter having a certain roughness, a shape of the cutter being selected based on a sectional profile of the display module.

8. The method as claimed in claim 1 , wherein the step of edging the display module further comprises:
cooling a grinding position with coolant.

9. The method as claimed in claim 8 , wherein the step of cooling a grinding position with coolant comprises:
spraying the coolant onto the grinding position via a nozzle.

10. The method as claimed in claim 1 , wherein an interval space is provided between encapsulation glue surrounding any two adjacent ones of the multiple display components, and the step of cutting the substrate and the cover plate of the display panel comprises:
cutting the substrate and the cover plate of the display panel with a cutter at the interval space.

11. The method as claimed in claim 10 , wherein the cutter is selected from a group comprising a toothed cutter, a toothless cutter and a cutter wheel.

12. The method as claimed in claim 1 , wherein the encapsulation glue is made from material comprising frit.

13. The method as claimed in claim 1 , wherein the preset width ranges from 200 μm to 600 μm.

14. The method as claimed in claim 1 , wherein the substrate and/or the cover plate is made of glass.

15. The method as claimed in claim 1 , further comprising:
providing a low temperature poly silicon LTPS layer at least between the substrate and the encapsulation glue.

Assignees

• Everdisplay Optronics Shanghai Ltd

Inventors

• Wen Chih-Wei
• Liu Denghui

Classifications

• B24B9/10 Primary

  of plate glass · CPC title

• B28D7/02

  for removing or laying dust, e.g. by spraying liquids; for cooling work · CPC title

• B28D5/022

  by cutting with discs or wheels · CPC title

• B24B55/02

  Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D) · CPC title

• H01L51/56 Primary

  Electricity · mapped topic