OLED panel, manufacturing method thereof and display device

Patent metadata

Field	Value
Publication number	US-9691824-B2
Application number	US-201514906469-A
Country	US
Kind code	B2
Filing date	Apr 14, 2015
Priority date	Jan 28, 2015
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

The present invention provides an OLED panel, a manufacturing method thereof and a display device. The OLED panel includes a substrate, an OLED light emitting unit that is provided on the substrate and a cover plate that is provided above the OLED light emitting unit, wherein a frit is provided in an area between the cover plate and the substrate corresponding to and surrounding a periphery of the light emitting unit, the frit being used for bonding the cover plate and the substrate together so as to hermetically package the OLED light emitting unit, and a supplementary packaging structure is further provided in an area between the cover plate and the substrate corresponding to a periphery of the frit, the supplementary packaging structure being used for assisting the frit to package the OLED light emitting unit and support the cover plate and the substrate.

First claim

What is claimed is:

1. An OLED panel, which includes a substrate, an OLED light emitting unit that is provided on the substrate and a cover plate that is provided above the OLED light emitting unit, wherein
a frit is provided in an area between the cover plate and the substrate corresponding to and surrounding a periphery of the light emitting unit, the frit being used for bonding the cover plate and the substrate together so as to hermetically package the OLED light emitting unit,
a supplementary packaging structure is further provided in an area between the cover plate and the substrate corresponding to a periphery of the frit, the supplementary packaging structure being used for assisting the frit to package the OLED light emitting unit and support the cover plate and the substrate, and
wherein the supplementary packaging structure includes a recess provided on a surface of the cover plate facing the OLED light emitting unit, a side of the recess away from the OLED light emitting unit being open, and the supplementary packaging structure further includes an UV adhesive, the UV adhesive being provided in an area between a bottom of the recess and a part of a surface of the substrate corresponding to the recess, and the UV adhesive being bonded with the bottom of the recess and the substrate, respectively.

2. The OLED panel according to claim 1 , wherein a depth of the recess is smaller than a thickness of the cover plate.

3. The OLED panel according to claim 1 , wherein a width of the recess in a direction away from the OLED light emitting unit is equal to or less than a distance between a side of the frit away from the OLED light emitting unit and an edge of the cover plate corresponding to the side.

4. The OLED panel according to claim 1 , wherein the UV adhesive surrounds the whole periphery of the frit and is bonded with the frit.

5. The OLED panel according to claim 1 , wherein the UV adhesive is provided at peripheries of two opposite sides of the frit and is bonded with the frit.

6. The OLED panel according to claim 1 , wherein the UV adhesive is provided at outside of each center of four sides of the frit respectively and is bonded with the frit.

7. A display device, which includes an OLED panel including a substrate, an OLED light emitting unit that is provided on the substrate and a cover plate that is provided above the OLED light emitting unit, wherein
a frit is provided in an area between the cover plate and the substrate corresponding to and surrounding a periphery of the light emitting unit, the frit being used for bonding the cover plate and the substrate together so as to hermetically package the OLED light emitting unit,
a supplementary packaging structure is further provided in an area between the cover plate and the substrate corresponding to a periphery of the frit, the supplementary packaging structure being used for assisting the frit to package the OLED light emitting unit and support the cover plate and the substrate, and
wherein the supplementary packaging structure includes a recess provided on a surface of the cover plate facing the OLED light emitting unit, a side of the recess away from the OLED light emitting unit being open, and the supplementary packaging structure further includes an UV adhesive, the UV adhesive being provided in an area between a bottom of the recess and a part of a surface of the substrate corresponding to the recess, and the UV adhesive being bonded with the bottom of the recess and the substrate, respectively.

8. The display device according to claim 7 , wherein a depth of the recess is smaller than a thickness of the cover plate.

9. The display device according to claim 7 , wherein a width of the recess in a direction away from the OLED light emitting unit is equal to or less than a distance between a side of the frit away from the OLED light emitting unit and an edge of the cover plate corresponding to the side.

10. The display device according to claim 7 , wherein the UV adhesive surrounds the whole periphery of the frit and is bonded with the frit.

11. The display device according to claim 7 , wherein the UV adhesive is provided at peripheries of two opposite sides of the frit and is bonded with the frit.

12. The display device according to claim 4 , wherein the UV adhesive is provided at outside of each center of four sides of the frit respectively and is bonded with the frit.

13. A manufacturing method of an OLED panel, which includes:
forming an OLED light emitting unit on a substrate;
forming a frit on a cover plate;
making a surface of the substrate with the OLED light emitting unit formed thereon and a surface of the cover plate with the frit formed thereon face to each other, and assembling the substrate with the cover plate, such that the frit is provided in an area corresponding to and surrounding a periphery of the OLED light emitting unit; and
sintering the frit, wherein
the method further includes packaging a periphery of the frit between the cover plate and the substrate by a supplementary packaging structure, wherein
the supplementary packaging structure includes a recess and an UV adhesive, a side of the recess away from the OLED light emitting unit being open, and
the packaging a periphery of the frit between the cover plate and the substrate by a supplementary packaging structure includes;
before forming the frit on the substrate, forming the recess on a surface of the cover plate facing the OLED light emitting unit;
after sintering the frit, injecting the UV adhesive into a gap between the recess and the substrate at the periphery of the frit; and
curing the UV adhesive.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Gao Xinwei

Classifications

• H01L51/52

  Electricity · mapped topic

• H01L27/32 Primary

  Electricity · mapped topic

• H01L51/5246

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic

• H10K59/871

  Self-supporting sealing arrangements · CPC title