Encapsulating method of oled substrate and oled structure

Patent metadata

Field	Value
Publication number	US-2016248037-A1
Application number	US-201414378394-A
Country	US
Kind code	A1
Filing date	Jul 2, 2014
Priority date	May 30, 2014
Publication date	Aug 25, 2016
Grant date	—

Abstract

The present invention relates to an encapsulating method of OLED substrate and an OLED structure. The encapsulating method includes steps of: step 1: providing an OLED substrate ( 1 ) and an encapsulation cover plate ( 3 ), a top surface of the OLED substrate ( 1 ) having a metal cathode ( 135 ); step 2: performing a surface treatment onto the metal cathode ( 135 ) by ion bombardment to thereby form a metal oxide layer ( 5 ) on a surface of the metal cathode ( 135 ); step 3: coating an encapsulation glue ( 7 ) and disposing a filler ( 9 ) on the encapsulation cover plate ( 3 ); step 4: oppositely disposing and bonding the encapsulation cover plate ( 3 ) and the OLED substrate ( 1 ); and step 5: curing the encapsulation glue ( 7 ) by UV light illumination and thereby realizing the encapsulation of the OLED substrate ( 1 ) by use of the encapsulation cover plate ( 3 ).

First claim

What is claimed is:

1 . An encapsulating method of OLED substrate, comprising steps of:
step 1: providing an OLED substrate and an encapsulation cover plate, wherein a top surface of the OLED substrate has a metal cathode; step 2: performing a surface treatment onto the metal cathode by ion bombardment to thereby form a metal oxide layer on a surface of the metal cathode; step 3: coating an encapsulation glue and disposing a filler on the encapsulation cover plate; step 4: oppositely bonding the encapsulation cover plate with the OLED substrate; and step 5: curing the encapsulation glue by UV light illumination and thereby achieving the encapsulation of the OLED substrate by use of the encapsulation cover plate.

2 . The encapsulating method as claimed in claim 1 , wherein the encapsulation glue is an UV glue.

3 . The encapsulating method as claimed in claim 1 , wherein a thickness of the metal oxide layer is in the range of 1 nm to 30 nm.

4 . The encapsulating method as claimed in claim 1 , wherein the encapsulation cover plate is a glass plate.

5 . The encapsulating method as claimed in claim 1 , wherein the ion bombardment is performed in a vacuum environment, or a waterless nitrogen environment with a small amount of oxygen.

6 . The encapsulating method as claimed in claim 5 , wherein the ion bombardment is performed in a ppm environmental closed chamber, a content of water is less than 10 ppm and a content of oxygen is in the range of 100 ppm to 20,000 ppm

7 . The encapsulating method as claimed in claim 1 , wherein the steps 2, 3, 4 and 5 all are performed in ppm environments.

8 . An OLED structure comprising:
an OLED substrate; an encapsulation cover plate sealingly connected onto the OLED substrate; and a filler disposed between the OLED substrate and the encapsulation cover plate; wherein a top surface of the OLED substrate has a metal cathode, and a surface of the metal cathode is formed with a metal oxide layer.

9 . The OLED structure as claimed in claim 8 , wherein the metal oxide layer is formed on the surface of the metal cathode by ion bombardment.

10 . The OLED structure as claimed in claim 8 , wherein the metal oxide layer has a thickness in the range of 1 nm to 30 nm, and the filler contains a transparent desiccant.

11 . An OLED structure comprising:
an OLED substrate; an encapsulation cover plate sealingly bonded with the OLED substrate; and a filler disposed between the OLED substrate and the encapsulation cover plate; wherein a top surface of the OLED substrate has a metal cathode and a surface of the metal cathode has a metal oxide layer; wherein the metal oxide layer is formed on the surface of the metal cathode by ion bombardment; wherein the metal oxide layer has a thickness in the range of 1 nm to 30 nm, and the filler contains a transparent desiccant.

Assignees

• Shenzhen China Star Optoelect

Inventors

• Liu Yawei
• Wu Taipi
• Wang Yifan

Classifications

• H10K59/874

  including getter material or desiccant · CPC title

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K59/8052

  Cathodes · CPC title

• H01L51/524 Primary

  Electricity · mapped topic

• H01L51/5259

  Electricity · mapped topic