Physical quantity sensor
US-9851233-B2 · Dec 26, 2017 · US
Sensor including a printed circuit board with semiconductor parts having a first and second resin
US10031006B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10031006-B2 |
| Application number | US-201515316981-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 15, 2015 |
| Priority date | Jul 30, 2014 |
| Publication date | Jul 24, 2018 |
| Grant date | Jul 24, 2018 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
In a module in which a circuit board is integrally insert molded with a housing while semiconductor parts mounted on the circuit board are exposed, deformation of the circuit board caused by pressure on the circuit board by a mold for blocking the molding resin is reduced. In the module in which the circuit board is integrally insert molded with the housing while the semiconductor parts mounted on the circuit board are exposed, the deformation of the circuit board is reduced by placing a material, which has an elastic modulus smaller than the elastic modulus of the printed circuit board, in the projection area of the mold holding portion on the circuit board.
First claim
Opening claim text (preview).
The invention claimed is: 1. A sensor comprising: a printed circuit board; a first member that is bonded to the printed circuit board and orthogonal to the printed circuit board, wherein the first member is formed from a first resin; one or more second members formed adjacent to the first member on the printed circuit board, wherein the one or more second members are formed from a second resin; and an upper cover that is parallel to the printed circuit board and attached to the first member; a lower cover that is parallel to the printed circuit and attached to the first member; a circuit chamber formed from the first member, the upper cover, and the lower cover; and semiconductor parts mounted on the printed circuit board, wherein at least one of the semiconductor parts is located within the circuit chamber; wherein the second resin has an elastic modulus smaller than an elastic modulus of the printed circuit board. 2. The sensor according to claim 1 , wherein the semiconductor parts include a semiconductor for flow sensing. 3. The sensor according to claim 1 , wherein the second resin is of a same material that is placed on conductor wiring formed on the printed circuit board. 4. The sensor according to claim 1 , wherein the sensor is formed by insert molding.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Encapsulations, e.g. protective coatings · CPC title
changes in structures or sizes · CPC title
being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title
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Frequently asked questions
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- What does patent US10031006B2 cover?
- In a module in which a circuit board is integrally insert molded with a housing while semiconductor parts mounted on the circuit board are exposed, deformation of the circuit board caused by pressure on the circuit board by a mold for blocking the molding resin is reduced. In the module in which the circuit board is integrally insert molded with the housing while the semiconductor parts mounted…
- Who is the assignee on this patent?
- Hitachi Automotive Systems Ltd
- What technology area does this patent fall under?
- Primary CPC classification G01F1/38. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jul 24 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).