Flow meter
US-12140459-B2 · Nov 12, 2024 · US
Flow sensor, method for manufacturing flow sensor and flow sensor module
US8969977B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8969977-B2 |
| Application number | US-96493510-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 10, 2010 |
| Priority date | Dec 11, 2009 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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- Title
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Abstract
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The invention provides a flow sensor structure for sealing the surface of an electric control circuit and a part of a semiconductor device via a manufacturing method capable of preventing occurrence of flash or chip crack when clamping the semiconductor device via a mold. The invention provides a flow sensor structure comprising a semiconductor device having an air flow sensing unit and a diaphragm formed thereto, and a board or a lead frame having an electric control circuit for controlling the semiconductor device disposed thereto, wherein a surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The invention further provides flow sensor structure in which surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed, or a manufacturing method for absorbing the dimensional variation of the semiconductor device by the deformation of springs or deformation of an elastic film in the thickness direction.
First claim
Opening claim text (preview).
What is claimed is: 1. A flow sensor comprising: a semiconductor device having an air flow sensing unit and a diaphragm formed thereto; a pre-mold component having a surface on which the semiconductor device is disposed and at least three walls disposed in a direction orthogonal to the side on which the semiconductor device is disposed; and a lead frame having an electric control circuit for controlling the semiconductor device disposed thereto; wherein a part of a surface o…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8969977B2 cover?
- The invention provides a flow sensor structure for sealing the surface of an electric control circuit and a part of a semiconductor device via a manufacturing method capable of preventing occurrence of flash or chip crack when clamping the semiconductor device via a mold. The invention provides a flow sensor structure comprising a semiconductor device having an air flow sensing unit and a diaph…
- Who is the assignee on this patent?
- Kono Tsutomu, Okamoto Yuuki, Morino Takeshi, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification G01F1/684. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).