Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-10030141-B2
Application number	US-201314435574-A
Country	US
Kind code	B2
Filing date	Oct 18, 2013
Priority date	Oct 19, 2012
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).

First claim

The invention claimed is:

1. A resin composition, comprising at least
an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a hemiester group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the hemiester group of the linear polysiloxane (a),
a cyanic acid ester compound (B) and/or a phenol resin (C), and
an inorganic filler (D).

2. The resin composition according to claim 1 , further comprising a halogen-free epoxy resin (E).

3. The resin composition according to claim 1 , further comprising a maleimide compound (F).

4. The resin composition according to claim 1 , comprising a cyanic acid ester compound (B) that comprises one or more selected from the group consisting of naphtholaralkyl-based cyanic acid ester compounds represented by formula (6):

wherein R 6 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more;
and novolac-based cyanic acid ester compounds represented by formula (7):

wherein R 7 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more.

5. The resin composition according to claim 1 , comprising a phenol resin (C) that comprises one or more selected from the group consisting of naphtholaralkyl-based phenol resins represented by formula (8):

wherein R 8 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more;
and biphenylaralkyl-based phenol resins represented by formula (9):

wherein R 9 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more.

6. The resin composition according to claim 3 , wherein the maleimide compound (F) comprises a maleimide compound represented by formula (16):

wherein R 15 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more.

7. The resin composition according to claim 3 , wherein a content of the epoxy silicone resin (A) is 5 to 50 parts by mass based on 100 parts by mass of a total content of the epoxy silicone resin (A), the cyanic acid ester compound (B), the phenol resin (C), the halogen-free epoxy resin (E), and the maleimide compound (F).

8. The resin composition according to claim 3 , wherein a total content of the cyanic acid ester compound (B) and the phenol resin (C) is 10 to 50 parts by mass based on 100 parts by mass of the total content of the epoxy silicone resin (A), the cyanic acid ester compound (B), the phenol resin (C), the halogen-free epoxy resin (E), and the maleimide compound (F).

9. The resin composition according to claim 3 , wherein a content of the inorganic filler (D) is 50 to 400 parts by mass based on 100 parts by mass of the total content of the epoxy silicone resin (A), the cyanic acid ester compound (B), the phenol resin (C), the halogen-free epoxy resin (E), and the maleimide compound (F).

10. The resin composition according to claim 3 , wherein a content of the maleimide compound (F) is 3 to 50 parts by mass based on 100 parts by mass of the total content of the epoxy silicone resin (A), the cyanic acid ester compound (B), the phenol resin (C), the halogen-free epoxy resin (E), and the maleimide compound (F).

11. The resin composition according to claim 1 , further comprising an imidazole compound (H),
wherein the imidazole compound (H) comprises an imidazole compound represented by formula (17):

wherein Ar each independently represents a phenyl group, a naphthalene group, a biphenyl group, an anthracene group, or a hydroxyl group-modified group thereof, and R 16 represents a hydrogen atom, an alkyl group, a hydroxyl group-modified group of an alkyl group, or an aryl group.

12. The resin composition according to claim 11 , wherein the imidazole compound (H) comprises 2,4,5-triphenylimidazole.

13. The resin composition according to claim 1 , wherein the inorganic filler (D) comprises one or more selected from the group consisting of boehmite and silicas.

14. The resin composition according to claim 2 , wherein the halogen-free epoxy resin (E) is one or more selected from the group consisting of phenol phenyl aralkyl novolac-based epoxy resins, phenol biphenylaralkyl-based epoxy resins, naphtholaralkyl-based epoxy resins, anthraquinone-based epoxy resins, and polyoxynaphthylene-based epoxy resins.

15. A prepreg, comprising a base material, and the resin composition according to claim 1 impregnated into or applied to the base material.

16. The prepreg according to claim 15 , wherein the base material is one or more selected from the group consisting of an E-glass cloth, a T-glass cloth, an S-glass cloth, a Q-glass cloth, and organic fibers.

17. A laminate, comprising one or more layers comprising the prepreg according to claim 15 .

18. A metal foil clad laminate, comprising the prepreg according to claim 15 , and a metallic foil laminated on the prepreg.

19. A printed circuit board, comprising an insulating layer, and a conductive layer disposed on a surface of the insulating layer,
wherein the insulating layer comprises the resin composition according to claim 1 .

20. The resin composition according to claim 1 , wherein the cyclic epoxy resin (b) comprises an alicyclic compound having an epoxy group, or an isocyanuric ring.

21. The resin composition according to claim 1 , comprising a cyanic acid ester compound (B) that comprises one or more selected from the group consisting of naphtholaralkyl-based cyanic acid ester compounds represented by formula (6):

wherein R 6 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more;
novolac-based cyanic acid ester compounds represented by formula (7):

wherein R 7 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more;
a phenol resin (C) that comprises one or more selected from the group consisting of naphtholaralkyl-based phenol resins represented by formula (8):

wherein R 8 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more;
and biphenylaralkyl-based phenol resins represented by formula (9):

wherein R 9 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 o

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Chiba Tomo
• Takahashi Hiroshi
• Shiga Eisuke
• Ogashiwa Takaaki

Classifications

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08K3/36

  Silica · CPC title

• C08G59/621

  Phenols · CPC title

• C08J2373/00

  Characterised by the use of macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C08J2359/00 - C08J2371/00; Derivatives of such polymers · CPC title

• C08G59/24

  carbocyclic · CPC title