Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board
US-10030141-B2 · Jul 24, 2018 · US
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Patent family 50488366
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 50488366 |
| Family type | — |
| Earliest priority | Oct 19, 2012 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10030141B2 — Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board |
Representative publication
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US10030141B2 — Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board (published Jul 24, 2018)
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