Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10026596-B2
Application number	US-201414462657-A
Country	US
Kind code	B2
Filing date	Aug 19, 2014
Priority date	Mar 30, 2009
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A substrate processing apparatus includes: a cylindrical shaped chamber configured to accommodate a substrate; a movable electrode capable of moving along a central axis of the cylindrical shaped chamber within the cylindrical shaped chamber; a facing electrode facing the movable electrode within the cylindrical shaped chamber; and an expansible/contractible partition wall connecting the movable electrode with an end wall on one side of the cylindrical shaped chamber. A high frequency power is applied to a first space between the movable electrode and the facing electrode, a processing gas is introduced thereto, and the movable electrode is not in contact with a sidewall of the cylindrical shaped chamber, a first dielectric member is provided at the cylindrical shaped chamber's sidewall facing the movable electrode, and an overlap area between the first dielectric member and a side surface of the movable electrode is changed according to movement of the movable electrode.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a cylindrical shaped chamber having a circular pipe-shaped sidewall and a circular plate-shaped cover that covers an upper end of the circular pipe-shaped sidewall and configured to accommodate a substrate;
a movable electrode having a top surface facing the circular plate-shaped cover and a bottom surface facing a facing electrode and a side surface facing the circular pipe-shaped sidewall and capable of moving along a central axis of the cylindrical shaped chamber within the cylindrical shaped chamber;
the facing electrode facing the movable electrode within the cylindrical shaped chamber; and
an expansible/contractible partition wall connecting the movable electrode with the circular plate-shaped cover,
wherein a high frequency power is applied to a first space between the movable electrode and the facing electrode, a processing gas is introduced thereto, and the movable electrode is not in contact with the circular pipe-shaped sidewall, and
a first dielectric member is provided at only a part of the circular pipe-shaped sidewall facing the movable electrode, and an overlap area between the first dielectric member and the side surface of the movable electrode is changed according to movement of the movable electrode,
further wherein a second dielectric member is provided at the movable electrode's side surface facing the first dielectric member and an overlap area between the first dielectric member and the second dielectric member is changed according to movement of the movable electrode,
in a cross section of the first dielectric member along a central axis of the cylindrical shaped chamber, a width in a direction orthogonal to the central axis is gradually changed along the central axis, and
in a cross section of the second dielectric member along the central axis of the cylindrical shaped chamber, a width in a direction orthogonal to the central axis is gradually changed along the central axis.

2. The substrate processing apparatus of claim 1 , wherein each of the first dielectric member and the second dielectric member is made of quartz, ceramic or an insulating resin.

3. The substrate processing apparatus of claim 1 , wherein a recess is formed in the circular pipe-shaped sidewall, and the first dielectric member is inserted into the recess.

Assignees

• Tokyo Electron Ltd

Inventors

• Hayashi Daisuke

Classifications

• H10P72/0421

  for drying etching · CPC title

• H01J2237/1502

  Mechanical adjustments · CPC title

• H01J2237/024

  Moving components not otherwise provided for · CPC title

• H01J37/32018

  Glow discharge · CPC title

• H01J37/32458

  Vessel · CPC title