Photosensitization chemical-amplification type resist material, method for forming pattern using same, semiconductor device, mask for lithography, and template for nanoimprinting

US10025187B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10025187-B2
Application numberUS-201515117686-A
CountryUS
Kind codeB2
Filing dateFeb 17, 2015
Priority dateFeb 21, 2014
Publication dateJul 17, 2018
Grant dateJul 17, 2018

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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A photosensitization chemical-amplification type resist material according to the present invention is used for a two-stage exposure lithography process, and contains (1) a developable base component and (2) a component generating a photosensitizer and an acid through exposure. Among three components consisting of (a) an acid-photosensitizer generator, (b) a photosensitizer precursor, and (c) a photoacid generator, the above component contains only the component (a), any two components, or all of the components (a) to (c).

First claim

Opening claim text (preview).

The invention claimed is: 1. A photosensitization chemical-amplification type resist material used as a photosensitive resin composition in a lithography process including a pattern-exposure step of irradiating a predetermined site of a resist material film formed using the photosensitive resin composition with ionizing radiation or non-ionizing radiation having a wavelength of equal to or less than 400 nm, a flood-exposure step of irradiating the resist material film having undergone the pattern-exposure step with non-ionizing radiation having a wavelength which is longer than the wavelength of the non-ionizing radiation used in the pattern-exposure and is greater than 200 nm, a baking step of heating the resist material film having undergone the flood-exposure step, and a developing step of forming a resist pattern by bringing the resist material film having undergone the baking step into contact with a developer, the photosensitization chemical-amplification type resist material comprising: (1) a base component which makes a portion subjected to the pattern-exposure soluble or insoluble in the developer after the baking step; and (2) a component generating a photosensitizer and an acid through exposure; and (3) a photodecomposition-type scavenger as a first scavenger capturing an acid and a cation, wherein the component (2) is the following component (a), contains any two components among the following components (a) to (c), or contains all of the following components (a) to (c), (a) an acid-photosensitizer generator generating an acid and a photosensitizer, which absorbs non-ionizing radiation having a wavelength of greater than 200 nm, by being irradiated with ionizing radiation or non-ionizing radiation having a wavelength of equal to or less than 400 nm, (b) a photosensitizer precursor becoming a photosensitizer, which absorbs non-ionizing radiation having a wavelength of greater than 200 nm, by being irradiated with ionizing radiation or non-ionizing radiation having a wavelength of equal to or less than 400 nm, and (c) a photoacid generator generating an acid by being irradiated with ionizing radiation or non-ionizing radiation having a wavelength of equal to or less than 400 nm, wherein the component (b) includes a ketal compound or an acetal compound represented by the following Formula (XXXVI), wherein, in the Formula (XXXVI), each of R 9 and R 10 independently represents a hydrogen atom; a phenyl group; a naphthyl group; an anthracenyl group; an alkoxy group having 1 to 5 carbon atoms; an alkylthio group having 1 to 5 carbon atoms; a phenoxy group; a naphthoxy group; an anthracenoxy group; an amino group; an amide group; a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms; an alkoxy group having 1 to 5 carbon atoms substituted with a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an amino group, an amide group, or a hydroxyl group; an alkylthio group having 1 to 5 carbon atoms substituted with a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an amino group, an amide group, or a hydroxyl group; a phenoxy group substituted with an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group, an amino group, an amide group, or an alkyl group having 1 to 5 carbon atoms; a phenyl group substituted with a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an amino group, an amide group, or a hydroxyl group; a naphthoxy group substituted with an alkoxy group having 1 to 5 carbon atoms, an alkyl group having 1 to 5 carbon atoms, an amino group, an amide group, or a hydroxyl group; an anthracenoxy group substituted with an alkoxy group having 1 to 5 carbon atoms, an alkyl group having 1 to 5 carbon atoms, an amino group, an amide group, or a hydroxyl group; a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms substituted with an alkoxy group having 1 to 5 carbon atoms, a phenoxy group, a naphthoxy group, an anthracenoxy group, an amino group, an amide group, or a hydroxyl group; or a carbonyl group to which an alkyl group having 1 to 12 carbon atoms is bonded, in the Formula (XXXVI), each of R 23 and R 24 independently represents a phenyl group; a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms; or a phenyl group substituted with a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a hydroxyl group, in the Formula (XXXVI), R 9 and R 10 or R 23 and R 24 may form a cyclic structure through a single bond, a double bond, or a bond containing —CH 2 —, —O—, —S—, —SO 2 —, —SO 2 NH—, —C(═O)—, —C(═O)O—, —NHCO—, —NHC(═O)NH—, —CHR g —, —CR g 2 —, —NH—, or —NR g —; and R g represents a phenyl group; a phenoxy group; a halogen atom; a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms; a phenoxy group substituted with an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group, or an alkyl group having 1 to 5 carbon atoms; or a phenyl group substituted with a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a hydroxyl group. 2. The resist material according to claim 1 , wherein the photosensitizer generated from the component (2) through exposure contains a carbonyl compound. 3. The resist material according to claim 2 , wherein the carbonyl compound is at least one compound selected from the group consisting of benzophenone derivatives, xanthone derivatives, thioxanthone derivatives, coumarin derivatives, and acridone derivatives. 4. The resist material according to claim 2 , wherein the carbonyl compound is an acridone derivative. 5. The resist material according to claim 2 , wherein the carbonyl compound is a naphthalene derivative or an anthracene derivative. 6. The resist material according to claim 1 , wherein the component (a) contains at least one compound selected from the group consisting of sulfonium salt compounds represented by the following Formulae (I) to (III), wherein, in the Formulae (I) to (III), each of R 1 , R 2 , R 1′ , R 2′ , R 1″ , and R 2″ independently represents a hydrogen atom; a phenyl group; a naphthyl group; an anthracenyl group; a phenoxy group; a naphthoxy group; an anthracenoxy group; an amino group; an amide group; a halogen atom; a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms; a phenoxy group substituted with an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group, an amino group, an amide group, or an alkyl group having 1 to 5 carbon atoms; a phenyl group substituted with a linear, branched or cyclic and saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an amino group, an amide group, or a hydroxyl group; a naphthoxy group substituted with an alkoxy group having 1 to 5 carbon atoms, an alkyl group having 1 to 5 carbon atoms, an amino group, an amide group, or a hydroxyl group; an anthracenoxy group substituted with an alkoxy group having 1 to 5 carbon atoms, an alkyl group having 1 to 5 carbon atoms, an amino gr

Assignees

Inventors

Classifications

  • Photolithographic processes · CPC title

  • Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength · CPC title

  • Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift · CPC title

  • Treatment before imagewise removal, e.g. prebaking {(G03F7/265 takes precedence)} · CPC title

  • Liquid compositions therefor, e.g. developers · CPC title

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What does patent US10025187B2 cover?
A photosensitization chemical-amplification type resist material according to the present invention is used for a two-stage exposure lithography process, and contains (1) a developable base component and (2) a component generating a photosensitizer and an acid through exposure. Among three components consisting of (a) an acid-photosensitizer generator, (b) a photosensitizer precursor, and (c) a…
Who is the assignee on this patent?
Tokyo Electron Ltd, Univ Osaka
What technology area does this patent fall under?
Primary CPC classification G03F7/0397. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 17 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).