Method for preparing hot-melt adhesive composition and hot-melt adhesive composition prepared thereby

US10023769B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10023769-B2
Application numberUS-201615007036-A
CountryUS
Kind codeB2
Filing dateJan 26, 2016
Priority dateJun 19, 2015
Publication dateJul 17, 2018
Grant dateJul 17, 2018

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed is a method for preparing a hot-melt adhesive composition and a hot-melt adhesive composition prepared thereby. The method comprises: preparing and mixing raw materials, including a butyl rubber, an ethylene propylene diene (EPDM) rubber, a styrene block copolymer, an amorphous poly-alpha-olefin (APAO) and a tackifier resin; and performing vacuum degassing of the mixed raw materials, wherein the styrene block copolymer comprises a styrene-isoprene-styrene (SIS) rubber. The hot-melt adhesive composition has high resistance in temperature cycles between low and high temperatures so as to maintain its physical properties, and thus has an excellent property of sealing a headlamp for a long period of time until the end of the lifespan of the headlamp. Also, the composition generates no gas in the sealed state of the headlamp, and thus does not create bubbles or voids and does not pose a water tightness problem.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for preparing a hot-melt adhesive composition, the method comprising; mixing raw materials comprising a butyl rubber, an ethylene propylene diene (EPDM) rubber, a styrene block copolymer, an amorphous poly-alpha-olefin (APAO) and a tackifier resin; and performing vacuum degassing of the mixed raw materials, wherein the styrene block copolymer comprises a styrene-isoprene-styrene (SIS) rubber, wherein the vacuum degassing is performed using a vacuum pump at a temperature between about 150° C. and about 210° C. at a vacuum level of about 70-150 mmHg for about 3-10 hours. 2. The method of claim 1 , wherein the tackifier resin is one or more selected from the group consisting of aliphatic petroleum resin, rosin ester and terpene resin. 3. The method of claim 2 , wherein the tackifier resin comprises about 35-65 wt % of the aliphatic petroleum resin, about 15-35 wt % of the rosin ester, and about 15-35 wt % of the terpene resin. 4. The method of claim 1 , wherein the raw materials further include a plasticizer containing polyisobutylerte, a phenol-based antioxidant, and a UV stabilizer. 5. The method of claim 1 , wherein the raw materials comprise: about 1.4.5-14.7 wt % of the butyl rubber; about 14.5-14.7 wt % of the ethylene propylene diene (EPDM) rubber; about 9.6-9.8 wt % of the styrene block copolymer; about 7.7-7.9 wt % of the amorphous poly-alpha-olefin (APAO); about 19.4-19.7 wt % of aliphatic petroleum resin; about 9.6-9.9 wt % of rosin ester; about 9.6-9.9 wt % of terpene resin; about 9.6-9.9 wt % of a plasticizer containing polyisobutylene; about 2-4 wt % of maleic anhydride polypropylene; about 0.5-1 wt % of a phenol-based antioxidant; and about 0.1-0.5 wt % of a UV stabilizer.

Assignees

Inventors

Classifications

  • Crosslinking · CPC title

  • containing four or more polymers in a blend · CPC title

  • Macromolecular additives · CPC title

  • Ethylene-propylene or ethylene-propylene-diene copolymers · CPC title

  • of vinyl-aromatic monomers and conjugated dienes · CPC title

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What does patent US10023769B2 cover?
Disclosed is a method for preparing a hot-melt adhesive composition and a hot-melt adhesive composition prepared thereby. The method comprises: preparing and mixing raw materials, including a butyl rubber, an ethylene propylene diene (EPDM) rubber, a styrene block copolymer, an amorphous poly-alpha-olefin (APAO) and a tackifier resin; and performing vacuum degassing of the mixed raw materials, …
Who is the assignee on this patent?
Hyundai Mobis Co Ltd, Okong Corp
What technology area does this patent fall under?
Primary CPC classification C09J123/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 17 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).